TW200407063A - Method for manufacturing a laminated plate and laminated plate dislocation preventing device - Google Patents
Method for manufacturing a laminated plate and laminated plate dislocation preventing device Download PDFInfo
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- TW200407063A TW200407063A TW092126439A TW92126439A TW200407063A TW 200407063 A TW200407063 A TW 200407063A TW 092126439 A TW092126439 A TW 092126439A TW 92126439 A TW92126439 A TW 92126439A TW 200407063 A TW200407063 A TW 200407063A
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- plate
- deviation
- aforementioned
- partition
- partition plate
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000011888 foil Substances 0.000 claims abstract description 10
- 238000005192 partition Methods 0.000 claims description 114
- 230000002265 prevention Effects 0.000 claims description 41
- 210000000078 claw Anatomy 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims 1
- 239000011229 interlayer Substances 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 26
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000005206 Hibiscus Nutrition 0.000 description 1
- 235000007185 Hibiscus lunariifolius Nutrition 0.000 description 1
- 241001075721 Hibiscus trionum Species 0.000 description 1
- 241000282887 Suidae Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 210000003195 fascia Anatomy 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000009417 prefabrication Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/20—Making multilayered or multicoloured articles
- B29C43/203—Making multilayered articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
- B32B2037/262—Partition plates or sheets for separating several laminates pressed simultaneously
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
200407063 五、發明說明(1) [發明所屬之技術領域] 本發明是有關於一種,且特別是有關於一 [先前技術] 習知,積層板是利用金屬荡或是内層 的積層板製造用薄片材料及預浸積声成 亦即,在金屬板(鏡面板)及與之相鄰的金屬板之胃二 地積層排列薄片材料及預浸材。接著,把此積“: 至一對熱板之間,朝其厚度方向加熱加壓,藉此, ς 浸材把^㈣彼此接著。在此—方法中,加熱加魔= t 預次材的樹脂會熔融流動’冑可能因此流動造成薄片 材料的位置偏差,而造成積層板之成形不良。^玖屢片 在:,已有提案嘗試防止像這樣的位置偏I,以減 成=不良,例如日本專利早期公開之6_334342號案, 用,層基板製造的金屬&,其具有偏差止押部: 此金屬板疋如第12圖所示,具有金屬製的矩形平板1〇〇, =及從矩形平板1〇〇周圍垂下的多個偏差止押部ιι〇,且 積層體120的上面及其對面的熱板(未圖示) 而使”止押部110配置成接觸或是靠近積層體12〇的 ::面目猎此,在加熱加壓的時候,肖成積層體之薄 以押部的金屬&,便可防止因預浸材的樹脂 Μ動所造成的大位置偏移。 曰 Η對於積層板的厚度增加,或是由厚度較薄的薄 =^枓構成積層體的場合等,即使使用 偏200407063 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a kind, and in particular to a [prior art] It is known that a laminated board is a sheet for manufacturing a laminated board using a metal plate or an inner layer. The material and the prepreg are formed by laminating the sheet material and the prepreg on the stomach of the metal plate (mirror panel) and the adjacent metal plate. Next, the product ": between a pair of hot plates, heated and pressurized in the thickness direction, thereby dipped the material to attach ^ ㈣ to each other. In this method, the heating and magic = t Resin will melt and flow. This may cause the positional deviation of the sheet material and cause poor forming of the laminate. ^ 玖 Repeatedly in: There have been proposals to try to prevent such positional deviation I, so as to reduce = bad, for example Japanese Patent Laid-Open No. 6_334342, a metal & manufactured with a layer substrate, has a deviation retaining portion: As shown in FIG. 12, this metal plate has a rectangular plate 100 made of metal, and from The rectangular flat plate 100 has a plurality of deflection stoppers tiling around it, and the upper surface of the laminated body 120 and a hot plate (not shown) opposite to the laminated plate 120 make the “stopper portion 110 contact or be close to the laminated body 12 〇 :: This is true. When heated and pressurized, Xiao Cheng's laminated body is thin and pressed with metal &, which can prevent large position shifts caused by the resin M of the prepreg. For example, if the thickness of the laminated board is increased, or when the laminated body is formed by a thinner thickness, such as ^ 枓, etc.
差防止部⑴的金屬韻。,仍不^以減少成形不良UPoorly prevent the metal rhyme of the part. , Still not ^ to reduce poor forming U
12323pif.ptd 第6頁 五、發明說明(2) 薄片材料是像金屬〜 刷配線板等當作=樣非常薄的材料 觸到偏差止押部;片:;'的:合相比較易破損 [發明内容] 盃屬泊會起皺。 一接 在此,本明發就a 的目的就是提供〜種匕問題點而提出。本發明 皴及;損等1而可減薄的金屬落也能防止起 本發明的積屑也制、 的兩片金屬製的‘隔二=^娃其特徵在於包括··在相鄰 少一片金屬笮式向昆 4父替配置至少一片預浸材與至 由分隔板、預i材::配線板那樣的薄片材料,形成 mtr:兩片分隔板;利用-對熱板,對積層體^ 厚度方向加熱,並把浸預材接著至薄板材料上。的 依照本發明,配置在熱板間的分隔板的片數,薄片 料的片數,預浸材的片數即使增加了,也利用偏差防止構 件把^隔板彼此連結,藉此,可限制分隔板的水平移動, 結果是可防止積層板的成形偏差(層間偏移)。 又,在本發明中,把上述積層體形成於載板,並把連 結分隔板的偏差防止構件固定至載板之後,較佳的是,把 具有積層體的載板設在熱板之間,並對之施行加熱加壓。 在此場合,配置於熱板之間的分隔板的片數、薄板材料的 片數、預浸材的片數多的場合非常有效。且可把積層體容 易且有效的在熱板間搬送、設定,且因為偏差防止構件是12323pif.ptd Page 6 V. Description of the invention (2) The sheet material is like metal ~ brush wiring board, etc. It is regarded as a very thin material that touches the deviation holding section; sheet:; ': The combined phase is more vulnerable to damage [ Summary of the invention] Cups will wrinkle. Following this, Ben Mingfa put forward that the purpose of a is to provide ~ dagger problems. The present invention affects the metal falling which can be reduced and can also prevent the accumulation of chips of the present invention. The two pieces of metal are also separated by two. The feature is that: The metal cymbals are equipped with at least one piece of prepreg material and a partition plate, pre-i material :: a thin sheet material such as a wiring board, to form mtr: two partition plates; use-for hot plates, for laminates The body is heated in the thickness direction, and the impregnated material is adhered to the sheet material. According to the present invention, even if the number of partition plates, the number of sheets, and the number of prepregs arranged between the hot plates are