TWI232797B - Process for cutting laminate boards and half-cutting device used in the process - Google Patents

Process for cutting laminate boards and half-cutting device used in the process Download PDF

Info

Publication number
TWI232797B
TWI232797B TW092117047A TW92117047A TWI232797B TW I232797 B TWI232797 B TW I232797B TW 092117047 A TW092117047 A TW 092117047A TW 92117047 A TW92117047 A TW 92117047A TW I232797 B TWI232797 B TW I232797B
Authority
TW
Taiwan
Prior art keywords
cutting
laminated board
laminated
cut
board
Prior art date
Application number
TW092117047A
Other languages
English (en)
Chinese (zh)
Other versions
TW200402354A (en
Inventor
Hisashi Yasoda
Takashi Tsuchida
Original Assignee
Uht Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uht Corp filed Critical Uht Corp
Publication of TW200402354A publication Critical patent/TW200402354A/zh
Application granted granted Critical
Publication of TWI232797B publication Critical patent/TWI232797B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0675—Grinders for cutting-off methods therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/06—Grooving involving removal of material from the surface of the work
    • B26D3/065—On sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007—Control means comprising cameras, vision or image processing systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Milling Processes (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
TW092117047A 2002-06-28 2003-06-24 Process for cutting laminate boards and half-cutting device used in the process TWI232797B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002190355A JP2004034319A (ja) 2002-06-28 2002-06-28 積層板の切断方法及びその切断方法に使用するハーフカット装置

Publications (2)

Publication Number Publication Date
TW200402354A TW200402354A (en) 2004-02-16
TWI232797B true TWI232797B (en) 2005-05-21

Family

ID=31700292

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092117047A TWI232797B (en) 2002-06-28 2003-06-24 Process for cutting laminate boards and half-cutting device used in the process

Country Status (4)

Country Link
JP (1) JP2004034319A (ko)
KR (1) KR100621453B1 (ko)
CN (1) CN1280074C (ko)
TW (1) TWI232797B (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4780752B2 (ja) * 2004-12-28 2011-09-28 Ｕｈｔ株式会社 切断加工装置
CN101160021B (zh) * 2007-10-31 2010-11-10 无锡凯尔科技有限公司 印刷线路板拼板的整板裁切装置及其裁切方法
JP5145499B2 (ja) * 2008-05-14 2013-02-20 国立大学法人福井大学 異形湾曲押出成形品の製造方法およびその製造装置
US9050732B2 (en) * 2008-12-23 2015-06-09 Trelleborg Sealing Solutions Kalmar Ab Method of forming a cutting line partially through a multilayer plate structure
TWI462885B (zh) * 2010-12-13 2014-12-01 Mitsuboshi Diamond Ind Co Ltd Method of breaking the substrate
CN102438399B (zh) * 2011-09-30 2014-08-06 景旺电子科技(龙川)有限公司 一种金属基pcb板无间距拼板及其切割方法
CN104028824B (zh) * 2014-06-16 2017-02-15 惠州华阳通用电子有限公司 一种剪断式pcb分板机
CN105174180B (zh) * 2015-09-24 2018-05-01 山东新华医疗器械股份有限公司 塑料安瓿旋转式割缝机构
KR101711451B1 (ko) * 2015-10-05 2017-03-02 양승철 나이프 가공에 의한 프리커팅라인 형성장치
CN105618857A (zh) * 2016-03-28 2016-06-01 胜宏科技（惠州）股份有限公司 一种pcb内斜边制作方法
CN105818177A (zh) * 2016-04-29 2016-08-03 英拓自动化机械（深圳）有限公司 电路板裁切刀具及其裁切电路板的方法
JP6177412B1 (ja) * 2016-11-22 2017-08-09 株式会社ソディック 積層造形装置
CN108040431B (zh) * 2017-12-11 2020-01-07 吉安满坤科技股份有限公司 一种沉铜前锣槽的加工方法
CN108135087A (zh) * 2018-02-05 2018-06-08 江西景旺精密电路有限公司 一种多层pcb大板层压后自动分板的方法
IT201800003287A1 (it) * 2018-03-05 2019-09-05 V Shapes S R L Stazione di incisione per macchina confezionatrice e relativo metodo di incisione
TWI659790B (zh) * 2018-10-24 2019-05-21 得力富企業股份有限公司 Multiple half cutting tool set
CN113400383A (zh) * 2021-07-09 2021-09-17 石华 一种改性沥青防水卷材生产工艺
CN114670271A (zh) * 2022-04-06 2022-06-28 林州致远电子科技有限公司 一种pcb覆铜板加工切割一体机

Also Published As

Publication number Publication date
TW200402354A (en) 2004-02-16
KR20040002757A (ko) 2004-01-07
CN1280074C (zh) 2006-10-18
JP2004034319A (ja) 2004-02-05
CN1480304A (zh) 2004-03-10
KR100621453B1 (ko) 2006-09-13

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MM4A Annulment or lapse of patent due to non-payment of fees