CN110153529B

CN110153529B - Jig assembly

Info

Publication number: CN110153529B
Application number: CN201910501251.0A
Authority: CN
Inventors: 梁大定; 周萍
Original assignee: Oppo Chongqing Intelligent Technology Co Ltd
Current assignee: Oppo Chongqing Intelligent Technology Co Ltd
Priority date: 2019-06-11
Filing date: 2019-06-11
Publication date: 2021-06-01
Anticipated expiration: 2039-06-11
Also published as: CN110153529A

Abstract

The application provides a tool subassembly, this tool subassembly includes paster tool, pressfitting tool, and pressfitting tool can dismantle with the paster tool and be connected. The surface mounting jig comprises a support plate and a pressing plate, wherein the support plate is provided with a bearing area, the bearing area is used for bearing the flexible circuit board and treating a welding piece, the pressing plate is provided with a through hole corresponding to the bearing area, and the pressing plate is used for pressing the flexible circuit board on the support plate and exposing the welding piece through the through hole. The pressing fixture comprises a support and a pressing piece corresponding to the through hole, the pressing piece is movably connected with the support, and when the support is arranged on the pressing plate, the pressing piece is used for pressing the to-be-welded piece on the support plate, so that the to-be-welded piece and the flexible circuit board are relatively fixed. Through the mode of respectively fixing the flexible circuit board and the part to be welded, the part to be welded and the flexible circuit board are relatively fixed, and the relative positions of the part to be welded and the flexible circuit board meet the assembly requirements of a welding process, so that the part to be welded and the flexible circuit board are welded together in a reflow soldering mode and the like.

Description

Jig assembly

Technical Field

The application relates to the technical field of electronic equipment, in particular to a jig assembly.

Background

As electronic devices (e.g., mobile phones, tablet computers, etc.) are becoming larger and thinner, the layout of electronic components is becoming more and more compact, and Flexible Printed Circuits (FPCs) are widely used in electronic devices due to their features of high wiring density, light weight, thin thickness, good flexibility, etc., so as to realize the electrical connection between electronic components.

Disclosure of Invention

The embodiment of the application provides a tool subassembly, wherein, this tool subassembly includes:

the chip mounting jig comprises a support plate and a pressing plate, wherein the support plate is provided with a bearing area, the bearing area is used for bearing the flexible circuit board and the piece to be welded, the pressing plate is provided with a through hole corresponding to the bearing area, and the pressing plate is used for pressing the flexible circuit board on the support plate and exposing the piece to be welded through the through hole;

the pressing fixture is detachably connected with the surface mounting fixture and comprises a support and a pressing piece corresponding to the through hole, the pressing piece is movably connected with the support, and when the support is arranged on the pressing plate, the pressing piece is used for pressing the to-be-welded piece on the support plate, so that the to-be-welded piece and the flexible circuit board are relatively fixed.

The beneficial effect of this application is: the application provides a tool subassembly includes paster tool, pressfitting tool, and pressfitting tool can be dismantled with the paster tool and be connected. The surface mounting jig comprises a support plate and a pressing plate, wherein the support plate is provided with a bearing area, the bearing area is used for bearing the flexible circuit board and treating a welding piece, the pressing plate is provided with a through hole corresponding to the bearing area, and the pressing plate is used for pressing the flexible circuit board on the support plate and exposing the welding piece through the through hole. The pressing fixture comprises a support and a pressing piece corresponding to the through hole, the pressing piece is movably connected with the support, and when the support is arranged on the pressing plate, the pressing piece is used for pressing the to-be-welded piece on the support plate, so that the to-be-welded piece and the flexible circuit board are relatively fixed. Through the mode of respectively fixing the flexible circuit board and the part to be welded, the part to be welded and the flexible circuit board are relatively fixed, and the relative positions of the part to be welded and the flexible circuit board meet the assembly requirements of a welding process, so that the part to be welded and the flexible circuit board are welded together in a reflow soldering mode and the like.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic cross-sectional structure diagram of a jig assembly according to a first embodiment of the present disclosure;