increased, the deviation preventing members are used to connect the partitions to each other, thereby making it possible to The horizontal movement of the partition plate is restricted. As a result, it is possible to prevent the forming deviation (interlayer offset) of the laminated plate. Furthermore, in the present invention, after the laminated body is formed on a carrier plate, and the deviation preventing member connecting the partition plates is fixed to the carrier plate, it is preferable that the carrier plate with the laminated body is provided between the hot plates. And apply heat and pressure to it. In this case, it is very effective when the number of the partition plates, the number of sheet materials, and the number of prepregs arranged between the hot plates are large. And the laminated body can be easily and efficiently transported and set between the hot plates, and because the deviation prevention member is
12323pif.ptd 第7頁 200407063 五、發明說明(3) 固定至載板上, 移動。 又’本發明 材料的片數及預 造方法的特徵在 接合部的第1分r 替排列著至少一 體,及未具有前 配置而形成多層 分隔板;透過多/ 分隔板的接合部 連結,並將前述 一對熱板,透過 熱加壓,並把預 本發明的又 裝置,特別適用 亦即,本發 偏差防止構件及 金屬製的平板及 防止構件接合至 分隔板彼此之間 的積層體,在利 所以可更確實地限制加熱時分隔板的水平 楗供的積層板製造方法,對於成形的薄板 浸材的片數多的場合具特別的效果。此製 於包括:將具有可與偏差防止構件接合之 *板配置到載板上;在第1分隔板上,把交 片預浸材及至少一片的薄片材料的積層 述接合部的第2分隔板,以一定次數交替 排列體;在多層排列體的上面配 &排列體把偏差防止構件接合至相鄰的第i 偏防止構件把第1分隔板彼此 ίΓΛ广 端固定至載板上;利用 Ί刀;&二反、對多層排列體的厚度方向加 =材接者至夕層排列體中的薄片材料。 :目的’是提供-種積層板製造偏差防止 於上述的製造方法。 梅H方止 :的偏ϋ防止裝置,其特徵在於是由 反所構成,且各分隔板具有 前述接合裝置,以利用偏# 使偏差 。配置於分隔板之間件連結 用熱板的手法枝預久材與薄片材料 200407063 五、發明說明(4) 例獲得理解。 為讓本發明之上 顯易懂,下文特舉—J和f他㈣、特徵、和優點能更明 細說明如下: Λ佳實施例,並配合所附圖式,作詳 [實施方式] 實施例的積層板製造::的同日守’砰述依照本發明之較佳 吃乃法。 在本實施例Φ , 間,層狀地配置著像= 圖所示,在-對熱板1之 金屬'泊或内層用印刷配線板那樣的多個薄=、3)、像 ;浸材。即’w圖中標號6所示的枓;^多個 一接德 > 片數的預浸材交替配置而得的積《鲈. 茲仏如 领層體6和多個分隔板(2、3)交替配署 曰守一對的熱板1之間得到一個多層排列體。_ /又預材’一直以來皆可應用於金屬箔張 =的製造,舉例而…使用如聚I纖維 的纖ί,或是在由玻璃纖維所織成的織布或不織布 、土材fέ浸環氧樹脂、聚亞醯胺樹脂及酚樹脂等的熱 硬化性樹脂,而成為半硬化狀態者。例如,預浸材的厚^ 為〇H〇· 3mm,樹脂含有量為3〇〜8〇%。 又 ^ 薄片材料,一直以來皆可應用於金屬箱層 的積層板的製"例而言,是銅猪等的金屬J積或是J 面及内部具有回路圖案的内外層用印刷配綠板 例如可 把5〜200微米厚的金屬箔,或是〇. ^丨.6_厚的内外層用印12323pif.ptd Page 7 200407063 V. Description of the invention (3) Fix to the carrier board and move. The features of the material of the present invention and the prefabrication method are at least integrally arranged at the first point r of the joint portion, and the multilayer partition plate is formed without a front configuration; and it is connected by the joint portion of the multi / divided partition plate. And the aforementioned pair of hot plates are pressurized by heat, and the device of the present invention is particularly applicable, that is, the deviation preventing member and the metal flat plate and the preventing member are joined to the partition plate. The laminated body is a method for manufacturing a laminated plate that can more surely limit the horizontal supply of the partition plate during heating, and is particularly effective in the case where the number of sheets of the formed thin plate immersion material is large. The manufacturing method includes: disposing an * plate having a joint capable of being joined with a deviation preventing member on a carrier plate; and placing a cross section prepreg and at least one sheet material on the first partition plate as a second part of the joint portion. Dividing partitions, alternately arranging the bodies a certain number of times; arranging & arranging bodies on top of the multilayered arranging body to join the deviation preventing member to the adjacent i-th deviation preventing member and fix the first partition plates to each other On the top, use a trowel to reverse the thickness direction of the multilayer array body, and add the sheet material to the layer array body. : Objective'is to provide a method for preventing the manufacturing variation of the laminated board from the above-mentioned manufacturing method. Mei H Fang Zhi: The skew prevention device is characterized in that it is constituted by a reverse, and each partition plate is provided with the aforementioned joint device to make deviations by the skew #. The pieces arranged between the partition plates are connected by the method of hot plate to pre-preserve the material and the sheet material. 200407063 V. Description of the invention (4) The example is understood. In order to make the present invention more understandable, the following enumeration—J and fam, features, and advantages can be described in more detail as follows: Λ The best embodiment, in conjunction with the attached drawings, make detailed [embodiment] Examples Laminated board manufacturing: The same day Shou 'slams the best eating method according to the present invention. In this embodiment, a plurality of thin layers, such as those shown in the figure, are shown in the figure, as shown in FIG. 3, as shown in FIG. 3, as shown in FIG. 3, as shown in FIG. That is, the product indicated by the reference numeral 6 in the figure "w; ^ multiple one-to-one" is a product obtained by alternately arranging the number of pieces of prepreg. "Large body 6 and a plurality of partition plates (2 3) Alternately arrange a pair of hot plates 1 to obtain a multilayer array body. _ / Youcai 'can always be applied to the manufacture of metal foil sheets, for example, using fibers such as poly I fibers, or woven or non-woven fabrics made of glass fibers, and soil materials. Thermosetting resins such as epoxy resins, polyimide resins, and phenol resins are semi-hardened. For example, the thickness of the prepreg is OH · 0.3mm, and the resin content is 30 ~ 80%. Also ^ sheet materials can be applied to the manufacture of laminated boards of metal boxes. For example, it is the metal J product of copper pigs, etc., or the green surface for the inner and outer layers with a circuit pattern on the J surface and inside. For example, 5 ~ 200 micron thick metal foil, or 0. ^ 丨. 6_ thick inner and outer layers can be printed with
