TWI237537B - Method for manufacturing a laminated plate and laminated plate dislocation preventing device - Google Patents

Method for manufacturing a laminated plate and laminated plate dislocation preventing device Download PDF

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Publication number
TWI237537B
TWI237537B TW092126439A TW92126439A TWI237537B TW I237537 B TWI237537 B TW I237537B TW 092126439 A TW092126439 A TW 092126439A TW 92126439 A TW92126439 A TW 92126439A TW I237537 B TWI237537 B TW I237537B
Authority
TW
Taiwan
Prior art keywords
deviation
plate
partition
laminated
partition plates
Prior art date
Application number
TW092126439A
Other languages
English (en)
Chinese (zh)
Other versions
TW200407063A (en
Inventor
Yoshihisa Sugawa
Tadashi Mori
Sueo Yoshida
Shoichi Sekine
Hajime Watanabe
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of TW200407063A publication Critical patent/TW200407063A/zh
Application granted granted Critical
Publication of TWI237537B publication Critical patent/TWI237537B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/20—Making multilayered or multicoloured articles
    • B29C43/203—Making multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/262—Partition plates or sheets for separating several laminates pressed simultaneously
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW092126439A 2002-09-25 2003-09-25 Method for manufacturing a laminated plate and laminated plate dislocation preventing device TWI237537B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002280011A JP3896938B2 (ja) 2002-09-25 2002-09-25 積層板の製造方法

Publications (2)

Publication Number Publication Date
TW200407063A TW200407063A (en) 2004-05-01
TWI237537B true TWI237537B (en) 2005-08-01

Family

ID=32040474

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092126439A TWI237537B (en) 2002-09-25 2003-09-25 Method for manufacturing a laminated plate and laminated plate dislocation preventing device

Country Status (6)

Country Link
JP (1) JP3896938B2 (ja)
CN (1) CN100417509C (ja)
AU (1) AU2003266586A1 (ja)
HK (1) HK1080424B (ja)
TW (1) TWI237537B (ja)
WO (1) WO2004028775A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI386276B (zh) * 2008-02-22 2013-02-21 Mitsubishi Heavy Ind Ltd 層積接合裝置用治具

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5583570B2 (ja) * 2010-12-20 2014-09-03 株式会社日立製作所 ホットプレス装置および多層プリント基板のプレス方法
CN102248747A (zh) * 2011-05-27 2011-11-23 开平太平洋绝缘材料有限公司 一种框形定位装置
CN103913471B (zh) * 2012-12-31 2016-04-13 深南电路有限公司 一种检验埋容板上埋容层对位的方法
CN108472708B (zh) * 2016-01-27 2020-08-11 株式会社三井高科技 层叠构件的加工方法
CN107995771A (zh) * 2017-11-09 2018-05-04 奥士康科技股份有限公司 一种高多层混合二阶hdi印刷电路板对位系统及方法
JP7317167B1 (ja) * 2022-03-28 2023-07-28 株式会社日本製鋼所 積層成形装置および積層成形システム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59185600A (ja) * 1983-04-08 1984-10-22 Hitachi Ltd 多段形ホツトプレス
JPH0263577U (ja) * 1988-10-31 1990-05-11
JPH04157751A (ja) * 1990-10-19 1992-05-29 Nec Corp ウェハー搬送装置
JPH05121875A (ja) * 1991-10-24 1993-05-18 Risho Kogyo Co Ltd 多層プリント配線板用基板の製造方法
JPH05343847A (ja) * 1992-06-05 1993-12-24 Hitachi Ltd 多層印刷配線板の製造方法
JPH07186167A (ja) * 1993-12-28 1995-07-25 Ibiden Co Ltd 積層基板形成用プレス装置のダミー板
JPH1128733A (ja) * 1997-07-10 1999-02-02 Shin Kobe Electric Mach Co Ltd 積層板製造用キャリアプレート
JP3712941B2 (ja) * 2001-01-05 2005-11-02 株式会社名機製作所 積層プレス装置
JP4599745B2 (ja) * 2001-04-04 2010-12-15 パナソニック電工株式会社 金属張り積層板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI386276B (zh) * 2008-02-22 2013-02-21 Mitsubishi Heavy Ind Ltd 層積接合裝置用治具

Also Published As

Publication number Publication date
AU2003266586A1 (en) 2004-04-19
JP2004114465A (ja) 2004-04-15
WO2004028775A1 (ja) 2004-04-08
HK1080424B (zh) 2009-06-05
CN1681632A (zh) 2005-10-12
CN100417509C (zh) 2008-09-10
TW200407063A (en) 2004-05-01
JP3896938B2 (ja) 2007-03-22
HK1080424A1 (en) 2006-04-28

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