FIG. 2 is a schematic side view of the USB socket of the present application after being soldered to a flexible circuit board;

FIG. 3 is a schematic diagram of a top view of the USB socket of FIG. 2 after soldering with a flexible circuit board;

fig. 4 is a schematic top view of the carrier board in fig. 1;

FIG. 5 is a schematic top view of the platen of FIG. 1;

FIG. 6 is a schematic top view of the bakelite base of FIG. 1;

fig. 7 is a schematic top view of the pressing fixture in fig. 1;

FIG. 8 is a schematic top view of the bracket of FIG. 7;

FIG. 9 is a schematic side view of the fastener of FIG. 7;

fig. 10 is a schematic top view of a jig assembly according to a second embodiment of the present disclosure;

fig. 11 is a schematic top view of a jig assembly according to a third embodiment of the present disclosure.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The inventors of the present application have found, through long-term research: although the flexible circuit board is widely used in electronic devices due to its characteristics of high wiring density, light weight, thin thickness, good flexibility, etc., to realize electrical connection between electronic components; however, the flexible circuit board is soft in texture and easy to wrinkle and warp, so that when the flexible circuit board and the electronic element patch are welded, the flexible circuit board and the electronic element patch are not in full contact, and quality problems such as 'floating height' and 'insufficient soldering' are caused. To this end, the present application provides the following examples.

Referring to fig. 1, fig. 1 is a schematic cross-sectional structure diagram of a jig assembly according to a first embodiment of the present disclosure.

The jig assembly 10 of the present embodiment includes a surface mount jig 11 and a press-fit jig 12. The surface mount device 11 includes a carrier 111 and a pressing plate 112, wherein the pressing plate 112 cooperates with the carrier 111 to fix the flexible printed circuit board. The pressing fixture 12 is matched with the surface mounting fixture 11 to fix the parts to be welded. Through the mode of respectively fixing the flexible circuit board and the part to be welded, the part to be welded and the flexible circuit board are relatively fixed, and the relative positions of the part to be welded and the flexible circuit board meet the assembly requirements of a welding process, so that the part to be welded and the flexible circuit board are welded together in a reflow soldering mode and the like.

Optionally, the surface mount jig 11 further includes a bakelite base 113, and the bakelite base 113 is used for carrying the support carrier 111, the press plate 112 and the press-fit jig 12, so as to increase the structural strength of the jig assembly 10.

It should be noted that the to-be-welded component may be an electronic component such as a usb (universal Serial bus) socket, a resistor, an inductor, a capacitor, a btb (board to board) connector, and an ic (integrated circuit) device in an electronic device (e.g., a mobile phone, a tablet computer, a notebook computer, a wearable device, etc.). The embodiment of the present application takes a to-be-welded component as an example of a USB socket.

Referring to fig. 2 and 3 together, fig. 2 is a side view of the USB socket 101 and the flexible circuit board 102 of the present application after being soldered, and fig. 3 is a top view of the USB socket 101 and the flexible circuit board 102 of fig. 2 after being soldered.

The USB socket 101 is generally arranged in a (approximately) symmetrical structure, and is much thicker than the flexible circuit board 102; when the two are soldered together, the flexible circuit board 102 is also generally located in the middle region of the USB socket 101, as shown in fig. 2.

Further, the UBS socket 101 generally has a plurality of PIN PINs, and the flexible circuit board 102 is correspondingly provided with a plurality of pads, as shown in fig. 3, the welding of the PIN PINs and the pads together mainly means the welding connection between the PIN PINs and the pads, so as to achieve the electrical connection between the USB socket 101 and the flexible circuit board 102. Obviously, the lapping effect between the PIN and the pad (for example, whether the assembly requirement of the soldering process is satisfied) will affect the soldering quality between the PIN and the pad (that is, the electrical performance between the PIN and the pad), and further affect the electrical connection performance between the USB socket 101 and the flexible circuit board 102.

Referring to fig. 4, fig. 4 is a schematic top view of the carrier plate 111 in fig. 1.

