HK1080424B - 層壓板製造方法及層壓板製造用防偏移裝置 - Google Patents

層壓板製造方法及層壓板製造用防偏移裝置

Info

Publication number
HK1080424B
HK1080424B HK06100302.7A HK06100302A HK1080424B HK 1080424 B HK1080424 B HK 1080424B HK 06100302 A HK06100302 A HK 06100302A HK 1080424 B HK1080424 B HK 1080424B
Authority
HK
Hong Kong
Prior art keywords
laminated board
misregistration
preventing system
producing
board production
Prior art date
Application number
HK06100302.7A
Other languages
English (en)
Other versions
HK1080424A1 (en
Inventor
須川美久
森正至
吉田末雄
關根正一
渡邊一
鈴木卓也
Original Assignee
松下電工株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電工株式會社 filed Critical 松下電工株式會社
Publication of HK1080424A1 publication Critical patent/HK1080424A1/xx
Publication of HK1080424B publication Critical patent/HK1080424B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/20—Making multilayered or multicoloured articles
    • B29C43/203—Making multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/262—Partition plates or sheets for separating several laminates pressed simultaneously
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
HK06100302.7A 2002-09-25 2006-01-06 層壓板製造方法及層壓板製造用防偏移裝置 HK1080424B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002280011A JP3896938B2 (ja) 2002-09-25 2002-09-25 積層板の製造方法
PCT/JP2003/012174 WO2004028775A1 (ja) 2002-09-25 2003-09-24 積層板の製造方法および積層板製造用ずれ防止装置

Publications (2)

Publication Number Publication Date
HK1080424A1 HK1080424A1 (en) 2006-04-28
HK1080424B true HK1080424B (zh) 2009-06-05

Family

ID=32040474

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06100302.7A HK1080424B (zh) 2002-09-25 2006-01-06 層壓板製造方法及層壓板製造用防偏移裝置

Country Status (6)

Country Link
JP (1) JP3896938B2 (zh)
CN (1) CN100417509C (zh)
AU (1) AU2003266586A1 (zh)
HK (1) HK1080424B (zh)
TW (1) TWI237537B (zh)
WO (1) WO2004028775A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4209456B1 (ja) * 2008-02-22 2009-01-14 三菱重工業株式会社 積層接合装置用治具
JP5583570B2 (ja) * 2010-12-20 2014-09-03 株式会社日立製作所 ホットプレス装置および多層プリント基板のプレス方法
CN102248747A (zh) * 2011-05-27 2011-11-23 开平太平洋绝缘材料有限公司 一种框形定位装置
CN103913471B (zh) * 2012-12-31 2016-04-13 深南电路有限公司 一种检验埋容板上埋容层对位的方法
CN108472708B (zh) * 2016-01-27 2020-08-11 株式会社三井高科技 层叠构件的加工方法
CN107995771A (zh) * 2017-11-09 2018-05-04 奥士康科技股份有限公司 一种高多层混合二阶hdi印刷电路板对位系统及方法
JP7317167B1 (ja) * 2022-03-28 2023-07-28 株式会社日本製鋼所 積層成形装置および積層成形システム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59185600A (ja) * 1983-04-08 1984-10-22 Hitachi Ltd 多段形ホツトプレス
JPH0263577U (zh) * 1988-10-31 1990-05-11
JPH04157751A (ja) * 1990-10-19 1992-05-29 Nec Corp ウェハー搬送装置
JPH05121875A (ja) * 1991-10-24 1993-05-18 Risho Kogyo Co Ltd 多層プリント配線板用基板の製造方法
JPH05343847A (ja) * 1992-06-05 1993-12-24 Hitachi Ltd 多層印刷配線板の製造方法
JPH07186167A (ja) * 1993-12-28 1995-07-25 Ibiden Co Ltd 積層基板形成用プレス装置のダミー板
JPH1128733A (ja) * 1997-07-10 1999-02-02 Shin Kobe Electric Mach Co Ltd 積層板製造用キャリアプレート
JP3712941B2 (ja) * 2001-01-05 2005-11-02 株式会社名機製作所 積層プレス装置
JP4599745B2 (ja) * 2001-04-04 2010-12-15 パナソニック電工株式会社 金属張り積層板の製造方法

Also Published As

Publication number Publication date
AU2003266586A1 (en) 2004-04-19
JP2004114465A (ja) 2004-04-15
WO2004028775A1 (ja) 2004-04-08
CN1681632A (zh) 2005-10-12
CN100417509C (zh) 2008-09-10
TW200407063A (en) 2004-05-01
JP3896938B2 (ja) 2007-03-22
HK1080424A1 (en) 2006-04-28
TWI237537B (en) 2005-08-01

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20230923