200930193 九、發明說明： 【發明所屬之技術領域】 '本發明涉及電路板製作技術’尤其涉及一種承載裝置 及利用該裝置進行雙面貼裝電路板製作之方法。 【先前技術】 隨著電子產品往體積小型化、功能多樣化方向之發 展，作為電子產品關鍵部件之一之電路板亦從硬性電路板 〇 ( Rigid Printed Circuit Board, RPCB)、軟性電路板（Flexible Printed Circuit Board, FPCB)往軟硬結合電路板（Rigid and Flexible Printed Circuit Board，RFPCB)方向發展。軟硬結合 電路板係指將硬性電路板與軟性電路板結合於一起，同時 利用硬性電路板之剛性以及軟性電路板之輕薄性與柔性， 以滿足電子產品體積小型化、功能多樣化之發展需求。因 而，近年各種電路板製造技術以及貼裝元件之相關技術， 特別係軟硬結合電路板製造技術以及於軟硬結合電路板貼 ® 裝元件之相關技術得到廣泛之研究，請參見Ganasan，J.R. 等人於 2000 年 1 月發表於 IEEE Transactions on Electronics Packaging Manufacturing，volume: 23，Issue: 1，page:28-31 之文獻 Chip on chip (COC) and chip on board (COB) assembly on flex rigid printed circuit assemblies o 雙面貼裝硬性電路板之製作成型通常採用開槽直接掰 離之方法，即於貼裝元件於硬性電路板之前，首先於硬性 電路板空板之相對兩表面開設相對之V形凹槽，於貼裝元 200930193 件於硬性電路板相對兩表面之後’再利用硬性電路板基板 之脆性沿v形凹槽分離成單個雙面貼裂硬性電路板。而雙 面貼裝軟性電路板由於基板呈柔性，因此雙面貼裝硬性電 路板之製作成型方法並不適用’雙面貼裝軟性電路板之製 作成型通常採用衝型之方法，即直接將雙面貼裝元件之軟 性電路板衝成單個之雙面貼裝軟性電路板。而由於硬性電 路板之基板中常含有玻璃纖維，直接衝型無法將玻璃纖維 衝斷’因此’雙面貼裝軟性電路板之製作成型方法亦不適 ❹用於貼裝元件之硬性電路板之製作方法，當然亦不適用於 貼裝元件之軟硬結合電路板之製作成型。 因此’於目前實際生產中，雙面貼裝軟硬結合電路板 之製作成型之方法主要有兩種。第一種方法，採用成型機 之銑刀首先於軟硬結合電路板空板上製作微連結點，然後 再進行雙面貼裝元件，最後用鐳射沿微連結點切割軟硬結 合電路板，從而獲得單個雙面貼裝軟硬結合電路板。第二 ❹種方法，首先直接於軟硬結合電路板之空板上進行雙面貼 裝元件’然後直接採用成型機之銑刀對雙面貼裝軟硬結合 電路板進行成型，製成單個之雙面貼裝軟硬結合電路板。 可是，第一種製作方法雖然製作精度較高，但製作效率較 低’生產成本較高’不適用量產；而第二種方法雖然製作 效率之到了明顯改善，成本明顯降低，但成型機上之除粉 塵用之毛刷以及成型用之銑刀等直接接觸產品，易損傷電 路板上之貼裝元件，因而會影響雙面貼裝軟硬結合電路板 之生產品質。 200930193 有鑑於此，提供一種承載裝置及利用該裝置進行雙面 貼裝電路板製作之方法，以適用於各種雙面貼裝電路板之 製作成型’有效降低雙面貼裝電路板之製作成本，提高雙 面貼裝電路板之製作效率及品質實屬必要。 【發明内容】 以下將以實施例說明一種承載裝置及利用該裝置進行 雙面貼裝電路板製作之方法。 Ο 該承載裝置，用於承載雙面貼裝電路板，該承載裝置 包括第一避位裝置及第二避位裝置，該第一避位裝置開設 有複數第一凹槽並設有複數第一鎖固結構，該第二避位裝 置開設有複數第二凹槽並設有複數與第一鎖固結構相對應 之第二鎖固結構’該第一避位裝置與第二避位裝置相對扣 合，通過第一凹槽與第二凹槽之配合以及第一鎖固結構與 第二鎖固結構之配合鎖固，用以將雙面貼裝電路板固定於 〇 第—避位裝置與第二避位裝置之間。 該雙面貼裝軟硬結合電路板之製作方法’其包括以下 步驟.提供待雙面貼裝之電路板，其包括第一貼裝面及與 第一貼裝面相對之第二貼裝面；於第一貼裝面與第二貼裝 面分別貼裝第一元件與第二元件，從而形成雙面貼裝電路 板，將雙面貼襞電路板放置於第一避位裝置與第二避位裝 置之間，使該第一避位裝置與第二避位裝置相對扣合，通 一避位裝置之第一鎖固結構與第二避位裝置之第二鎖 固結構之配合鎖固；將相對扣合鎖固之第一避位裝置及第 200930193 二避位裝置固定於成型機，利用成型機將雙面貼裝電路板 成型。 本技術方案之承載裝置及利用該裝置進行雙面貼裝電 路板製作之方法具有如下優點：該承載裝置利用第一避位 裝置及與第一避位裝置相配合之第二避位裝置，使得雙面 貼裝電路板可平整固定，能有效提高雙面貼裝電路板製作 成型精度，並能有效保護貼裝於電路板之貼裝元件，防止 貼裝元件損壞。 【實施方式】 下面將結合附圖及實施例，對本技術方案提供之承載 裝置及利用該裝置進行雙面貼裝電路板製作之方法作進一 步之詳細說明。 以下將以軟硬結合電路板空板製作成為雙面貼裝軟硬 結合電路板為例，對本技術方案提供之承載裝置進行說 明。當然，本技術方案提供之承載裝置及利用該承載裝置 進行雙面貼裝電路板之製作方法亦適用於例如硬性電路 板、軟性電路板等其他類型電路板之製作成型。 請一併參閱圖1及圖2,本實施例提供一已經完成導電 線路製作之待雙面貼裝元件之軟硬結合電路板10,其包括 相對之第一貼裝面101與第二貼裝面102。該軟硬結合電路 板10包括兩個軟硬結合電路板單元11，每個軟硬結合電路 板單元11均可成型為單個軟硬結合電路板產品。當然，該 軟硬結合電路板10亦可包括更多個軟硬結合電路板單元 200930193 . 11。軟硬結合電路板10還開設有固定孔103，以便後續製 作成型固定，本實施例中，四個固定孔103開設於軟硬結 合電路板10之四角處。 軟硬結合電路板10之每個軟硬結合電路板單元11可 於相對之第一貼裝面101與第二貼裝面102分別貼裝第一 元件12與第二元件13，使軟硬結合電路板10成為雙面貼 裝軟硬結合電路板10a。如圖2所示，每個雙面貼裝軟硬結 合電路板10a包括兩個雙面貼裝軟硬結合電路板單元11a， ® 從而使得每個軟硬結合電路板單元11a可成型為單個之雙 面貼裝軟硬結合電路板產品。當然，第一元件12與第二元 件13之數量、形狀及尺寸可相同亦可不相同。每個軟硬結 合電路板單元11貼裝之第一元件12及第二元件13之數 量、形狀及尺寸可相同亦可不相同。為了便於實際生產中 大量生產，本實施例中，每個軟硬結合電路板單元11貼裝 之第一元件12與第二元件13之數量、形狀及尺寸相同。 ❹貼裝於第一貼裝面101之第一元件12與貼裝於第二貼裝面 102之第二元件13數量、形狀及尺寸不相同。 請參閱圖3及圖4,其為本實施例提供之承載裝置20， 其用於承載該雙面貼裝軟硬結合電路板10a進行製作。該 承載裝置20包括第一避位裝置21、與第一避位裝置21相 配合之第二避位裝置22。 該第一避位裝置21之形狀可根據實際需要設計。本實 施例中，該第一避位裝置21呈長方形，其具有第一表面211 及與第一表面211相對之第二表面212。自第一表面211向 11 200930193 第一避位裝置21内部開設有複數第一凹槽213並設有複數 第一鎖固結構214。自第二表面212向第一避位裝置21内 部開設有複數定位結構215。 該複數第一凹槽213用於容置貼裝於軟硬結合電路板 10之第一貼裝面101之複數第一元件12。該第一凹槽213 之數量、開設位置、形狀及尺寸均與複數第一元件12相對 應。為了便於取放第一元件12,該第一凹槽213之尺寸可 比對應之第一元件12之尺寸略大。本實施例中，由於第一 〇 元件12之形狀為長方體形，所以該第一凹槽213亦為長方 體形凹槽，第一元件12可恰好容置於該第一凹槽213中。 該複數第一鎖固結構214,用於將與第一避位裝置21 配合之第二避位裝置22鎖固於第一避位裝置21。該複數第 一鎖固結構214其開設位置並無限定，其可開設於第一表 面211不與第一凹槽213重合之任何位置。本實施例中， 採用定位銷型之固定件23將第一避位裝置21及第二避位 Ο 裝置鎖固於一起，因此，第一鎖固結構214為與軟硬結合 電路板10之固定孔103及固定件23相配合之孔結構，其 可貫通第一表面211及第二表面212亦可不貫通第一表面 211及第二表面212之孔，優選為不貫通第一表面211及第 二表面212之孔。該複數第一鎖固結構214可為圓形孔， 方形孔，橢圓形孔或其他不規則形狀孔。優選地，如本實 施例中，第一避位裝置21分別開設了四個作為第一鎖固結 構214之圓形孔，四個第一鎖固結構214分別開設於長方 形第一避位裝置21之四角處，並與軟硬結合電路板10之 12 200930193 固定孔103對應。當然，根據第一避位裝置21及第二避位 裝置22配合鎖固之方式不同，第一鎖固結構214亦可為其 他結構。 該複數定位結構215，用於將第一避位裝置21固定於 成型機，由於該定位結構215通常與成型機台之定位銷配 合，因此複數定位結構215可為貫通第一表面211及第二 表面212亦可為不貫通第一表面211及第二表面212之孔 結構，優選為不貫通第一表面211及第二表面212之孔結 〇 構，如此，成型之定位銷不會插入定位結構215中從第一 表面211凸出而將放置於第一表面211之電路板頂起。該 複數定位結構215之開設位置並無限定，其可開設於第二 表面212不與第一凹槽213及第一鎖固結構213相通之任 何位置。