The carrier board 111 is provided with a carrying area 1111, and the carrying area 1111 is used for carrying a flexible circuit board and a to-be-welded element.

Optionally, the number of the bearing areas 1111 is multiple, and the multiple bearing areas 1111 can simultaneously bear multiple groups of flexible circuit boards and to-be-welded parts, so that it is possible for the jig assembly 10 to simultaneously fix multiple groups of flexible circuit boards and to-be-welded parts, thereby increasing the clamping efficiency of the jig assembly 10. In this embodiment, the number of the bearer zones 1111 is six, and the structures of the six bearer zones 1111 are correspondingly the same, as shown in fig. 4; and one of the bearer zones 1111 is illustrated in detail as shown by the dashed box in fig. 4.

In some embodiments, if the thickness of the flexible circuit board is not consistent with that of the parts to be soldered, as shown in fig. 2, a portion of the carrier board 111 corresponding to the carrying area 1111 may be recessed, so that the flexible circuit board is directly attached to the carrier board 111, and the parts to be soldered are received in the recessed portion of the carrier board 111. Moreover, the shape, size and other structural features of the recessed portion are consistent with those of the to-be-welded part, that is, the recessed portion may be a profiling structure of the to-be-welded part, so that when the flexible circuit board and the to-be-welded part are placed in the carrying region 1111, the relative positions of the flexible circuit board and the to-be-welded part can meet the assembly requirements of the welding process, as shown in fig. 2 and 3. In this way, the difficulty in manufacturing the carrier board 111 can be simplified, thereby increasing the processing efficiency of the carrier board 111 and reducing the processing cost of the carrier board 111.

In other embodiments, the carrier 111 is provided with a first avoiding region 1112, the first avoiding region 1112 may be recessed in the carrier 111 or penetrate through the carrier 111, and the first avoiding region 1112 is used for avoiding an electronic component mounted on a flexible circuit board (near one surface of the carrier 111) so that the flexible circuit board is flatly and directly mounted on the carrier 111, and the electronic component is accommodated in the first avoiding region 1112. The shape, size, number, distribution, and other structural features of the first avoidance region 1112 are consistent with those of the electronic component, that is, the first avoidance region 1112 may be a profile structure of the electronic component. Through the mode, the carrier plate 111 can effectively avoid electronic elements arranged on the patch of the flexible circuit board, and the carrier plate 111 can position the flexible circuit board to a certain extent.

In other embodiments, the carrier plate 111 further has a first ventilating hole 1113, and particularly, the carrying region 1111 and the first avoiding region 1112 correspond to a portion of the carrier plate 111. Negative pressure can be eliminated on the one hand like this, be convenient for get and put the flexible circuit board, treat the welding piece, on the other hand can also increase the flexible circuit board, treat the convection current between welding piece and the external environment, especially the thermal convection among the reflow soldering in-process to increase the welding effect of flexible circuit board and treating the welding piece.

It should be noted that the shape, number, distribution and other parameters of the first avoidance region 1112 can be designed reasonably according to actual avoidance requirements. Similarly, the size, number and distribution of the first ventilation holes 1113 can be designed reasonably according to actual welding requirements.

Referring to fig. 5, fig. 5 is a schematic top view of the pressure plate 112 of fig. 1.

The pressing plate 112 has a through hole 1121 corresponding to the carrying region 1111, and the pressing plate 112 presses the flexible circuit board onto the carrier 111 and exposes the component to be welded through the through hole 1121. In other words, when the flexible circuit board, the parts to be soldered, is placed in the carrying area 1111, the pressing plate 112 cooperates with the carrier plate 111 only for fixing the flexible circuit board; the to-be-welded members correspond to the through holes 1121, and are not fixed to the carrier plate 111 by the pressing plate 112.

Optionally, the number of the through holes 1121 is plural and is the same as the number of the bearing zones 1111. For example: when the number of the bearing zones 1111 is six, as shown in fig. 4, the number of the through holes 1121 is also six, as shown in fig. 5. Moreover, the relative positional relationship among the six through holes 1121 is the same as that of the six bearing regions 1111.