第9頁Page 9
ZUU^U/UOJ 五、發明說明(5) 刷配線板當作薄片材料使用。 在本實施中,利用後述的偏差 的㈣隔板2與比第!分隔板Λ差二止:且件以^ =夂那樣的具高熱傳導性的金屬製 小而適宜^$。 κ寸了視欲製造的積層板的大 及在Γ平分:Λ2古ί如第2Α圖所示,由長方形的平板20, = H 側略中央部分突出的-對突出片 乂隔板2的大小,舉例而言,平板2。的 可把突出片21形成為10_随。 # ί < Μ P1上设有接合孔22。接合孔22,舉例而言,可形 圓形、矩形。在本實施例中,雖然僅把突 出片21設成在矩形平板2〇對向的兩邊,但是,也可再多設 於對向的另兩邊^。只5 ^ 1 \ — 運 、要疋 第1分隔板2的矩形平板的4個 邊上分別設有具接合孔2 2的突出片2丨便可。 第2分隔板3,是如第2B圖所示,除了未設突出片。之 外,其餘皆與第1分隔板2為實質相同。換言之,第2分隔 板3具有與第1分隔板2略等的尺寸。 一其次’如第1 B所示’在多層排列體7中的多數個第1分 隔板2的接合孔22中插入偏差防止構件4,以使第i分隔板2 彼此連結。在此狀態下,如第丨c圖所示,用一對熱板,把 多層排列體7往厚度方向加熱加熱,以預浸材把各積層體6 的薄片材料彼此接著。ZUU ^ U / UOJ V. Description of the Invention (5) The brush wiring board is used as a sheet material. In this embodiment, the ㈣ diaphragm 2 which uses the deviation described later is two times worse than the! Partition plate: and the pieces are made of a metal having high thermal conductivity such as ^ = 夂, which is suitable. κ inch shows the size of the laminated board that is to be manufactured, and it is equally divided in Γ: As shown in Figure 2A, the rectangular flat plate 20, which protrudes from the slightly central part of the H-side, is the size of the protruding plate 乂 partition 2. , For example, tablet 2. The protruding piece 21 can be formed as 10 mm. # ί < Μ P1 is provided with a joint hole 22. The engaging hole 22 may be circular or rectangular, for example. In this embodiment, although the protruding piece 21 is provided only on the two opposite sides of the rectangular flat plate 20, it may be provided on the other two opposite sides ^. Only 5 ^ 1 \ — It is necessary to provide protruding pieces 2 with engaging holes 2 2 on the four sides of the rectangular flat plate of the first partition plate 2 respectively. The second partition plate 3 is as shown in FIG. 2B, except that no protruding piece is provided. Other than that, it is substantially the same as the first partition plate 2. In other words, the second partition plate 3 has a size approximately equal to that of the first partition plate 2. Secondly, as shown in FIG. 1B, the deviation preventing members 4 are inserted into the joint holes 22 of the plurality of first sub-partitions 2 in the multilayer array body 7, so that the i-th partition plates 2 are connected to each other. In this state, as shown in FIG. 丨 c, the multilayer array body 7 is heated and heated in the thickness direction by a pair of hot plates, and the sheet materials of the laminated bodies 6 are adhered to each other with a prepreg.
12323pif.ptd 第10頁 200407063 五、發明說明(6) 以下將對本發明的積層板製造方法作更具體的說明。 首先’以至少一片預浸材及炱少一片薄片材料相互交替配 置而形成積層體6。只要積層體6在薄片材料之間存在了預 次材便可。舉例而言,在製造兩面金屬箔張力積層板的場 合’如第3A圖所示,可在至少一片的預浸材6〇的上下兩面 上’配置作為薄片材料7 〇的金屬箔71,以得積層體6。 又’在製造具内層回路圖案的兩面多層積層板的場合,如 苐3 B圖所示’在内層用印刷配線板7 2的上下兩面上,各至 少配置一片預浸材60,在預浸材60的更外側上,配置外層 用金屬箔71,藉此可得積層體6。更,在製造具内層回路 圖案之多層積層板的場合,如第3 C圖所示,在内層用印刷 配線板7 2的上下面,各配置至少一片預浸材6〇之後,在預 浸材60的更外側上,配置外層用印刷配線板73,藉此,可 得積層體6。尚,第3B圖及第3C圖的内層用印刷配9線板 72 ’在其上下面具有内層用回路圖案75。且,第扣圖外層 用印刷配線板73,在一面具有内層用回路圖案η,在另面 具有外層用金屬箔71。 其次,在載板(carrier plate)5上交替重疊上述 體6及分隔板(2、3),以形成多層排列體7。使用載曰 話,可搭載由積層體6及分隔板(2、3)構成的多層排俨 7,使之原封不動地在一對熱板之間搬送。又,與分『 彼此連接的偏差防止構件4,因為可由載板5保持定板2 著,所以在搬送中可防止位置偏差的產生。更,因 貫限制偏差防止構件4的位置偏移,因而可進一牛制、、可確 v I造層12323pif.ptd Page 10 200407063 V. Description of the invention (6) The method for manufacturing the laminated board of the present invention will be described in more detail below. First, the laminated body 6 is formed by alternately disposing at least one prepreg material and at least one thin sheet material with each other. It is sufficient that the laminated body 6 has a pre-processed material between the sheet materials. For example, when manufacturing a double-sided metal foil tension laminate, as shown in FIG. 3A, a metal foil 71, which is a sheet material 70, may be disposed on both the upper and lower sides of at least one prepreg 60 to obtain Laminated body 6. In the case where two-sided multilayer laminated boards with inner-layer circuit patterns are manufactured, as shown in Fig. 3B, at least one prepreg material 60 is arranged on each of the upper and lower surfaces of the printed wiring board 72 for the inner layer. On the outer side of 60, a metal foil 71 for an outer layer is arranged, whereby a laminated body 6 can be obtained. Furthermore, when a multilayer laminated board having an inner layer circuit pattern is manufactured, as shown in FIG. 3C, at least one prepreg 60 is arranged on each of the upper and lower surfaces of the printed wiring board 72 for the inner layer, and then the prepreg is placed on the prepreg. On the outer side of 60, a printed wiring board 73 for an outer layer is arranged, whereby the laminated body 6 can be obtained. 3B and 3C, the inner-layer printed board 9-line board 72 'has an inner-layer circuit pattern 75 on the upper and lower surfaces. In addition, the printed wiring board 73 for the outer layer of the first button has a circuit pattern η for the inner layer on one side and a metal foil 71 for the outer layer on the other side. Next, the above-mentioned bodies 6 and the partition plates (2, 3) are alternately superposed on a carrier plate 5 to form a multilayer array body 7. In use, a multi-layer row 7 composed of a laminated body 6 and a partition plate (2, 3) can be mounted and transported between a pair of hot plates without change. In addition, since the deviation preventing member 4 connected to the points "can be held by the carrier plate 5, the occurrence of positional deviation can be prevented during transportation. In addition, since the deviation is constantly restricted to prevent the position of the component 4 from being shifted, it can be further improved, and the formation can be confirmed.