優選地，如本實施例中，第一避位裝置21分別開 設了四個作為定位結構215之圓形孔，複數定位結構215 開設於第一避位裝置21中央處呈四角分佈。 Ο 該第二避位裝置22與第一避位裝置21之形狀大小相 匹配，亦呈長方形，第二避位裝置22具有第三表面221及 與第三表面221相對之第四表面222。自第三表面221向第 二避位裝置22内部開設有複數第二凹槽223並設有複數第 二鎖固結構224。 該複數第二凹槽223用於容置貼裝於軟硬結合電路板 10之第二貼裝面102之複數第二元件13。該第二凹槽223 之數量、開設位置、形狀及尺寸均與複數第二元件13相對 應。為了便於取放第二元件13,該第二凹槽223之尺寸可 13 200930193 比對應之第二元件13之尺寸略大。本實施例中，由於第二 元件13之形狀為長方體形，所以該第二凹槽223亦為長方 體形凹槽，以使第二元件13可恰好容置於該第二凹槽223 中〇 該複數第二鎖固結構224,用於與複數第一鎖固結構 214配合，以將與第一避位裝置21與第二避位裝置22進行 配合鎖固。該複數第二鎖固結構224其開設位置並無限定， 其可開設於第三表面221不與第二凹槽223重合之任何位 〇 置。因為本實施例中，採用定位銷型之固定件23將第一避 位裝置21及第二避位裝置鎖固於一起，因此，第二鎖固結 構224為與第一鎖固結構214及固定件23配合之通孔結 構，其貫通第三表面221及第四表面222孔。該複數第二 鎖固結構224可為圓形孔，方形孔，橢圓形孔或其他不規 則形狀孔。當然，根據第一避位裝置21及第二避位裝置22 配合鎖固之方式不同，第二鎖固結構214同樣亦可為與第 一鎖固結構配合之其他結構。 該第一避位裝置21與第二避為裝置22相互配合鎖 固，可將雙面貼裝軟硬結合電路板l〇a固定於第一避位裝 置21及第二避為裝置22之間進行製作成型。具體地，第 一避位裝置21之第一表面211及第二避位裝置22之第三 表面221相對扣合，使得第一避位裝置21及第二避為裝置 22通過第一鎖固裝置214及第二鎖固裝置224相互配合鎖 固。 利用本技術方案提供之承載裝置20承載雙面貼裝軟硬 200930193 結合電路板10a進行製作之方法包括以下步驟。 第一步，提供軟硬結合電路板10。 提供軟硬結合電路板10,如前其為一已經完成導電線 路製作之待雙面貼裝元件之軟硬結合電路板10,其包括相 對之第一貼裝面101與第二貼裝面102。該軟硬結合電路板 10包括兩個軟硬結合電路板單元11，每個軟硬結合電路板 單元11均可成型為單個之軟硬結合電路板產品。 第二步，於第一貼裝面101及第二貼裝面102分別貼 〇 裝第一元件12及第二元件13，從而形成雙面貼裝電路板 10a ° 本實施例中，首先，於軟硬結合電路板10之第一貼裝 面101貼裝第一元件12。 請參閱圖5,於軟硬結合電路板10之每個軟硬結合電 路板單元11之第一貼裝面101貼裝第一元件12,該貼裝過 程可於表面貼裝機上自動完成。 Ο 其次，將貼裝有第一元件12之軟硬結合電路板10放 置於第一避位裝置21，再於軟硬結合電路板10之第二貼 裝面102貼裝第二元件13，從而形成雙面貼裝軟硬結合電 路板10a。 請結合參閱圖4及圖6,將貼裝有第一元件12之軟硬 結合電路板10放置於第一避位裝置21，使得第一元件12 對應之位於第一凹槽213中。此時，第一避位裝置21作為 承載裝置，承載貼裝有第一元件12之軟硬結合電路板10 進行貼裝第二元件13於第二貼裝面102之步驟，該貼裝過 15 200930193 程可於表面貼裝機上自動完成。完成貼裝後即形成雙面貼 裝軟硬結合電路板10a，其包括兩個雙面貼裝軟硬結合電路 板單元11 a。 第三步，將雙面貼裝電路板l〇a放置於第一避位裝置 21與第二避位裝置22之間。 本實施例中，請結合參閱圖4及圖7，將第二避位裝置 22之第三表面221與第一避位裝置21之第一表面211相 對，並將第二避位裝置22放置於雙面貼裝軟硬結合電路板 〇 l〇a，使得雙面貼裝軟硬結合電路板10a之第二元件13位 於第二凹槽中。利用固定件23,插入配合之第一鎖固結構 214、固定孔103及第二鎖固結構224進行鎖固，使相對扣 合之第二避位裝置22與第一避位裝置21配合固定。此時， 雙面貼裝軟硬結合電路板10a固定於第一避位裝置21及第 二避為裝置22之間。 第四步，利用成型機30將雙面貼裝軟硬結合電路板單 ^ 元11a成型成單個之雙面貼裝軟硬結合電路板產品。 〇 請參閱圖8,將配合鎖固之第一避位裝置21及第二避 為裝置22放置於成型機30之機台31，對固定於第一避位 裝置21及第二避位裝置22之間之雙面貼裝軟硬結合電路 板單元11a進行成型加工。首先，使得機台31之定位銷301 插入第一避位裝置21之定位結構215，使得配合鎖固之第 一避位裝置21及第二避為裝置22固定於機台31。其次， 利用成型機30之銑刀302沿每個雙面貼裝軟硬結合電路板 單元11a之邊緣進行銑切成型，銑切成型過程中，銑刀302 16 200930193 會直接銑切第一避位裝置21、雙面貼裝軟硬結合電路板10a 及第二避位裝置22,從而成型出單個之雙面貼裝軟硬結合 電路板產品。銑切完畢後，取出雙面貼裝軟硬結合電路板 產品即可。第一元件12及第二元件13受到第一避位裝置 21及第二避位裝置22之保護，銑刀302以及其他成型機 30之部件不會接觸到第一元件12及第二元件13，能有效 提高雙面貼裝電路板製作成型精度，能有效保護第一元件 12及第二元件13,防止第一元件12及第二元件13之損壞。 〇 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本技術方案實施方式提供之軟硬結合電路板之 0俯視圖。 圖2係本技術方案實施方式圖1中之軟硬結合電路板 雙面貼裝元件之侧視圖。 圖3係本技術方案實施方式提供之承載裝置之立體示 意圖。 圖4係本技術方案實施方式圖3中之承載裝置之剖視 圖。 圖5係本技術方案實施方式圖1中之軟硬結合電路板 於第一貼裝面貼裝第一元件之示意圖。 17 200930193 圖6係本技術方案實施方式圖1中之軟硬結合電路板 於第一貼裝面貼裝第一元件後置於第一避位裝置進行貼裝 第二元件於第二貼裝表面之示意圖。 圖7係本技術方案實施方式提供之雙面貼裝電路板位 於第一避位裝置及第二避位裝置之間之示意圖。 圖8本技術方案實施方式提供之成型機成型雙面貼裝 電路板之示意圖。200930193 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a circuit board manufacturing technology, and more particularly to a carrying device and a method for manufacturing a double-sided mounting circuit board using the same. [Prior Art] With the development of electronic products in the direction of miniaturization and diversification of functions, the circuit board, which is one of the key components of electronic products, is also from Rigid Printed Circuit Board (RPCB) and flexible circuit board (Flexible). Printed Circuit Board, FPCB) is moving toward the Rigid and Flexible Printed Circuit Board (RFPCB). The combination of a hard and a hard circuit board refers to the combination of a rigid circuit board and a flexible circuit board, and utilizes the rigidity of the rigid circuit board and the thinness and flexibility of the flexible circuit board to meet the development requirements of miniaturization and diversification of electronic products. . Therefore, in recent years, various circuit board manufacturing technologies and related technologies of mounting components, especially the combination of soft and hard circuit board manufacturing technology and related technologies for hard and soft board bonding and mounting components, have been extensively studied. Please