In some embodiments, the pressing plate 112 is provided with a second avoiding region 1122, the second avoiding region 1122 may be recessed in the pressing plate 112 or may penetrate through the pressing plate 112, the second avoiding region 1122 is used for avoiding an electronic component mounted on a patch on the flexible circuit board (a surface close to the pressing plate 112), so that the flexible circuit board is flatly and directly pressed on the carrier plate 111 by the pressing plate 112, and the electronic component is accommodated in the second avoiding region 1122. The structural features of the second bypass regions 1122, such as the shape, size, number, and distribution thereof, may be identical to those of the electronic components, that is, the second bypass regions 1122 may have a replica structure of the electronic components. In this way, the pressing plate 112 can press the flexible printed circuit board onto the carrier 111, that is, the flexible printed circuit board is flatly clamped by the carrier 111 and the pressing plate 112, so as to effectively prevent the flexible printed circuit board from wrinkling and warping due to its soft texture.

In other embodiments, the pressing plate 112 further defines a second vent 1123. Therefore, on one hand, the negative pressure between the pressing plate 112 and the carrier plate 111 can be eliminated, so that the pressing plate 112 can be conveniently taken and placed, and on the other hand, the convection between the space (the flexible circuit board and the space area where the to-be-welded part is located) formed by the pressing plate 112 and the carrier plate 111 and the external environment can be increased through the cooperation between the second air hole 1123 and the first air hole 1113, especially the thermal convection between the flexible circuit board, the to-be-welded part and the external environment in the reflow soldering process, so that the soldering effect of the flexible circuit board and the to-be-welded part is.

It should be noted that the shape, number, distribution and other parameters of the second avoidance zone 1122 can be reasonably designed according to actual avoidance requirements. Similarly, the size, number and distribution of the second air holes 1123 can be designed according to the actual welding requirement.

Referring again to fig. 4 and 5 together, the platen 112 is a magnetic platen made of a magnetic material. The carrier plate 111 is provided with a plurality of first magnetic members 1114, and the plurality of first magnetic members 1114 are magnetically connected with the pressing plate 112, so that when the pressing plate 112 presses the flexible circuit board on the carrier plate 111, the fixing effect of the carrier plate 111 and the pressing plate 112 on the flexible circuit board is increased, and the reliability of the chip mounting jig 11 is increased.

In some embodiments, the first magnetic member 1114 may be a permanent magnet, and when the pressing plate 112 is disposed on the carrier plate 111, the pressing plate 112 is directly magnetically attracted to the carrier plate 111, so as to press the flexible circuit board onto the carrier plate 111.

In other embodiments, the first magnetic member 1114 may also be a coil, and when the pressing plate 112 is disposed on the carrier plate 111, the first magnetic member 1114 is energized to generate a magnetic force, so that the pressing plate 112 is magnetically attracted to the carrier plate 111, thereby pressing the flexible circuit board onto the carrier plate 111. After the first magnetic member 1114 is powered off, the magnetic attraction between the pressing plate 112 and the carrier plate 111 is released, so that the pressing plate 112 can be taken away, thereby increasing the clamping efficiency of the chip mounter 11.

It should be noted that the magnetic property, the quantity and the distribution of the first magnetic member 1114 can be reasonably designed according to the actual magnetic absorption requirement.

Referring to fig. 6, fig. 6 is a schematic top view of the bakelite base 113 in fig. 1.

The bakelite base 113 is provided with a plurality of positioning columns 1131, and the positioning columns 1131 protrude from the bakelite base 113. Accordingly, the carrier 111 and the pressing plate 112 are provided with positioning holes corresponding to the positioning posts 1131. For example: the carrier 111 has a first positioning hole 1115, and the platen 112 has a second positioning hole 1124.