2UU4U/U()3 五、發明說明(7) 間偏差少的積屛 最下面配置著^ ° ,在第1C圖中,在多層排列體7的 配置著由墊紙、/反2,在此第1分隔板2與熱板i之間 面,在多層排列體73的最\橡膠等形成的塾板8。另一方 隔板3與熱板丨=、最上面配置者第2分隔板3,在第2分 多層排列ί7 Λ配置著墊板8。 第1分隔板2與第9八^分隔板,全為第1分隔板2亦可。在 數片(3〜6片)的#刀隔板3併用的場合,例如較佳的是,每 相鄰的第1分隔弟2分隔板3配置第1分隔板2。其結果是, 複數個積層體6反之間’交替配置著複數片第2分隔板3及 合,較佳的是,。^併用第1分隔板2與第2分隔板3的場 2。作為一例示,多層排列體7的最下面,配置第1分隔板 排列體7的場合,’ f 18片積層體5及19片分隔板2製作多層 第1分隔板2,装从攸上數來第6、第1 0、第1 4、第1 9層配置 如上述那樣方配置第2分隔板3。 結多層排列體7中^成…夕層排列體7後,以偏差防止構件4連 利用棒狀的偏差之第1分隔板2彼此之間。在第1 C圖中, 的第1分隔板2之:ί構件4,將此偏差防止構件通過全部 的第1分隔板2。 口孔2 2,由偏差防止構件4連結複數片 狀(管狀)。且,^的偏差防止構件4,也可以形成中空 的形狀而争宗 ^差防止構件的斷面形狀是根據接合孔22 更,偏=構:4如的二 度還要小。在此尸人長又,較佳的是比多層排列體7的厚 板1加熱加壓多/排口,差防止構件4便不會成為一對熱 夕’排列體7的妨礙。 200407063 五、發明說明(8) 八隔L層/6的大小是與第1分隔板2之矩形平板20或是第2 同大小。因此,通過接合孔22而配置的偏ΙΓ 像金屬…便不會接觸到積層體6的周端。且,在積層體6中 的薄片材料70形成得比預浸材6°或其他的 异雜a & 的場合,可避免偏差防止構件4接觸到積 二f的端面(特別是金屬络的端面)。且,較佳的是,偏 方止構件4的下端接合固定至載板5。在加熱加壓時, 八=止構件4可限制相對於載板5的移動,因而可防止 ,隔板2的位置偏移。為了把偏差防止構件4接合固定於 反上,舉例而言,可把偏差防止構件4的下載 5上面所開設的插入口(未圖示)。 至載板 *由偏差防止部4連結第1分隔板2之後,多層排列體7 σ 在搭,於載板5的狀態下,搬送於一對熱板1之間。其次疋 ^昇溫之後的熱板往多層排列體7的厚度方向加熱加壓, 错此,由預浸材60接著薄片材料70彼此之間。如此一來, 便可獲得由絕緣層的預浸材接著的複數個薄 積層板。尚,在加熱加壓中,位於多層排列體7材之 :第1分隔板2是透過墊板8及載板5,自一邊的熱板加熱, "^層排列體7的最上面的第2分隔板3(或第1分隔板 、疋、過塾板8 ’由另邊的熱板1加熱。 力”、、加壓日守的溫度、壓力條件及成形時間,可依照薄 片材料的種類、預浸材的樹脂種類及量等而適宜地設定。 舉例而言,溫度條件為從常溫開始以5/分昇溫至丨2〇 C,並在120 °C維持20分鐘之後,以2 分昇溫至18(pc,2UU4U / U () 3 V. Description of the invention (7) The bottom of the product with small deviations is arranged ^ °. In Fig. 1C, the multilayer array 7 is provided with a pad, / inverse 2, here. On the surface between the first partition plate 2 and the hot plate i, a fascia plate 8 formed on the outermost surface of the multilayer array 73 is made of rubber or the like. On the other side, the partition plate 3 and the hot plate are arranged at the top, and the second partition plate 3 is arranged in a multi-layer arrangement at the second point, and the backing plate 8 is arranged. Both the first partition plate 2 and the 98th partition plate may be the first partition plate 2. When a plurality of (3 to 6) #knife partitions 3 are used in combination, for example, it is preferable that the first partition plate 2 is arranged every adjacent first partition plate 2 partition plate 3. As a result, the plurality of laminated bodies 6 are alternately arranged with the plurality of second partition plates 3 in combination, and more preferably. ^ Use field 2 of the first partition plate 2 and the second partition plate 3 together. As an example, when the first partition plate array body 7 is arranged at the bottom of the multilayer array body 7, 'f 18 sheets of the laminated body 5 and 19 partition plates 2 are used to make a multilayer first partition plate 2, The second, third partition plates 3 are arranged in the sixth, tenth, fourteenth, and nineteenth layers as described above. After the multi-layered array body 7 is formed, the first-layered array body 7 is connected with the first partition plates 2 that are rod-shaped deviations with the deviation prevention member 4 in series. In FIG. 1C, the first partition plate 2 of the: 1 member 4 prevents this deviation from passing through all the first partition plates 2. The apertures 22 are connected to a plurality of sheets (tubular) by a deviation preventing member 4. In addition, the deviation prevention member 4 may be formed in a hollow shape, and the cross-sectional shape of the deviation prevention member is changed according to the joint hole 22, and the deviation of the structure is smaller than the second degree. Here, it is preferable that the corpse grows and is heated / pressed more than the thick plate 1 of the multilayer array body 7, so that the difference preventing member 4 does not hinder the pair of thermal array bodies 7. 200407063 V. Description of the invention (8) The size of the eight partition L layer / 6 is the same size as the rectangular flat plate 20 of the first partition plate 2 or the second. Therefore, the partial Γ image-like metal arranged through the bonding hole 22 does not touch the peripheral end of the laminated body 6. Moreover, when the sheet material 70 in the laminated body 6 is formed at 6 ° or other foreign materials a & than the prepreg, the deviation preventing member 4 can be prevented from contacting the end face of the product 2 (especially the end face of the metal wire). ). And, it is preferable that the lower end of the deflection stop member 4 is fixed to the carrier plate 5 in an engaged manner. When heating and pressurizing, the eight-stop member 4 can restrict the movement relative to the carrier plate 5, and thus can prevent the position of the partition plate 2 from shifting. In order to fix the deviation prevention member 4 on the reverse side, for example, an insertion opening (not shown) provided above the download 5 of the deviation prevention member 4 can be used. To the carrier plate * After the first partition plate 2 is connected by the deviation preventing portion 4, the multilayer array body 7 σ is placed on the carrier plate 5 and transported between the pair of hot plates 1. Next, the heated plates are heated and pressurized in the thickness direction of the multilayer array body 7 after the temperature rise. In this case, the prepreg 60 and the sheet material 70 are between each other. In this way, a plurality of thin laminates can be obtained followed by the prepreg of the insulating layer. However, in heating and pressing, it is located in the multilayer array 7: the first partition plate 2 is heated through the hot plate on one side through the backing plate 8 and the carrier plate 5, and the topmost layer array 7 The second partition plate 3 (or the first partition plate, the rafter, and the rafter plate 8 ′ is heated by the other hot plate 1. The force, the temperature, pressure conditions, and forming time of the pressing day guard can be based on the sheet The type of the material, the type and amount of the resin of the prepreg are appropriately set. For example, the temperature condition is that the temperature is raised from 5 ° C / min to 2 ° C from normal temperature, and maintained at 120 ° C for 20 minutes, and then 2 minutes to 18 (pc,
