1317309 九、發明說明： 【發明所屬之技術領域】 ^發明涉及-種承載裝置，尤其涉及— 雷射加工承載裝置。 ％吩攸 【先前技術】 隨著電子產品不斷向體積小型化及功能多樣化 么展，已被廣泛應用於各種電子產品之柔 :小’線路密度亦越來越高。為了節約原料成本及讀^ 二：Τ板上通常會設計許多相同或不同線路單 兀來共同加工製作。故，當牟性 裝好電子元哭件之後，元成線路製作並貼 “ 牛後通电需要進行後續雷射切割加工。 田"刀割加工時，利用柔性電路板自身輕薄之特點，採 ί射真空：附工作台直接將柔性電路板吸附固 符人二產：f:電路板之線路單元將柔性電路板切割成 >付口電子產品組裝要求之成品。 姓雷射切割機之真空吸附卫作台來直接吸附固定柔 右Ρ冑’與工作台表面接觸之柔性電路板表面需要且 有較*平整性才能確㈣性電路板良好固定。㉟，當t 電路板採用雙面貼裝，即，於羊性 田Μ 都貼褒有電子元考件/錐：fl:板之相對兩個表面 表面會因雷早Γ 電路板之相對兩個 兀器件之存在而向低不平，從而無法良好 :;:雷：割機之真空吸附工作台上，卿 °精又。此外，將雙面贴裝柔性電路板直接與工作台表面 1317309 接觸固定，可能會損壞電子元 地連接，甚至致使電 子板之間良好 攸而影響柔性電路板成品之品質。 >、而知壞、脫落， 【發明内容】 有鑑於此，提供一種柔性電路板 以承載雙面貼裝柔性電路板 、载襄置，用 以下將以實施例說明—種田、σ工實屬必要。 置。 電路板雷射加卫承载裝 # 一種柔性電路板雷射加卫承載裝置， 弟一表面及相對第二表面，μ承載裝置包括 凹槽及至少-定位孔，該至設有至少-第- :表面’該第二表面開設有至少一第二及第 曰位置相賴之第-凹槽之深度及該第凹 t於所述柔性電路板雷射加工承載裝置從第二=;和 表面之厚度。 步表面到第二 =於先前技術’所述柔性電路板雷射加工承載裝置 對庫地第面具3與柔性電路板第一貼裝面之電子元器件相 應地第—凹槽，用於容置柔性電路板第-貼裝面之雷早 疋盗件’以使柔性電路板可平穩放置於該柔性電路 加工承載裝置。所述柔性電路板雷射加工承載裝置之第二 少一第二凹槽，該第二凹槽内之空氣排出後可 牦j柔性電路板雷射加工承載裝置與雷射加工裝置真空工 作台之間地吸附力，從而使柔性電路板雷射加工承载=置 良好地固定於真空工作台面。此外，雷射加工裝置真命工 1317309 1 作台面之真空吸附力可透過真空定位孔使柔性電路板吸附 固定於柔性電路板雷射加工承載裝置。所述柔性電路板雷 射加工承載裝置使得雙面貼裝柔性電路板可平整地固定於 雷射加工裝置上，能有效提高雙面貼裝柔性電路板雷射切 割之精度，並有效防止電子元器件與柔性電路板之連接不 良、脫落或損壞。 【實施方式】 下面結合附圖及實施例對本技術方案之柔性電路板雷 鲁射加工承載裝置作進一步說明。 請參閱圖1，本技術方案實施例提供之柔性電路板雷 射加工承載裝置用於承載柔性電路板10進行雷射加工。該 柔性電路板10具有第一貼裝面101及相對第二貼裝面 102。於第一貼裝面101貼裝有複數個第一電子元器件 103，於第二貼裝面102貼裝有複數個第二電子元器件 104，從而構成雙面貼裝柔性電路板10。本實施例中，該 | 第一電子元器件103為長方體形，該第二電子元器件104 為圓柱體形，該第一電子元器件103及該第二電子元器件 104分別對應貼裝於柔性電路板10相對地第一貼裝面101 及第二貼裝面102。當然，第一電子元器件103及第二電 ‘子元器件104之數量、形狀及尺寸可相同亦可不相同，位 置可相對應亦可不相對應。 本技術方案實施例提供之柔性電路板雷射加工承載裝 置設計製作時可設計為與柔性電路板10貼裝有第一電子 元器件103之第一貼裝面101配合，亦可與柔性電路板10 1317309 貼裝有第二電子元器件104之第二貼裝面102配合，用於 。 承載柔性電路板10。以下實施例提供之柔性電路板雷射加 工承載裝置將係與柔性電路板10貼裝有第一電子元器件 103之第一貼裝面101配合，用於承載柔性電路板10。 請一併參閱圖2及圖3，本技術方案第一實施例提供 之柔性電路板雷射加工承載裝置100。該柔性電路板雷射 加工承載裝置100可為銅板、銘板、鐵板、合金板、有機 複合板或其他可耐高溫之底板。本實施例中，所述柔性電 *路板雷射加工承載裝置100為厚度均勻表面平整之鋁 板。該柔性電路板雷射加工承載裝置100包括第一表面110 及相對第二表面120。 該第一表面110開設有複數個第一凹槽112及複數個 定位孔113。該複數個第一凹槽112用於對應地容置貼裝 於柔性電路板10之第一貼裝面101之複數個第一電子元器 件103。該第一凹槽112之數量、開設位置、形狀及尺寸 •均與貼裝於柔性電路板10之第一貼裝面101之第一電子元 器件103相對應。當柔性電路板10之第一貼裝面101之第 一電子元器件103只有一個時，該第一凹槽112亦應為一 個。為了便於取放第一電子元器件103,該第一凹槽112之 尺寸可比對應之第一電子元器件103之尺寸略大。本實施 例中，由於第一電子元器件103之形狀為長方體形，所以 該第一凹槽112亦為長方體形凹槽，第一電子元器件103 可恰好容置於該第一凹槽112中。該複數個定位孔113貫 通第一表面110及第二表面120，其開設位置並無限定， 1317309 其可開設於第一表面110不與第一凹槽112重合之任何位 ' 置。該複數個定位孔113可為圓形孔，方形孔，橢圓形孔 或其他不規則形狀孔。當然，該定位孔113之數量亦可僅 為一個。優選地，如本實施例中，該複數個定位孔113為 圓形孔，每一定位孔113分別與每一第一凹槽112相對應， 且與相對應之第一凹槽112相鄰設置。且該複數個定位孔 113圍繞該複數個第一凹槽112呈均勻分佈。當該第一凹 槽112為一個時，該複數個定位孔113可圍繞該一個第一 鲁凹槽112且呈均勻分佈。 該第二表面120開設有一第二凹槽122，其開設位置 並無限定，其可開設於第二表面120任何位置。該第二凹 槽122可為任意形狀，例如圓形凹槽、方形凹槽、環形凹 槽、多邊形凹槽及其它不規則形狀之凹槽。若第二凹槽122 與某個第一凹槽112之位置相對應，那麼此時該第二凹槽 122之深度及與其位置對應之第一凹槽112之深度之和應 $當小於柔性電路板雷射加工承載裝置100之厚度，即從第 一表面110到第二表面120之厚度，以使第一凹槽112與 第二凹槽122不相通。若該第二凹槽122並沒有直接與第 一凹槽112之位置相對應，此時，該第二凹槽122之深度 應當小於柔性電路板雷射加工承載裝置100之厚度。本實 施例中，該第二凹槽122為開設於第二表面120中央之方 形凹槽，貫通於第一表面110及第二表面120之複數個定 位孔113圍繞該第二凹槽122且呈均勻分佈。 當柔性電路板雷射加工承載裝置100承載柔性電路板 10 1317309 10固定於雷射加工裝置時，該第一表面110與所承載之柔 ' 性電路板10之第一貼裝面101接觸，第二表面120與雷射 加工裝置之真空吸附工作台接觸。貼裝於柔性電路板10 之第一貼裝面101之複數個第一電子元器件103恰好能容 置於第一表面110之複數個第一凹槽112中，確保柔性電 路板10平整地得以固定。該複數個定位孔113用以使雷射 加工裝置真空吸附工作台之真空吸附力可透過該複數個定 位孔113，從而吸附柔性電路板10使其固定於雷射加工承 *載裝置工作台。本實施例中，該複數個定位孔113對應複 數個第一凹槽112呈均勻分佈，以使得吸附力可均勻作用 於柔性電路板10，進一步確保柔性電路板10平整地得以 吸附固定，同時，亦確保被雷射切割下來之柔性電路板能 良好吸附固定於工作台。此時，第二表面120之第二凹槽 122内之空氣被真空吸附工作台抽真空排出，如此可增大 柔性電路板雷射加工承載裝置100與雷射加工裝置真空吸 φ附工作台之間地吸附力，從而使柔性電路板雷射加工承載 裝置100良好固定於真空工作台，便於柔性電路板之雷射 加工，例如按照柔性電路板10之線路單元將柔性電路板 10切割成符合電子產品組裝要求之成品。 請參閱圖4,本技術方案第二實施例提供之柔性電路 板雷射加工承載裝置200。其與第一實施例所提供之柔性 電路板雷射加工承載裝置100之不同之處在於，第二表面 220開設有複數個第二凹槽222。該複數個第二凹槽222 可為任意形狀，例如圓形凹槽、長方形凹槽、環形凹槽、 11 1317309 多邊形凹槽及其它不規則形狀之凹槽。本實施例中，該第 ' 二凹槽222為複數個平行排列之長方形凹槽。該複數個第 二凹槽222之厚度可相同亦可不相同，惟應當使得第二凹 槽222之深度及與其位置對應之第一凹槽（圖未示）之深 度之和小於柔性電路板雷射加工承載裝置200之厚度，以 使第一凹槽和第二凹槽222不相通。