refer to Ganasan, JR, etc. Chip on chip (COC) and chip on board (COB) assembly on flex rigid printed circuit assemblies published in January 2000 in IEEE Transactions on Electronics Packaging Manufacturing, volume: 23, Issue: 1, page: 28-31 o Double-sided mounting rigid circuit board is usually formed by slotting directly, that is, before mounting the component on the rigid circuit board, firstly, the opposite V-shaped groove is formed on the opposite surfaces of the rigid board empty board. After the mounting of the element 200930193 on the opposite surfaces of the rigid circuit board, the brittleness of the rigid circuit board substrate is separated into a single double-sided cracked rigid circuit board along the v-shaped groove. The double-sided mounting flexible circuit board is flexible because of the substrate, so the manufacturing method of the double-sided mounting rigid circuit board is not suitable for the manufacturing process of the double-sided mounting flexible circuit board, which is usually formed by a punching method, that is, directly The flexible circuit board of the surface mount component is punched into a single double-sided mounting flexible circuit board. Since the substrate of the rigid circuit board often contains glass fiber, the direct punching type cannot break the glass fiber. Therefore, the manufacturing method of the double-sided mounting flexible circuit board is not suitable for the manufacturing method of the rigid circuit board for mounting components. Of course, it is not suitable for the fabrication of soft and hard bonded circuit boards for mounting components. Therefore, in the current actual production, there are mainly two methods for manufacturing the double-sided mounting soft and hard circuit board. In the first method, the milling cutter of the molding machine firstly forms a micro-joining point on the empty board of the soft-hard combined circuit board, and then performs the double-sided mounting component, and finally cuts the soft and hard combined circuit board along the micro-joining point by laser, thereby Get a single double-sided mount hard and soft combination board. The second method is to directly perform the double-sided mounting component directly on the empty board of the soft and hard circuit board, and then directly form the double-sided mounting soft and hard bonding circuit board by using the milling cutter of the molding machine to form a single one. Double-sided mounting of hard and soft board. However, although the first production method has higher precision, the production efficiency is lower, and the production cost is higher, which is not suitable for mass production. The second method, although the production efficiency is significantly improved, the cost is significantly reduced, but on the molding machine. The direct contact between the dust removing brush and the milling cutter for forming is easy to damage the mounting components on the circuit board, thereby affecting the production quality of the double-sided mounting soft and hard combined circuit board. In view of the above, there is provided a carrying device and a method for manufacturing a double-sided mounting circuit board by using the device, which is suitable for manufacturing various double-sided mounting circuit boards, thereby effectively reducing the manufacturing cost of the double-sided mounting circuit board. It is necessary to improve the production efficiency and quality of the double-sided printed circuit board. SUMMARY OF THE INVENTION Hereinafter, a carrying device and a method of manufacturing a double-sided mounting circuit board using the same will be described by way of embodiments. The carrying device is configured to carry a double-sided mounting circuit board, the carrying device includes a first avoiding device and a second avoiding device, wherein the first avoiding device is provided with a plurality of first grooves and is provided with a plurality of first a locking structure, the second avoiding