200407063 五、發明說明(9) =°,2持30分鐘。之後,冷卻至常溫。成形時的壓 雄拄=八 言,以1MPa(約10kgf/cni2)成形開始,並 士 刀在里之後’昇壓至3MPa(約30kgf/cm2),並在此壓 3MPa持1〇分鐘。之後,一直到成形終了為止,保持 熱板ί i:Μ中a f採用i習知積層板製造所用的-對 '4 ^ J. 、 也可以視舄要,採用由油壓汽缸等使一 邊埶:i ϊ ί:另邊熱板而移動的類型,或者是,採用兩 …、 ^間間隔狹小之方向移動的類型亦可。 ip»iK· y此那樣,依照本發明,因為是由偏差防止構件4 =;=分,板相互連結,所以,即使是構成:二 往水;方向移:在::力口時流動’仍可限制第1分隔板 動所造成的π偏η:,可防止因薄片材料之水平移 不良的積層板有Ϊ三 可把無板厚、偏差等的成形 的周面皆:接ί ΐ 良率地製造出。又’因為積層體6 形。特別是,厘在加熱加壓時薄片材料不易變 形或破損等。 像金屬羯那樣薄的薄片材料起皺、變 *了實施例的積層板製造方法中,例 構件4所構成弟分隔板2與第1B圖所示的偏差防止 發T之積構層成 攸偏差防止裝置的其他例。 第4圖緣示的積層板 9 板20、在此矩形平板2〇上^偏差防止裝置,疋由矩形平 〇的長方向兩端的略中央附近設有一200407063 V. Description of the invention (9) = °, 2 hold for 30 minutes. After that, it was cooled to normal temperature. The pressure at the time of molding was 八 = 8, and the molding was started at 1 MPa (about 10 kgf / cni2), and the pressure was increased to 3 MPa (about 30 kgf / cm2), and the pressure was held at 3 MPa for 10 minutes. After that, until the end of forming, keep the hot plate ί i: Μ in the af using the conventional i-laminated laminated plate manufacturing-to '4 ^ J., you can also use a hydraulic cylinder to make one side: i ϊ ί: A type that moves on the other side of the hot plate, or a type that moves in a direction with a narrow interval between two ... ip »iK · y In this way, according to the present invention, because the deviation prevention member 4 =; = points, the plates are connected to each other, so even if it is constituted: two to the water; the direction is moved: at :: flow at the mouth It can limit the π deviation caused by the movement of the first partition plate: It can prevent the laminated plate due to the horizontal movement of the sheet material. The laminated peripheral surface can be formed without plate thickness, deviation, etc .: ί 良Prompt manufacturing. Also because the laminated body is 6-shaped. In particular, the sheet material is less likely to be deformed or damaged during heat and pressure. In the method for manufacturing a laminated board according to the embodiment, a thin sheet material such as a metal grate is wrinkled and deformed. The deviation between the partition plate 2 formed by the example member 4 and the deviation shown in FIG. 1B prevents the formation of the laminated layer T. Other examples of preventive devices. The laminated board 9 shown in the edge of FIG. 4 is a board 20, and a deviation preventing device is provided on the rectangular flat plate 20, and a rectangular flat plate is provided near the center at both ends in the long direction.
12323pif.ptd 第14頁 200407063 五、發明說明(ίο) -----------------—_____—_______________ 對接合孔22的分隔板2、棒狀的 棒狀的偏差防止構件4插通至相 防止構件4所構成。把 藉此,可使分隔板2彼此連接。的刀隔板2的接合孔22, 第5圖繪示的積層板製造偏 : 利用兩對接合孔22中的- 為了連結下方相鄰的分隔板2,利用兩對接〜 :::父此點是,第t圖之偏差防止裝置不同二也 迅、♦祕、鱼琢:即使疋要k化多層排列層7的組數,也能 =進行多層排列體的設定,達到偏差防止 - 對於縮短作業時間也很有效。 且 用在Γ方圖^會示山的積層板製造偏差防止裝置,其特徵為利 可伸縮的偏差防止構件4。在第6圖中 ===止構件40的筒狀構件,符號42是被收納在 mλ彈簧等㈣性體。若外力往偏差防止構 彈力?二作::話,偏差防止構件4會抵抗彈性體42的 4是做Λ 移動。所以,結果是,偏差防止構件 的下部J方Λ長度可變的;,例而言,在偏差防止構件4 的話,乂入筒狀構件41的狀態下,由熱板1進行加壓加熱 為傯茬維持分隔板2與偏差防止構件4相連結的同時,’、因 ::Ϊ :止構件4與多層排列體7皆可在厚度方向上收缩, 加壓工程中’不會因偏差防止構件4的誤差而造 刀Q反2或熱板的損傷。尚,像筒狀構件41那樣的偏差12323pif.ptd Page 14 200407063 V. Description of the invention (ίο) ----------------- — _____ —_______________ To the partition plate 2 of the joint hole 2, rod-shaped rod-shaped The deviation preventing member 4 is inserted into the phase preventing member 4. By this, the partition plates 2 can be connected to each other. The joint hole 22 of the knife partition 2 is shown in Figure 5. The laminated board manufacturing bias shown in Figure 5: Use two pairs of joint holes 22-To connect the adjacent partition plate 2 below, use two butts ~ ::: father this The point is that the deviation prevention device in the t figure is different. It is also fast, secret, and fishy: Even if you want to k the number of sets of the multilayer array layer 7, you can = set the multilayer array to achieve deviation prevention-for shortening Working time is also effective. Furthermore, the laminated plate used in the Γ-square diagram ^ will show the deviation prevention device, which is characterized by a retractable deviation prevention member 4. In FIG. 6, the tubular member of the === stop member 40, and the reference numeral 42 is a flexible member such as a mλ spring. If the external force is biased to prevent the elastic force? Second operation :: Then, the deviation preventing member 4 will resist the elastic body 42 and move Λ. Therefore, as a result, the length of the lower part J of the deviation preventing member is variable; for example, if the deviation preventing member 4 is inserted into the cylindrical member 41, the hot plate 1 is pressurized and heated to 偬While maintaining the connection between the partition plate 2 and the deviation preventing member 4, the ', cause :: Ϊ: both the stop member 4 and the multilayer array body 7 can be contracted in the thickness direction, and in the pressurization process,' the deviation preventing member is not prevented. The error of 4 caused by the knife Q 2 or the damage of the hot plate. Still, deviation like cylindrical member 41