In some embodiments, each positioning post 1131 simultaneously penetrates through the first positioning hole 1115 and the second positioning hole 1124, so that the carrier 111 and the press plate 112 are sequentially stacked on the bakelite base 113, and the structure of the chip mounting fixture 11 is simplified. In addition, the positioning columns 1131 are matched with the first positioning holes 1115 and the second positioning holes 1124, so that the carrier board 111 and the pressing board 112 are positioned relative to the bakelite base 113, and the flexible circuit board is fixed by the carrier board 111 and the pressing board 112 to meet the requirements of a welding process.

It should be noted that the shape, size, number, distribution, and matching relationship of the positioning posts 1131, the first positioning holes 1115 and the second positioning holes 1124 can be designed reasonably according to actual positioning requirements.

Referring to fig. 7, fig. 7 is a schematic top view of the pressing fixture 12 in fig. 1.

The pressing jig 12 is detachably connected to the surface mount jig 11, so that after the flexible circuit board and the to-be-welded element are placed on the carrier plate 111, and the pressing plate 112 is matched with the carrier plate 111 to fix the flexible circuit board, the pressing jig 12 is matched with the surface mount jig 11 to fix the to-be-welded element, so that the to-be-welded element and the flexible circuit board are relatively fixed, and the relative positions of the to-be-welded element and the flexible circuit board meet the assembly requirements of a welding process.

The pressing fixture 12 includes a support 121, a pressing member 122 and a rotating shaft 123, wherein the pressing member 122 is movably connected to the support 121 through the rotating shaft 123. When the pressing fixture 12 is disposed on the mounting fixture 11, the support 121 is disposed on the pressing plate 112, and the pressing element 122 corresponds to the through hole 1121. At this time, the pressing member 122 is used for pressing the to-be-welded member on the carrier plate 111, so that the to-be-welded member and the flexible circuit board are relatively fixed.

The bracket 121 is provided with a positioning hole corresponding to the positioning pillar 1131, such as a third positioning hole 1211. In addition, the positioning of the pressing jig 12 and the mounting jig 11 is realized through the matching relationship between the positioning column 1131 and the third positioning hole 1211, so that the mounting jig 11 and the pressing jig 12 fix the flexible circuit board and the to-be-welded component to meet the assembly requirement of the welding process.

It should be noted that the shape, size, number, distribution, and matching relationship of the positioning pillars 1131 and the third positioning holes 1211 can be designed reasonably according to actual positioning requirements.

Optionally, the press fixture 12 and the patch fixture 11 are movably connected by using a hinge structure, so as to increase the compactness of the fixture assembly 10.

Referring to fig. 8 and 9 together, fig. 8 is a schematic top view of the bracket 121 in fig. 7, and fig. 9 is a schematic side view of the pressing member 122 in fig. 7.

The rack 121 is comb-shaped and includes a plurality of comb teeth 1212 to form a plurality of receiving spaces 1213 arranged at intervals. Also, the number of the accommodating spaces 1213 corresponds to the number of the through holes 1121. For example: when the number of the through holes 1121 is six, as shown in fig. 5, the number of the accommodating spaces 1213 is also six, and the number of the comb teeth 1212 is five or seven, as shown in fig. 7 and 8. Also, the relative positional relationship between the six accommodation spaces 1213 is the same as the correspondence of the six penetration holes 1121. Accordingly, the number of the pressing members 122 is also six, and each pressing member 122 is correspondingly inserted into one of the accommodating spaces 1213, as shown in fig. 7. Moreover, the relative positional relationship between the six pressing elements 122 is the same as the correspondence of the six through holes 1121, so that each pressing element 122 can press the to-be-welded member onto the carrier plate 111.

Optionally, each comb 1212 is formed with a groove (not labeled), and all the grooves are located on the same straight line, as shown in fig. 8. The shaft 123 is received in the groove, and two ends of the shaft are provided with cover plates (not labeled in the figures), and the cover plates are connected with the bracket 121 by screws, buckles, and the like to fix the shaft 123, as shown in fig. 7.

The pressing element 122 includes a fixing portion 1221 and a pressing portion 1222, as shown in fig. 9, the fixing portion 1221 is sleeved on the rotating shaft 123, so that the pressing element 122 is rotatably connected to the bracket 121, and the pressing portion 1222 is used for pressing the to-be-welded element on the carrier plate 111. At this time, the rotating shaft 123 is sequentially inserted through the fixing portions 1221 of the six pressing members 122 and the comb 1212 of the holder 121 at intervals, as shown in fig. 7.