device is provided with a plurality of second recesses and is provided with a plurality of second locking structures corresponding to the first locking structure. The first avoiding device and the second avoiding device are oppositely buckled And the locking of the first recess and the second recess and the locking of the first locking structure and the second locking structure for fixing the double-sided mounting circuit board to the first-level avoidance device and the first Between two avoidance devices. The manufacturing method of the double-sided mounting soft-hardened circuit board includes the following steps: providing a circuit board to be mounted on both sides, comprising a first mounting surface and a second mounting surface opposite to the first mounting surface And mounting the first component and the second component on the first mounting surface and the second mounting surface respectively, thereby forming a double-sided mounting circuit board, and placing the double-sided mounting circuit board on the first avoidance device and the second component Between the avoiding devices, the first avoiding device and the second avoiding device are relatively fastened, and the first locking structure of the first avoiding device is locked with the second locking structure of the second avoiding device. The first avoidance device and the 200930193 second avoidance device are fixed to the molding machine, and the double-sided mounting circuit board is formed by the molding machine. The carrying device of the technical solution and the method for manufacturing the double-sided mounting circuit board by using the device have the following advantages: the carrying device utilizes the first avoiding device and the second avoiding device matched with the first avoiding device, so that The double-sided mounting circuit board can be flat and fixed, can effectively improve the forming precision of the double-sided mounting circuit board, and can effectively protect the mounting components mounted on the circuit board and prevent damage of the mounting components. [Embodiment] Hereinafter, a bearing device provided by the present technical solution and a method for manufacturing a double-sided mounting circuit board using the same will be further described in detail with reference to the accompanying drawings and embodiments. In the following, the carrier device provided by the present technical solution will be described by taking a soft-hardened circuit board blank board as a double-sided mounting soft and hard combined circuit board as an example. Of course, the carrying device provided by the technical solution and the manufacturing method of the double-sided mounting circuit board using the same are also applicable to the fabrication of other types of circuit boards such as a rigid circuit board and a flexible circuit board. Referring to FIG. 1 and FIG. 2 together, the embodiment provides a soft and hard bonding circuit board 10 for a double-sided mounting component that has completed the fabrication of a conductive line, and includes a first mounting surface 101 and a second mounting surface. Face 102. The hard and soft bonded circuit board 10 includes two hard and soft bonded circuit board units 11, each of which can be formed as a single hard and hard bonded circuit board product. Of course, the hard and soft combination circuit board 10 can also include more flexible and hard circuit board units 200930193. The hard and soft circuit board 10 is further provided with fixing holes 103 for subsequent molding and fixing. In the embodiment, the four fixing holes 103 are formed at the four corners of the hard and soft bonding circuit board 10. Each of the soft and hard circuit board units 11 of the hard and soft circuit board 10 can respectively mount the first component 12 and the second component 13 opposite to the first mounting surface 101 and the second mounting surface 102 to make a soft and hard combination. The circuit board 10 becomes a double-sided mounting