CN1279580C - 衬底处理装置和衬底处理方法 - Google Patents

衬底处理装置和衬底处理方法 Download PDF

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Publication number
CN1279580C
CN1279580C CNB031064868A CN03106486A CN1279580C CN 1279580 C CN1279580 C CN 1279580C CN B031064868 A CNB031064868 A CN B031064868A CN 03106486 A CN03106486 A CN 03106486A CN 1279580 C CN1279580 C CN 1279580C
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CN
China
Prior art keywords
mentioned
film
substrate
hydrophobization
removal device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB031064868A
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English (en)
Chinese (zh)
Other versions
CN1434481A (zh
Inventor
牛岛满
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
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Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1434481A publication Critical patent/CN1434481A/zh
Application granted granted Critical
Publication of CN1279580C publication Critical patent/CN1279580C/zh
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Spray Control Apparatus (AREA)
  • Coating Apparatus (AREA)
CNB031064868A 2002-01-22 2003-01-22 衬底处理装置和衬底处理方法 Expired - Fee Related CN1279580C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP13236/02 2002-01-22
JP13236/2002 2002-01-22
JP2002013236A JP3959612B2 (ja) 2002-01-22 2002-01-22 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
CN1434481A CN1434481A (zh) 2003-08-06
CN1279580C true CN1279580C (zh) 2006-10-11

Family

ID=27650242

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB031064868A Expired - Fee Related CN1279580C (zh) 2002-01-22 2003-01-22 衬底处理装置和衬底处理方法

Country Status (4)

Country Link
JP (1) JP3959612B2 (ko)
KR (1) KR100917728B1 (ko)
CN (1) CN1279580C (ko)
TW (1) TWI254193B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4481698B2 (ja) 2004-03-29 2010-06-16 キヤノン株式会社 加工装置
JP4994074B2 (ja) * 2006-04-20 2012-08-08 東京エレクトロン株式会社 基板洗浄装置，基板洗浄方法，基板処理装置
JP4983565B2 (ja) * 2006-12-20 2012-07-25 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
CN101230466B (zh) * 2007-01-24 2010-09-01 沈阳工业大学 一种脱胶液
JP6418932B2 (ja) * 2014-12-15 2018-11-07 東京応化工業株式会社 紫外線照射装置、紫外線照射方法、基板処理装置、及び基板処理装置の製造方法
KR102156895B1 (ko) * 2018-11-06 2020-09-17 세메스 주식회사 기판 처리 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100264006B1 (ko) 1993-11-29 2000-08-16 이형도 고온초전도 조셉슨소자의 제조방법
TW394980B (en) * 1998-02-05 2000-06-21 Samsung Electronics Co Ltd Semiconductor device fabrication system and method of forming semiconductor device pattern using the same
JP3752420B2 (ja) 1999-11-11 2006-03-08 東京エレクトロン株式会社 薄膜除去装置
JP2001297962A (ja) 2000-04-12 2001-10-26 Toppan Printing Co Ltd 基板外周部の残渣除去装置

Also Published As

Publication number Publication date
JP3959612B2 (ja) 2007-08-15
KR100917728B1 (ko) 2009-09-15
TWI254193B (en) 2006-05-01
JP2003218007A (ja) 2003-07-31
TW200302404A (en) 2003-08-01
KR20030063219A (ko) 2003-07-28
CN1434481A (zh) 2003-08-06

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20061011

Termination date: 20100222