若該第二凹槽222並 未與第一凹槽之位置相對應，此時，該第二凹槽222之深 度小於柔性電路板雷射加工承載裝置200之厚度即可。本 β實施例中，該第二凹槽222為複數個深度相同之平行排列 之長方形凹槽，且都不與第一凹槽相連通。 請參閱圖5,本技術方案第三實施例提供之柔性電路 板雷射加工承載裝置300。其與第一實施例所提供之柔性 電路板雷射加工承載裝置100之不同之處在於，由於第二 表面320上所開設第二凹槽322尺寸較大，以致該複數個 定位孔313與該第二凹槽322相連通。當然，根據該第二 0 凹槽322形狀之不同，亦可僅係該複數個定位孔313中之 一個或幾個與該第二凹槽322相連通。 請參閱圖6,本技術方案第四實施例提供之柔性電路 板雷射加工承載裝置400。當其與第一實施例所提供之柔 性電路板雷射加工承載裝置100之不同之處在於，第二表 面420開設有複數個第二凹槽422，且該貫通於第一表面 410及第二表面420之複數個定位孔413與該複數個第二 凹槽422相連通。當然，根據第二凹槽422形狀之不同， 亦可僅係該複數個定位孔413中之一個或幾個與該複數個 12 1317309 第二凹槽422中之一個或幾個相連通。本實施例中，該第 二凹槽422為複數個平行排列之長方形凹槽，複數個定位 孔413均與該複數個第二凹槽422相連通，且每個第二凹 槽422均分別與兩個定位孔413相連通。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施方式，本 發明之範圍並不以上述實施方式為限，舉凡熟悉本案技藝 之人士，在援依本案發明精神所作之等效修飾或變化，皆 | 應包含於以下之申請專利範圍内。 【圖式簡單說明】 圖1係雙面貼裝柔性電路板示意圖。 圖2係本技術方案實施例一提供之柔性電路板雷射加工 承載裝置第一表面結構示意圖。 圖3係本技術方案實施例一提供之柔性電路板雷射加工 承載裝置之第二表面結構示意圖。 > 圖4係本技術方案實施例二提供之柔性電路板雷射加工 承載裝置之第二表面結構示意圖。 圖5係本技術方案實施例三提供之柔性電路板雷射加工 承載裝置之第二表面結構示意圖。 圖6係本技術方案實施例四提供之柔性電路板雷射加工 承載裝置之第二表面結構示意圖。 【主要元件符號說明】 柔性電路板 10 第一貼裝面 101 13 102 1317309 ' 第二貼裝面 第一電子元器件 第二電子元器件 柔性電路板雷射加工承載裝置 第一表面 第一凹槽 第二表面 定位孔 擊第二凹槽 103 104 100、200、300 ' 400 110、310、410 112 120 ' 220 ' 320 ' 420 113 、 313 、 413 122 ' 222 ' 322 ' 4221317309 IX. Description of the invention: [Technical field to which the invention pertains] The invention relates to a type of carrying device, and more particularly to a laser processing carrying device. % [Phase] As electronic products continue to be smaller and more diversified, they have been widely used in the softness of various electronic products: small 'line density is also getting higher and higher. In order to save the cost of raw materials and read ^ 2: Many different or different circuit boards are usually designed to be processed together. Therefore, when the electronic element is crying, the Yuancheng line is made and posted. Injection vacuum: attached to the workbench to directly adsorb the flexible circuit board to the second generation: f: the circuit board of the circuit board cuts the flexible circuit board into the finished product of the electronic product assembly requirements. The vacuum adsorption of the surname laser cutting machine The weitai table directly adsorbs the fixed soft right Ρ胄' the surface of the flexible circuit board that is in contact with the surface of the workbench and needs to be more flat to ensure that the (four) circuit board is well fixed. 35, when the t circuit board is mounted on both sides, That is, in the sheep sex field, there are electronic yuan test pieces / cones: fl: the opposite surface surfaces of the board will be low due to the existence of two relative devices of the circuit board, which is not good. :::Ray: On the vacuum adsorption table of the cutting machine, the Qing is fine. In addition, the double-sided mounting flexible circuit board is directly fixed to the surface of the table 1317309, which may damage the connection of the electronic components and even cause the electronic There is a good relationship between the quality of the finished flexible circuit board. >, knowing the bad, falling off, [invention] In view of this, a flexible circuit board is provided to carry the double-sided mounting flexible circuit board and the mounting device. The following will be explained by way of example - farming, σ work is necessary. Placement board laser plus escort loader # A flexible circuit board laser reinforced carrier device, a surface and a second surface, the μ bearing device includes a groove and at least a positioning hole, wherein the at least - -: surface is provided; the second surface is open with a depth of the first groove