soft-hardened circuit board 10a. As shown in FIG. 2, each of the double-sided mounting soft and hard bonding circuit boards 10a includes two double-sided mounting soft and hard bonding circuit board units 11a, so that each of the hard and soft bonding circuit board units 11a can be formed into a single one. Double-sided mounting of hard and soft board products. Of course, the number, shape and size of the first component 12 and the second component 13 may be the same or different. The number, shape and size of the first component 12 and the second component 13 to which each of the soft and hard circuit board units 11 are mounted may be the same or different. In order to facilitate mass production in actual production, in this embodiment, the number, shape and size of the first component 12 and the second component 13 which are attached to each of the soft and hard circuit board units 11 are the same. The number, shape and size of the first component 12 mounted on the first mounting surface 101 and the second component 13 mounted on the second mounting surface 102 are different. Please refer to FIG. 3 and FIG. 4 , which are the carrying device 20 provided in the embodiment for carrying the double-sided mounting soft and hard circuit board 10 a. The carrier device 20 includes a first avoidance device 21 and a second avoidance device 22 that cooperates with the first avoidance device 21. The shape of the first avoidance device 21 can be designed according to actual needs. In this embodiment, the first avoidance device 21 has a rectangular shape and has a first surface 211 and a second surface 212 opposite to the first surface 211. A plurality of first recesses 213 are defined in the first avoidance device 21 from the first surface 211 to the 11 200930193 and a plurality of first lock structures 214 are disposed. A plurality of positioning structures 215 are opened from the second surface 212 to the inside of the first escaping device 21. The plurality of first recesses 213 are for receiving the plurality of first elements 12 mounted on the first mounting surface 101 of the hard and soft circuit board 10. The number, opening position, shape and size of the first recesses 213 correspond to the plurality of first elements 12. In order to facilitate the pick-and-place of the first component 12, the first recess 213 may be slightly larger in size than the corresponding first component 12. In this embodiment, since the first 元件 element 12 has a rectangular parallelepiped shape, the first recess 213 is also a rectangular recess, and the first component 12 can be received in the first recess 213. The plurality of first locking structures 214 are configured to lock the second avoiding device 22 that cooperates with the first avoiding device 21 to the first avoiding device 21. The first locking structure 214 is not limited in its opening position, and can be opened at any position where the first surface 211 does not coincide with the first recess 213. In this embodiment, the first escaping device 21 and the second escaping device are locked together by the positioning pin type fixing member 23. Therefore, the first locking structure 214 is fixed to the soft and hard circuit board 10. The hole structure 103 and the fixing member 23 are matched to each other, and the first surface 211 and the second surface 212 may not penetrate the holes of the first surface 211 and the second surface 212, and preferably do not penetrate the first surface 211 and the second surface. Hole in surface 212. The plurality of first locking structures 214 can be circular holes, square holes, elliptical holes or other irregularly shaped holes. Preferably, in the embodiment, the first escaping device 21 defines four circular holes as the first locking structure 214, and the four first locking structures 214 are respectively opened on the rectangular first escaping device 21 At the four corners, it corresponds to the 12303030 fixing hole 103 of the hard and soft circuit board 10. Of course, depending