12323pif.ptd 第15頁 200407063 五、發明說明(11) 防止構件用的保持裝置,趟伟沾曰 了衣夏敉隹的是,固定在載板5上。把 偏差防止構件4插入筒狀槿株41免# $ Μ^ 件内,藉此,可避免偏差防 夕成u Τ 了防止因載板5在搬送中造成 多層排列體7的位置偏移。 第7圖纷不積層板製造偏差防止裝置,是由矩形平板 20、在此矩形平板20的長方向兩端的略中央附近設有一對 凹部23的分隔板2,及具有與此凹部23接合之外形的棒狀 :差山防止構件4所構成。其特徵在於,把棒狀偏差防止構 件4肷入至相鄰的分隔板的凹部23,藉此,使分隔板2彼此 相連結。依照此偏差防止裝置,可把偏差防止構件4盥分 隔板2更強固地接合,因而可確實地抑制多層排列體7之水 平方向的位置偏移。 第8圖繪示積層板製造偏差防止裝置,是由矩形平板 20、在此矩形平板20的長方向兩端的略中央附近具有突出 的一對突出片21的分隔板2,及具有與此突出片π接合之 形狀的凹部4 3的棒狀偏差防止構件4所構成。其特徵在 於,把相鄰的分隔板2的突出片21,嵌入至棒狀偏差防止 j構件4的凹部43,藉此,使分隔板2彼此相連結。 | 第9圖繪示的積層板製造偏差防止裝置,是由矩形平 板20、在此矩形平板20的長方向兩端的略中央附近突出的 一對突出片2 1、具有在各突出片的側面設有一對切口 24的 分隔板2、具有與切口 24接合之一對爪45,及具有與突出 片側面接合之凹部43的棒狀偏差防止構件4所構成了其特 徵在於,把偏差防止構件4的爪4 5嵌入至相鄰的兩片分隔12323pif.ptd Page 15 200407063 V. Description of the invention (11) The holding device for preventing the component, TANG Wei-Zhan said that it was fixed on the carrier 5 by Yi Xia. By inserting the deviation preventing member 4 into the cylindrical hibiscus 41 free, the deviation prevention can be prevented, and the positional displacement of the multilayer array body 7 caused by the carrier 5 during transportation can be prevented. 7 is a device for preventing deviations in manufacturing laminated boards, which is composed of a rectangular flat plate 20, a partition plate 2 provided with a pair of recessed portions 23 near the center of both ends in the longitudinal direction of the rectangular flat plate 20, and The shape of the rod: the difference prevention member 4. It is characterized in that the rod-like deviation preventing members 4 are inserted into the recessed portions 23 of the adjacent partition plates, thereby connecting the partition plates 2 to each other. According to this deviation preventing device, the deviation preventing member 4 and the partition plate 2 can be more strongly joined, so that the horizontal positional displacement of the multilayer array body 7 can be reliably suppressed. FIG. 8 shows a laminated plate manufacturing deviation preventing device, which is composed of a rectangular flat plate 20, a partition plate 2 having a pair of protruding pieces 21 protruding near the center of both ends in the longitudinal direction of the rectangular flat plate 20, and The rod-shaped deviation preventing member 4 of the recessed portion 43 of the shape in which the pieces π are joined is configured. It is characterized in that the protruding pieces 21 of the adjacent partition plates 2 are fitted into the recesses 43 of the rod-shaped deviation prevention j member 4 to thereby connect the partition plates 2 to each other. The laminated plate manufacturing deviation preventing device shown in FIG. 9 is a rectangular flat plate 20 and a pair of protruding pieces 21 protruding near the center of both ends in the longitudinal direction of the rectangular flat plate 20. The partition plate 2 having a pair of cutouts 24, a pair of claws 45 engaging one of the cutouts 24, and a rod-like deviation preventing member 4 having a recess 43 engaged with a side surface of the protruding piece are characterized in that the deviation preventing member 4 is The claws 4 5 are embedded in the adjacent two pieces to separate
200407063 五、發明說明(12) 板2的切口 24,藉此,可使分隔板2彼此之間強固地連結。 分隔板2的突出片21的側面是接觸至防止構件4的凹部43, 再加上把偏差防止構件4的爪45接合至切口 24,所以可利 用偏差防止構件更進一步提昇連結後分隔板2的位置偏差 防止效果。 第10圖繪示的積層板製造偏差防止裝置,是由矩形平 板20、在此矩形平板2〇的長方向兩端的略中央附近突出的 對犬出片21、具有在各突出片的側面設有一對切口 24的 分隔板2,及具有與切口 24接合之一對爪45,並具有在使 爪間距離變窄的方向上提供彈性驅動力的彈力驅動裝置 (未圖不)的偏差防止構件4所構成。把偏差防止構件4的爪 45接合至相鄰的分隔板2的切口 24,藉此,可使分隔板2彼 此之間強固地連結。具體而言,偏差防止構件4具有斷面 狀且在軸方向上具一定長度的一對臂46,各臂的一 對樞軸47回轉地被支持著,另端則設有心。且, J上46 :利用彈簧等的彈力驅動裝置,把爪45的先端彼此 的/向施以彈力。依照此偏差防止裝置,如第1〇圖 =示’可容易地把偏差防止構件4的爪45往設於 24相接合,且可更進-步地提昇連結後 之刀隔板2的位置偏差(移動)的防止效果。 5圖緣示的積層板製造偏差防止裝置,《由矩 二/矩古形平板2〇表面的周緣部設有-對凹部25的分 隔板2,及具有與前述凹部25 丨3们刀 使爪間距離變窄的方向上提供彈對/45,並具有在 坪f生驅動力的彈力驅動裝置200407063 V. Description of the invention (12) The cutouts 24 of the plates 2 allow the partition plates 2 to be firmly connected to each other. The side surface of the protruding piece 21 of the partition plate 2 is a recess 43 that contacts the prevention member 4 and the claw 45 of the deviation prevention member 4 is joined to the cutout 24, so the deviation prevention member can be used to further enhance the rear separation plate after connection. 2 position deviation prevention effect. The laminated plate manufacturing deviation preventing device shown in FIG. 10 is a rectangular flat plate 20, a pair of dog-out pieces 21 protruding near the center of both ends in the longitudinal direction of the rectangular flat plate 20, and a side surface of each protruding piece is provided with a The partition plate 2 facing the cutout 24, and a deviation preventing member having an elastic driving device (not shown) having a pair of claws 45 engaged with the cutout 24 and having an elastic driving force in a direction that narrows the distance between the claws. 4 composition. The claws 45 of the deviation preventing member 4 are joined to the cutouts 24 of the adjacent partition plates 2, whereby the partition plates 2 can be firmly connected to each other. Specifically, the deviation preventing member 4 has a pair of arms 46 having a cross-sectional shape and a certain length in the axial direction, and a pair of pivot shafts 47 of each arm are rotatably supported, and a heart is provided at the other end. Moreover, J upper 46: The elastic force driving means such as a spring is used to apply elastic force to the distal ends of the claws 45 in the same direction. According to this deviation preventing device, as shown in FIG. 10, 'the claws 45 of the deviation preventing member 4 can be easily engaged at 24, and the position deviation of the blade spacer 2 after the connection can be further increased. (Moving) prevention effect. The laminated plate manufacturing deviation prevention device shown in Fig. 5 is provided with a partition plate 2 provided with a pair of recessed portions 25 at the peripheral edge of the surface of the second / rectangular flat plate 20, and has the same operations as the recessed portions 25 and 3 described above. Provides elastic pair / 45 in the direction where the distance between the claws becomes narrow, and has an elastic driving device that generates driving force at the plateau