corresponding to the second and second positions, and the first concave portion is The flexible circuit board laser processing carrier device from the second =; and the thickness of the surface. Step surface to the second = in the prior art 'the flexible circuit board laser processing carrier device to the library mask 3 and the flexible circuit board first The electronic component of the mounting surface correspondingly has a first groove for accommodating the first surface of the flexible circuit board, so that the flexible circuit board can be smoothly placed on the flexible circuit processing carrier. Flexible circuit board laser a second less than a second recess of the carrying device, wherein the air in the second recess is discharged to absorb the force between the laser processing device of the flexible circuit board and the vacuum working table of the laser processing device, thereby enabling Flexible circuit board laser processing load = well fixed to the vacuum work surface. In addition, the laser processing device is really working 1317309 1 The vacuum adsorption force of the table top can be used to adsorb and fix the flexible circuit board to the flexible circuit board by vacuum positioning holes. The processing and carrying device of the flexible circuit board enables the double-sided mounting flexible circuit board to be flatly fixed on the laser processing device, which can effectively improve the precision of laser cutting of the double-sided mounting flexible circuit board. The connection between the electronic component and the flexible circuit board is effectively prevented, and the connection or the damage of the flexible circuit board is effectively prevented. [Embodiment] The flexible circuit board Rayleigh processing bearing device of the present technical solution will be further described below with reference to the accompanying drawings and embodiments. Referring to FIG. 1, a flexible circuit board laser processing carrying device provided by an embodiment of the present technical solution is configured to carry a flexible circuit board 10 for laser processing. The flexible circuit board 10 has a first mounting surface 101 and a second mounting surface 102. A plurality of first electronic components 103 are attached to the first mounting surface 101, and a plurality of second electronic components 104 are attached to the second mounting surface 102 to form a double-sided printed flexible circuit board 10. In this embodiment, the first electronic component 103 has a rectangular parallelepiped shape, and the second electronic component 104 has a cylindrical shape. The first electronic component 103 and the second electronic component 104 are respectively mounted on the flexible circuit. The board 10 is opposite to the first mounting surface 101 and the second mounting surface 102. Of course, the number, shape and size of the first electronic component 103 and the second electrical component 34 may be the same or different, and the positions may or may not correspond. The flexible circuit board laser processing bearing device provided by the embodiment of the present technical solution can be designed and matched with the first mounting surface 101 of the flexible circuit board 10 to which the first electronic component 103 is attached, or can be combined with the flexible circuit board. 