on the manner in which the first avoidance device 21 and the second avoidance device 22 are locked together, the first locking structure 214 may have other structures. The plurality of positioning structures 215 are configured to fix the first escaping device 21 to the molding machine. Since the positioning structure 215 is generally matched with the positioning pin of the molding machine, the plurality of positioning structures 215 can be through the first surface 211 and the second. The surface 212 may also be a hole structure that does not penetrate the first surface 211 and the second surface 212, and preferably has a hole structure that does not penetrate the first surface 211 and the second surface 212. Thus, the formed positioning pin is not inserted into the positioning structure. The 215 protrudes from the first surface 211 to jack up the circuit board placed on the first surface 211. The position of the plurality of positioning structures 215 is not limited, and may be opened at any position where the second surface 212 does not communicate with the first recess 213 and the first locking structure 213. Preferably, in the present embodiment, the first escaping device 21 has four circular holes as positioning structures 215, and the plurality of positioning structures 215 are disposed at the center of the first escaping device 21 at a four-corner distribution. The second avoiding device 22 is matched in shape and size to the first avoiding device 21, and has a rectangular shape. The second avoiding device 22 has a third surface 221 and a fourth surface 222 opposite to the third surface 221. A plurality of second grooves 223 are opened from the third surface 221 to the inside of the second avoiding device 22, and a plurality of second locking structures 224 are provided. The plurality of second recesses 223 are for receiving the plurality of second elements 13 mounted on the second mounting surface 102 of the hard and soft circuit board 10. The number, opening position, shape and size of the second recesses 223 correspond to the plurality of second elements 13. In order to facilitate the pick-and-place of the second component 13, the size of the second recess 223 can be slightly larger than the size of the corresponding second component 13 by 200930193. In this embodiment, since the shape of the second component 13 is a rectangular parallelepiped shape, the second recess 223 is also a rectangular parallelepiped groove, so that the second component 13 can be properly received in the second recess 223. The plurality of second locking structures 224 are configured to cooperate with the plurality of first locking structures 214 to cooperate with the first avoiding device 21 and the second avoiding device 22 to lock. The second second locking structure 224 is not limited in its opening position, and can be opened at any position where the third surface 221 does not coincide with the second recess 223. In this embodiment, the first locking device 21 and the second avoiding device are locked together by the fixing pin 23 of the positioning pin type. Therefore, the second locking structure 224 is fixed to the first locking structure 214 and fixed. The through hole structure of the piece 23 is matched to the third surface 221 and the fourth surface 222 hole. The plurality of second locking structures 224 can be circular holes, square holes, elliptical holes or other irregularly shaped holes. Of course, depending on the manner in which the first avoidance device 21 and the second avoidance device 22 are locked together, the second locking structure 214 can also be other structures that cooperate with the first locking structure. The first avoiding device 21 and the second avoiding device 22 are interlocked with each other, and the double-sided mounting soft and hard circuit board 10a can be fixed between the first avoiding device 21 and the second avoiding device 22 Make molding. Specifically, the first surface 211 of the first avoidance device 21 and the third