12323pif.ptd 第17頁 200407063 五、發明說明(13) ~ (未圖示)的偏差防止構件4所構成。把偏差防止構件4的爪 45接合至相鄰的分隔板2的凹部25,藉此,可使分隔板2彼 此之間連結。本實施例之偏差防止裝置的結構,其與第i 〇 圖之偏差防止構件結構實質上為相同,因而省略重複的說 明’但針對與第1 〇圖的偏差防止構件之各分隔板2之突出 片2 1的側面上所設的切口 4 5接合的設計,第丨丨圖的偏差防 止構件,其爪45的一個是接合至設於相鄰的分隔板2的一 邊的凹部25,另邊的爪45則是接合至設於相鄰的分隔板之 另邊的凹部25,把配置於積層體6之間的相鄰的一對分隔 板2從厚度方向夾住,此點則與第i 〇圖不同。尚,就加壓 力^熱時進=步限制分隔板2之移動的觀點來看,較佳的 疋隔板(2、3)及積層體6的端面,做成如第11圖所 二ίί至偏I防止構件4。且,在分隔板w夾持力非常 【的;::丄:f ’不-定需在分隔板2上設置凹部25,但 部25 :像:t i固定爪的位置的觀點看來,建議形成凹 #25像廷樣,依照本實施例的偏差防止裝 = 厚度)方向,透過兩片二定口 = :間口;2各而/?性高的位置偏移防止效 加壓處理的積岸體6 t θ 的偏差防止構件4,在加熱 合,適切的選擇合用者。 ,、有各種厚度的場 [產業利用性] 造成分隔板移動,可利用 =$,預浸材的樹脂流動 利用利用偏差防止構件,使分隔板彼12323pif.ptd Page 17 200407063 V. Description of the invention (13) ~ (not shown) The deviation prevention member 4 is composed. The claws 45 of the deviation preventing member 4 are joined to the recessed portions 25 of the adjacent partition plates 2, whereby the partition plates 2 can be connected to each other. The structure of the deviation preventing device of this embodiment is substantially the same as the structure of the deviation preventing member of FIG. 10, and therefore redundant description is omitted. However, for each of the partition plates 2 of the deviation preventing member of FIG. 10, One of the claws 45 of the deviation prevention member shown in the figure in the design of the engagement of the cutout 4 5 provided on the side of the protruding piece 21 is joined to a recessed portion 25 provided on one side of the adjacent partition plate 2 and the other The side claws 45 are joined to the recessed portions 25 provided on the other side of the adjacent partition plate, and sandwich the adjacent pair of partition plates 2 disposed between the laminated bodies 6 from the thickness direction. It is different from the figure i 〇. Still, from the point of view that the pressure ^ heat advances = further restricts the movement of the partition plate 2, the end faces of the preferred concrete partition (2, 3) and the laminated body 6 are made as shown in FIG. 11 To deflection I prevention member 4. Moreover, the holding force of the partition plate w is very large: [:: 丄: f ']-It is necessary to provide the recessed portion 25 on the partition plate 2, but the portion 25: like: the position of the fixing claw, It is suggested to form the recess # 25 like a court. According to the direction of the deviation prevention device of this embodiment = thickness), through two pieces of two fixed openings =: between the openings; 2 each of the products with high positional displacement prevention effect pressure treatment The deviation prevention member 4 of the shore body 6 t θ is suitable for heating and closing, and a suitable one is appropriately selected. There are fields of various thicknesses [Industrial availability] The partition plate is moved, and can be used = $, the resin flow of the prepreg is used to prevent the member from using the deviation to make the partition plate
12323pif.ptd 第18頁 在本發明中,在加熱加壓 200407063 :五、發明說明(14) I此間連接而獲得抑制。以此方式,積層板製造時的薄片材 料的位置偏移可顯著地低減。而真,因為偏差防止構件不 ;與積層體相接觸,薄片材料可無變形且無破損地進行加熱 i I加壓。特別是,當薄片材料是薄的金屬箔的場合,可防止i 丨起皺,因而可減少積層板之成形不艮的發生。 i ! 像這樣’本發明的積層板製造方法及積層板製造偏差|12323pif.ptd page 18 In the present invention, under heat and pressure 200407063: V. Description of the invention (14) I connected here to obtain suppression. In this way, the positional deviation of the sheet material at the time of manufacturing the laminated board can be significantly reduced. In fact, since the deviation preventing member does not contact the laminated body, the sheet material can be heated without deformation and breakage and pressurized. In particular, when the sheet material is a thin metal foil, it is possible to prevent wrinkling, thereby reducing the occurrence of lamination of the laminated board. i! It ’s like this ’The method for manufacturing a laminated board of the present invention and the manufacturing deviation of the laminated board |
丨防止裝置,可減少積層板的成形不良,而穩定地供給高品I I質的積層板,基於此點,可預期本發明將廣泛地運用於车 |導體產業。 干 | 雖然本發明已以較佳實施例揭露 I限定本發明,任何熟習此技藝者,=ϋ上’然其並非用以 和範圍内,當可作些許之更動與潤不脫離本發明之精神 範圍當視後附之申請專利範圍所哭a ’因此本發明之保護 叫%界定者為準。丨 Prevention device can reduce the formation failure of laminated board and stably supply high-quality laminated board of high quality. Based on this, it can be expected that the present invention will be widely used in the car | conductor industry. Dry | Although the present invention has been disclosed in the preferred embodiment to limit the present invention, anyone skilled in this art will not use it within the scope. It can be changed and moistened without departing from the spirit of the present invention. The scope is subject to the scope of the attached patent application. Therefore, the protection of the present invention is defined as%.
12323pif.ptd 200407063 丨圖式簡單說明 [圖式簡單說明] 第1 A〜1 C圖繪示依照本發明之較佳實施例之一種積層 板製造方法之概略側視圖。 第2A、2B圖繪示本發明之積層板製造用偏差防止裝置 的第1及第2分隔板之平面圖。 第3 A〜3C圖繪示由金屬板、薄片材料及預浸材所構成12323pif.ptd 200407063 丨 Simplified illustration of the drawings [Simplified illustration of the drawings] Figures 1A to 1C show a schematic side view of a method for manufacturing a laminated board according to a preferred embodiment of the present invention. Figures 2A and 2B are plan views of the first and second partition plates of the deviation preventing device for manufacturing a laminated board according to the present invention. Figures 3A to 3C show the metal plate, sheet material, and prepreg.