10 1317309 The second mounting surface 102 to which the second electronic component 104 is attached is used for cooperation. The flexible circuit board 10 is carried. The flexible circuit board laser processing carrying device provided in the following embodiments is matched with the first mounting surface 101 of the flexible circuit board 10 to which the first electronic component 103 is attached for carrying the flexible circuit board 10. Referring to FIG. 2 and FIG. 3 together, the first embodiment of the present technical solution provides a flexible circuit board laser processing and carrying device 100. The flexible circuit board laser processing carrier 100 can be a copper plate, a nameplate, an iron plate, an alloy plate, an organic composite plate or other high temperature resistant substrate. In this embodiment, the flexible electric circuit board laser processing bearing device 100 is an aluminum plate with a uniform thickness and a flat surface. The flexible circuit board laser processing carrier 100 includes a first surface 110 and an opposite second surface 120. The first surface 110 defines a plurality of first grooves 112 and a plurality of positioning holes 113. The plurality of first recesses 112 are for accommodating a plurality of first electronic component devices 103 mounted on the first mounting surface 101 of the flexible circuit board 10. The number, opening position, shape and size of the first recesses 112 are all corresponding to the first electronic component 103 mounted on the first mounting surface 101 of the flexible circuit board 10. When there is only one first electronic component 103 of the first mounting surface 101 of the flexible circuit board 10, the first recess 112 should also be one. In order to facilitate the pick-and-place of the first electronic component 103, the size of the first recess 112 may be slightly larger than the size of the corresponding first electronic component 103. In this embodiment, since the shape of the first electronic component 103 is a rectangular parallelepiped shape, the first recess 112 is also a rectangular parallelepiped groove, and the first electronic component 103 can be accommodated in the first recess 112. . The plurality of positioning holes 113 pass through the first surface 110 and the second surface 120, and the opening position thereof is not limited. The 1317309 can be opened at any position where the first surface 110 does not coincide with the first groove 112. The plurality of positioning holes 113 may be circular holes, square holes, elliptical holes or other irregularly shaped holes. Of course, the number of the positioning holes 113 may be only one. Preferably, in the embodiment, the plurality of positioning holes 113 are circular holes, and each positioning hole 113 corresponds to each of the first grooves 112 and is adjacent to the corresponding first groove 112. . And the plurality of positioning holes 113 are evenly distributed around the plurality of first grooves 112. When the first recess 112 is one, the plurality of positioning holes 113 may surround the first first recess 112 and be evenly distributed. The second surface 120 defines a second recess 122. The opening position is not limited, and the second surface 120 can be opened at any position on the second surface 120. The second recess 122 can be any shape, such as a circular recess, a square recess, an annular recess, a polygonal recess, and other irregularly shaped recesses. If the second groove 122 corresponds to the position of a certain first groove 112, then the sum of the depth of the second groove 122 and the depth of the first groove 112 corresponding to the position thereof should be less than the flexible circuit. The thickness of the plate laser processing carrier 100, that is, the thickness from the first surface 110 to the second surface 120, such that the first groove 112 and the second groove 