surface 221 of the second avoidance device 22 are relatively engaged, so that the first avoidance device 21 and the second avoidance device 22 pass the first locking device. The 214 and the second locking device 224 are interlocked with each other. The carrying device 20 provided by the technical solution carries the double-sided mounting soft and hard 200930193 The method for manufacturing the combined circuit board 10a includes the following steps. In the first step, a hard and soft combined circuit board 10 is provided. A soft-hardened circuit board 10 is provided, which is a soft-hardened circuit board 10 to be double-sidedly mounted on a conductive line, and includes a first mounting surface 101 and a second mounting surface 102. . The hard and soft bonded circuit board 10 includes two hard and soft bonded circuit board units 11, and each of the hard and soft combined circuit board units 11 can be formed into a single hard and hard bonded circuit board product. In the second step, the first component 12 and the second component 13 are respectively mounted on the first mounting surface 101 and the second mounting surface 102 to form a double-sided mounting circuit board 10a. In this embodiment, first, The first mounting surface 101 of the hard and soft combination circuit board 10 mounts the first component 12. Referring to FIG. 5, the first component 12 is mounted on the first mounting surface 101 of each of the flexible and hard-bonding circuit board units 11 of the hard and soft circuit board 10. The mounting process can be automatically performed on the surface mounter. Ο Next, the soft and hard circuit board 10 to which the first component 12 is attached is placed on the first avoidance device 21, and then the second component 13 is placed on the second mounting surface 102 of the hard and soft circuit board 10, thereby A double-sided mounting soft and hard bonding circuit board 10a is formed. Referring to FIG. 4 and FIG. 6, the soft and hard bonding circuit board 10 on which the first component 12 is attached is placed on the first avoidance device 21 such that the first component 12 is correspondingly located in the first recess 213. At this time, the first escaping device 21 serves as a carrying device, and carries the step of mounting the second component 13 on the second mounting surface 102 by carrying the soft-hardened circuit board 10 on which the first component 12 is mounted. 200930193 Cheng can be completed automatically on the surface mounter. Upon completion of the mounting, a double-sided mounting soft and hard bonded circuit board 10a is formed which includes two double-sided mounting soft and hard bonded circuit board units 11a. In the third step, the double-sided mounting circuit board 10a is placed between the first avoidance device 21 and the second avoidance device 22. In this embodiment, referring to FIG. 4 and FIG. 7 , the third surface 221 of the second avoidance device 22 is opposite to the first surface 211 of the first avoidance device 21 , and the second avoidance device 22 is placed on The double-sided mounting soft and hard bonding circuit board 〇l〇a causes the second component 13 of the double-sided mounting soft-hard bonding circuit board 10a to be located in the second recess. The first locking structure 214, the fixing hole 103 and the second locking structure 224 are inserted and fixed by the fixing member 23, and the second fastening device 22 that is relatively engaged is fixedly coupled with the first avoiding device 21. At this time, the double-sided mounting soft-hard bonding board 10a is fixed between the first avoiding device 21 and the second avoiding device 22. In the fourth step, the double-sided mounting soft and hard circuit board unit 11a is formed into a single double-sided mounting soft and hard circuit board product by the molding machine 30. Referring to FIG. 8 , the first avoidance device 21 and the second avoidance device 22 that are locked together are placed on the machine table 31 of the molding machine 