HK1080424A1 - Method for producing laminated board and misregistration-preventing system for laminated board production - Google Patents

Method for producing laminated board and misregistration-preventing system for laminated board production

Info

Publication number
HK1080424A1
HK1080424A1 HK06100302.7A HK06100302A HK1080424A1 HK 1080424 A1 HK1080424 A1 HK 1080424A1 HK 06100302 A HK06100302 A HK 06100302A HK 1080424 A1 HK1080424 A1 HK 1080424A1
Authority
HK
Hong Kong
Prior art keywords
laminated board
misregistration
preventing system
producing
board production
Prior art date
Application number
HK06100302.7A
Other versions
HK1080424B (en
Inventor
Yoshihisa Sugawa
Tadashi Mori
Sueo Yoshida
Shoichi Sekine
Hajime Watanabe
Takuya Suzuki
Original Assignee
Panasonic Elec Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Elec Works Co Ltd filed Critical Panasonic Elec Works Co Ltd
Publication of HK1080424A1 publication Critical patent/HK1080424A1/en
Publication of HK1080424B publication Critical patent/HK1080424B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/20—Making multilayered or multicoloured articles
    • B29C43/203—Making multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/262—Partition plates or sheets for separating several laminates pressed simultaneously
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
HK06100302.7A 2002-09-25 2006-01-06 Method for producing laminated board and misregistration-preventing system for laminated board production HK1080424B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002280011A JP3896938B2 (en) 2002-09-25 2002-09-25 Laminate production method
PCT/JP2003/012174 WO2004028775A1 (en) 2002-09-25 2003-09-24 Method for producing laminated board and misregistration-preventing system for laminated board production

Publications (2)

Publication Number Publication Date
HK1080424A1 true HK1080424A1 (en) 2006-04-28
HK1080424B HK1080424B (en) 2009-06-05

Family

ID=32040474

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06100302.7A HK1080424B (en) 2002-09-25 2006-01-06 Method for producing laminated board and misregistration-preventing system for laminated board production

Country Status (6)

Country Link
JP (1) JP3896938B2 (en)
CN (1) CN100417509C (en)
AU (1) AU2003266586A1 (en)
HK (1) HK1080424B (en)
TW (1) TWI237537B (en)
WO (1) WO2004028775A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4209456B1 (en) * 2008-02-22 2009-01-14 三菱重工業株式会社 Lamination bonding equipment jig
JP5583570B2 (en) * 2010-12-20 2014-09-03 株式会社日立製作所 Hot press apparatus and multilayer printed circuit board pressing method
CN102248747A (en) * 2011-05-27 2011-11-23 开平太平洋绝缘材料有限公司 Frame shape positioning device
CN103913471B (en) * 2012-12-31 2016-04-13 深南电路有限公司 The method held and plate buries and holds layer contraposition is buried in a kind of inspection
EP3409396A4 (en) * 2016-01-27 2019-09-18 Mitsui High-Tec, Inc. Method for processing laminated member
CN107995771A (en) * 2017-11-09 2018-05-04 奥士康科技股份有限公司 A kind of high multilayer mixing second order HDI printed circuit board (PCB)s alignment system and method
JP7317167B1 (en) * 2022-03-28 2023-07-28 株式会社日本製鋼所 Laminate molding equipment and laminate molding system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59185600A (en) * 1983-04-08 1984-10-22 Hitachi Ltd Multistage type hot press
JPH0263577U (en) * 1988-10-31 1990-05-11
JPH04157751A (en) * 1990-10-19 1992-05-29 Nec Corp Wafer transport device
JPH05121875A (en) * 1991-10-24 1993-05-18 Risho Kogyo Co Ltd Manufacture of multilayer printed wiring board
JPH05343847A (en) * 1992-06-05 1993-12-24 Hitachi Ltd Manufacture of multilayer printed wiring board
JPH07186167A (en) * 1993-12-28 1995-07-25 Ibiden Co Ltd Dummy plate of press apparatus for forming laminated base sheet
JPH1128733A (en) * 1997-07-10 1999-02-02 Shin Kobe Electric Mach Co Ltd Carrier plate for manufacturing laminate
JP3712941B2 (en) * 2001-01-05 2005-11-02 株式会社名機製作所 Laminating press
JP4599745B2 (en) * 2001-04-04 2010-12-15 パナソニック電工株式会社 Method for producing metal-clad laminate

Also Published As

Publication number Publication date
JP3896938B2 (en) 2007-03-22
HK1080424B (en) 2009-06-05
CN100417509C (en) 2008-09-10
TW200407063A (en) 2004-05-01
JP2004114465A (en) 2004-04-15
WO2004028775A1 (en) 2004-04-08
AU2003266586A1 (en) 2004-04-19
TWI237537B (en) 2005-08-01
CN1681632A (en) 2005-10-12

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20230923