122 are not in communication. If the second recess 122 does not directly correspond to the position of the first recess 112, the depth of the second recess 122 should be less than the thickness of the flexible circuit board laser processing carrier 100. In this embodiment, the second recess 122 is a square recess formed in the center of the second surface 120. The plurality of positioning holes 113 penetrating the first surface 110 and the second surface 120 surround the second recess 122. Evenly distributed. When the flexible circuit board laser processing carrier 100 carries the flexible circuit board 10 1317309 10 and is fixed to the laser processing device, the first surface 110 is in contact with the first mounting surface 101 of the loaded flexible circuit board 10, The two surfaces 120 are in contact with a vacuum adsorption station of the laser processing apparatus. The plurality of first electronic components 103 mounted on the first mounting surface 101 of the flexible circuit board 10 can be accommodated in the plurality of first recesses 112 of the first surface 110 to ensure that the flexible circuit board 10 is evenly disposed. fixed. The plurality of positioning holes 113 are configured to allow the vacuum adsorption force of the laser processing table of the laser processing apparatus to pass through the plurality of positioning holes 113, thereby adsorbing the flexible circuit board 10 to be fixed to the laser processing carrier. In this embodiment, the plurality of positioning holes 113 are evenly distributed corresponding to the plurality of first grooves 112, so that the adsorption force can uniformly act on the flexible circuit board 10, further ensuring that the flexible circuit board 10 is uniformly adsorbed and fixed. It also ensures that the flexible circuit board cut by the laser can be well adsorbed and fixed to the workbench. At this time, the air in the second groove 122 of the second surface 120 is evacuated by the vacuum adsorption table, thereby increasing the flexible circuit board laser processing bearing device 100 and the laser processing device vacuum suction φ attached workbench The ground adsorption force, so that the flexible circuit board laser processing bearing device 100 is well fixed to the vacuum table, facilitating laser processing of the flexible circuit board, for example, cutting the flexible circuit board 10 into electronic conformity according to the circuit unit of the flexible circuit board 10. Finished product for product assembly requirements. Referring to FIG. 4, a flexible circuit board laser processing carrying device 200 according to a second embodiment of the present technical solution is provided. It differs from the flexible circuit board laser processing carrier 100 provided in the first embodiment in that the second surface 220 is provided with a plurality of second grooves 222. The plurality of second grooves 222 may be of any shape, such as a circular groove, a rectangular groove, an annular groove, a 11 1317309 polygonal groove, and other irregularly shaped grooves. In this embodiment, the second recess 222 is a plurality of rectangular grooves arranged in parallel. The thickness of the plurality of second grooves 222 may be the same or different, except that the depth of the second groove 222 and the depth of the first groove (not shown) corresponding to the position of the second groove 222 are smaller than the flexible circuit board laser. The thickness of the carrier device 200 is processed such that the first recess and the second recess 222 are out of communication. If the second groove 222 does not correspond to the