30 , and are fixed to the first avoidance device 21 and the second avoidance device 22 . The double-sided mounting soft-hardened circuit board unit 11a is formed between the two sides. First, the positioning pin 301 of the machine table 31 is inserted into the positioning structure 215 of the first escaping device 21, so that the first escaping device 21 and the second escaping device 22 that are engaged with the locking are fixed to the machine table 31. Next, the milling cutter 302 of the molding machine 30 is used for milling along the edge of each of the double-sided mounting soft and hard circuit board units 11a. During the milling and forming process, the milling cutter 302 16 200930193 directly mills the first The avoidance device 21, the double-sided mounting soft and hard bonding circuit board 10a and the second avoidance device 22, thereby forming a single double-sided mounting soft and hard bonding circuit board product. After the milling is completed, remove the double-sided mounting soft and hard board product. The first component 12 and the second component 13 are protected by the first avoidance device 21 and the second avoidance device 22, and the components of the milling cutter 302 and other molding machines 30 do not contact the first component 12 and the second component 13, The forming precision of the double-sided mounting circuit board can be effectively improved, and the first component 12 and the second component 13 can be effectively protected to prevent damage of the first component 12 and the second component 13.综 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application in accordance with the law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top plan view of a soft-hardened circuit board provided by an embodiment of the present technical solution. 2 is a side view of the double-sided mounting component of the soft-hardened circuit board of FIG. 1 in the embodiment of the present technical solution. Figure 3 is a perspective view of a carrier device provided by an embodiment of the present technical solution. Figure 4 is a cross-sectional view of the carrier device of Figure 3 in accordance with an embodiment of the present technology. FIG. 5 is a schematic view showing the first component mounted on the first mounting surface of the soft-hardened circuit board of FIG. 1 according to the embodiment of the present invention. 17 200930193 FIG. 6 is an embodiment of the present technical solution. The soft and hard bonded circuit board of FIG. 1 is placed on the first mounting surface and placed on the first escaping device to mount the second component on the second mounting surface. Schematic diagram. FIG. 7 is a schematic diagram of a double-sided mounting circuit board provided by an embodiment of the present technical solution between a first avoidance device and a second avoidance device. Fig. 8 is a schematic view showing a molding machine double-sided mounting circuit board provided by an embodiment of the present invention.
【主要元件符號說明】 10 10a 11 11a 101 102 12 13 103 軟硬結合電路板 雙面貼裝軟硬結合電路板 軟硬結合電路板單元 雙面貼裝軟硬結合電路板單元 第一貼裝面 第二貼裝面 第一元件 第二元件 固定孔 承載裝置 20 第一避位裝置 21 第二避位裝置 22 固定件 23 第一表面 211 第二表面 212 18 200930193 第一凹槽 213 第一鎖固結構 214 定位結構 215 第三表面 221 第四表面 222 第二凹槽 223 第二鎖固結構 224 成型機 30 〇機台 31 定位銷 301 銑刀 302 〇 19[Main component symbol description] 10 10a 11 11a 101 102 12 13 103 Soft and hard combined circuit board double-sided mounting soft and hard combined circuit board soft and hard combined circuit board unit double-sided mounting soft and hard combined circuit board unit first mounting surface Second mounting surface first component second component fixing hole carrying device 20 first avoiding device 21 second avoiding device 22 fixing member 23 first surface 211 second surface 212 18 200930193 first groove 213 first locking Structure 214 Positioning Structure 215 Third Surface 221 Fourth Surface 222 Second Groove 223 Second Locking Structure 224 Forming Machine 30 Machine Table 31 Locating Pin 301 Milling Cutter 302 〇19