I |的積層體結構的概略側視圖。 ! 第4圖繪示本發明之其他積層板製造偏差防止裝置之 平面圖。 第5圖繪示本發明之再另一積層板製造偏差防止裝置 丨之側視圖。 | 第6圖繪示本發明之可伸縮的偏差防止構件之部份斷I | A schematic side view of the multilayer structure. Fig. 4 is a plan view showing another apparatus for preventing deviations in manufacturing a laminated board according to the present invention. FIG. 5 shows a side view of yet another apparatus for preventing deviations in manufacturing laminated boards according to the present invention. Figure 6 shows a partial break of the retractable deviation preventing member of the present invention
I 面圖。 第7圖繪示本發明之其他積層板製造偏差防止裝置之 平面圖。 第8圖繪示本發明之再另一積層板製造偏差防止裝置 丨之上視圖。 I 第9圖繪示本發明之更另一積層板製造偏差防止裝置 |之上視圖。I side view. Fig. 7 is a plan view showing another apparatus for preventing deviations in manufacturing a laminated board according to the present invention. FIG. 8 is a top view of yet another apparatus for preventing deviations in manufacturing laminated boards according to the present invention. I FIG. 9 shows still another laminated device manufacturing deviation preventing device of the present invention.
I 第1 0圖繪示本發明之更另一積層板製造偏差防止裝置 之上視圖。 I 第11圖繪示本發明之更另一積層板製造偏差防止裝置 之側視圖。 第1 2圖繪示習知應用於積層板製造方法之具有偏差止I FIG. 10 shows a top view of another apparatus for preventing deviations in manufacturing laminated boards according to the present invention. I FIG. 11 shows a side view of another laminated board manufacturing deviation preventing device according to the present invention. Figures 12 and 12 show the conventional method used in manufacturing laminated boards.
12323pif.ptd 第20頁 200407063 圖式簡單說明 押部的金屬板的斜視圖。 [圖式標示說明] 1 :熱板,2、3 :分隔板,4 :偏差防止構件, 5:載板(carrier plate),6、120:積層體,7:多層排 列體, 8 :墊板,2 0、1 0 0 :平板,2 1 ·.突出片,2 2 :接合孔, 2 3、2 5 :凹部,2 4 :切口,4 0 :偏差防止構件, 4 1 :筒狀構件,4 2 :彈性體,4 3 :凹部,4 5 :爪,4 6 : 臂, 4 7 :樞軸,6 0 :預浸材,7 0 :薄片材料,7 1 :金屬箔, 7 2 :印刷配線板,7 5 :内層用回路圖案,11 0 :偏差止押 部°12323pif.ptd Page 20 200407063 Brief description of the drawing The perspective view of the metal plate of the pusher. [Schematic description] 1: hot plate, 2, 3: partition plate, 4: deviation prevention member, 5: carrier plate, 6, 120: laminated body, 7: multilayer array, 8: pad Plate, 2 0, 1 0 0: flat plate, 2 1 ·. Protruding piece, 2 2: joint hole, 2 3, 2 5: recessed portion, 2 4: cutout, 4 0: deviation prevention member, 4 1: cylindrical member 4 2: elastomer, 4 3: recess, 4 5: claw, 4 6: arm, 4 7: pivot, 60: prepreg, 70: sheet material, 7 1: metal foil, 7 2: Printed wiring board, 7 5: Circuit pattern for inner layer, 11 0: Deviation stopper °
12323pif.ptd 第21頁12323pif.ptd Page 21
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2002280011A JP3896938B2 (en) | 2002-09-25 | 2002-09-25 | Laminate production method |
Publications (2)
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TW200407063A true TW200407063A (en) | 2004-05-01 |
TWI237537B TWI237537B (en) | 2005-08-01 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW092126439A TWI237537B (en) | 2002-09-25 | 2003-09-25 | Method for manufacturing a laminated plate and laminated plate dislocation preventing device |
Country Status (6)
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JP (1) | JP3896938B2 (en) |
CN (1) | CN100417509C (en) |
AU (1) | AU2003266586A1 (en) |
HK (1) | HK1080424B (en) |
TW (1) | TWI237537B (en) |
WO (1) | WO2004028775A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4209456B1 (en) * | 2008-02-22 | 2009-01-14 | 三菱重工業株式会社 | Lamination bonding equipment jig |
JP5583570B2 (en) * | 2010-12-20 | 2014-09-03 | 株式会社日立製作所 | Hot press apparatus and multilayer printed circuit board pressing method |
CN102248747A (en) * | 2011-05-27 | 2011-11-23 | 开平太平洋绝缘材料有限公司 | Frame shape positioning device |
CN103913471B (en) * | 2012-12-31 | 2016-04-13 | 深南电路有限公司 | The method held and plate buries and holds layer contraposition is buried in a kind of inspection |
CA3007608C (en) * | 2016-01-27 | 2020-04-14 | Mitsui High-Tec, Inc. | Method for processing laminated material |
CN107995771A (en) * | 2017-11-09 | 2018-05-04 | 奥士康科技股份有限公司 | A kind of high multilayer mixing second order HDI printed circuit board (PCB)s alignment system and method |
JP7317167B1 (en) * | 2022-03-28 | 2023-07-28 | 株式会社日本製鋼所 | Laminate molding equipment and laminate molding system |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS59185600A (en) * | 1983-04-08 | 1984-10-22 | Hitachi Ltd | Multistage type hot press |
JPH0263577U (en) * | 1988-10-31 | 1990-05-11 | ||
JPH04157751A (en) * | 1990-10-19 | 1992-05-29 | Nec Corp | Wafer transport device |
JPH05121875A (en) * | 1991-10-24 | 1993-05-18 | Risho Kogyo Co Ltd | Manufacture of multilayer printed wiring board |
JPH05343847A (en) * | 1992-06-05 | 1993-12-24 | Hitachi Ltd | Manufacture of multilayer printed wiring board |
JPH07186167A (en) * | 1993-12-28 | 1995-07-25 | Ibiden Co Ltd | Dummy plate of press apparatus for forming laminated base sheet |
JPH1128733A (en) * | 1997-07-10 | 1999-02-02 | Shin Kobe Electric Mach Co Ltd | Carrier plate for manufacturing laminate |
JP3712941B2 (en) * | 2001-01-05 | 2005-11-02 | 株式会社名機製作所 | Laminating press |
JP4599745B2 (en) * | 2001-04-04 | 2010-12-15 | パナソニック電工株式会社 | Method for producing metal-clad laminate |
-
2002
- 2002-09-25 JP JP2002280011A patent/JP3896938B2/en not_active Expired - Lifetime
-
2003
- 2003-09-24 AU AU2003266586A patent/AU2003266586A1/en not_active Abandoned
- 2003-09-24 WO PCT/JP2003/012174 patent/WO2004028775A1/en active Application Filing
- 2003-09-24 CN CNB038212277A patent/CN100417509C/en not_active Expired - Lifetime
- 2003-09-25 TW TW092126439A patent/TWI237537B/en not_active IP Right Cessation
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2006
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HK1080424B (en) | 2009-06-05 |
JP2004114465A (en) | 2004-04-15 |
CN1681632A (en) | 2005-10-12 |
WO2004028775A1 (en) | 2004-04-08 |
AU2003266586A1 (en) | 2004-04-19 |
CN100417509C (en) | 2008-09-10 |
TWI237537B (en) | 2005-08-01 |
HK1080424A1 (en) | 2006-04-28 |
JP3896938B2 (en) | 2007-03-22 |
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