position of the first groove, the depth of the second groove 222 may be smaller than the thickness of the flexible circuit board laser processing device 200. In the β embodiment, the second groove 222 is a plurality of rectangular grooves arranged in parallel with the same depth, and is not in communication with the first groove. Referring to FIG. 5, a flexible circuit board laser processing carrying device 300 according to a third embodiment of the present technical solution is provided. The difference from the flexible circuit board laser processing device 100 provided by the first embodiment is that the second recess 322 is larger in size on the second surface 320, so that the plurality of positioning holes 313 and the The second grooves 322 are in communication. Of course, depending on the shape of the second recess 322, only one or more of the plurality of positioning holes 313 may be in communication with the second recess 322. Referring to FIG. 6, a flexible circuit board laser processing carrying device 400 according to a fourth embodiment of the present technical solution is provided. The second surface 420 is provided with a plurality of second grooves 422, and the first surface 410 and the second surface are connected to the first surface 410 and the second surface. A plurality of positioning holes 413 of the surface 420 are in communication with the plurality of second grooves 422. Of course, depending on the shape of the second recess 422, only one or more of the plurality of positioning holes 413 may be in communication with one or more of the plurality of 12 1317309 second recesses 422. In this embodiment, the second groove 422 is a plurality of rectangular grooves arranged in parallel, and the plurality of positioning holes 413 are connected to the plurality of second grooves 422, and each of the second grooves 422 is respectively The two positioning holes 413 are in communication. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be equivalently modified or changed in accordance with the spirit of the invention. All should be included in the scope of the following patent application. [Simple description of the drawing] Figure 1 is a schematic diagram of a double-sided mounting flexible circuit board. 2 is a schematic view showing the first surface structure of a flexible circuit board laser processing carrier device according to Embodiment 1 of the present technical solution. FIG. 3 is a schematic structural view of a second surface of a flexible circuit board laser processing carrying device according to Embodiment 1 of the present technical solution. > Fig. 4 is a schematic view showing the second surface structure of the flexible circuit board laser processing carrying device provided in the second embodiment of the present technical solution. Figure 5 is a schematic view showing the second surface structure of the flexible circuit board laser processing carrying device provided in the third embodiment of the present technical solution. Figure 6 is a schematic view showing the second surface structure of the flexible circuit board laser processing carrying device provided in the fourth embodiment of the present technical solution. [Description of main component symbols] Flexible circuit board 10 First mounting surface 101 13 102 1317309 'Second mounting surface first electronic component second electronic component flexible circuit board laser processing carrying device first surface first groove The second surface positioning hole strikes the second groove 103 104 100, 200, 300 ' 400 110, 310, 410 112 120 ' 220 ' 320 ' 420 113 , 313 , 413 122 ' 222 ' 322 ' 422
1414