Optionally, a surface of the pressing element 122 close to the pressing plate 112 is recessed, as shown in fig. 9, so that when the pressing fixture 12 is disposed on the surface mount fixture 11, a contact area between the pressing element 122 and the pressing plate 112 is reduced, so that the pressing element 122 presses the to-be-welded element on the support plate 111 better, and reliability of the fixture assembly 10 is further improved.

In some embodiments, the pressing fixture 12 further includes a cross bar 124, and an extending direction of the cross bar 124 is identical to an extending direction of the rotating shaft 123, as shown in fig. 7. Moreover, the cross bar 124 is connected to the pressing members 122 at the same time, so that the pressing members 122 can rotate relative to the bracket 121 through the rotating shaft 123 at the same time, thereby increasing the clamping efficiency of the pressing jig 12.

In other embodiments, the support 121 is further provided with a limiting block 1214, and the extending direction of the limiting block 1214 is consistent with the extending direction of the comb teeth 1212 of the support 121. The two ends of the bracket 121 may be respectively provided with a limiting block 1214, as shown in fig. 7 and 8. The stopper 1214 serves to stop the cross bar 124, thereby limiting the rotation angle of the engaging member 122 relative to the bracket 121. In addition, since the pressing member 122 is inserted into the accommodating space 1213 of the bracket 121, the bracket 121 itself can also stop the pressing member 122, for example: in this stop situation, the pressing element 122 is arranged at (approximately) right angles to the holder 121.

Referring to fig. 7 and 8 again, the bracket 121 is provided with a plurality of second magnetic members 1215, and the plurality of second magnetic members 1215 are magnetically connected to the pressing plate 112, so that the pressing jig 12 is magnetically adsorbed to the surface mount jig 11, thereby realizing the detachable connection between the pressing jig 12 and the surface mount jig 11.

In some embodiments, the second magnetic member 1215 may be a permanent magnet, and when the pressing fixture 12 is disposed on the patch fixture 11, the support 121 is directly magnetically attracted to the pressing plate 112, so that the pressing fixture 12 is magnetically connected to the patch fixture 11.

In other embodiments, the second magnetic member 1215 may also be a coil, and when the pressing fixture 12 is disposed on the patch fixture 11, the second magnetic member 1215 is energized to generate a magnetic force, so that the support 121 is magnetically attracted to the pressing plate 112. Moreover, after the second magnetic member 1215 is powered off, the magnetic attraction between the bracket 121 and the pressing plate 112 is released, so as to take away the pressing fixture 12, thereby increasing the clamping efficiency of the fixture assembly 10.

It should be noted that the magnetic property, the quantity and the distribution of the second magnetic member 1215 can be designed reasonably according to the actual magnetic adsorption requirement.

Further, the pressing member 122 is provided with a plurality of third magnetic members 1223, and the plurality of third magnetic members 1223 are magnetically connected to the pressing plate 112, so that when the pressing member 122 presses the to-be-welded member on the support plate 111, the fixing effect of the pressing member 122 and the support plate 111 on the to-be-welded member is increased, thereby increasing the reliability of the pressing jig 12.

In some embodiments, the third magnetic member 1223 may be a permanent magnet, and when the pressing fixture 12 is disposed on the patch fixture 11, the pressing member 122 is directly magnetically attracted to the pressing plate 112, so as to press the member to be welded on the carrier plate 111.

In other embodiments, the third magnetic member 1223 may also be a coil, and when the pressing fixture 12 is disposed on the surface mount fixture 11, the third magnetic member 1223 is energized to generate a magnetic force, so that the pressing member 122 is magnetically attracted to the pressing plate 112, and the to-be-welded member is pressed on the support plate 111. Moreover, after the third magnetic member 1223 is powered off, the magnetic attraction between the pressing member 122 and the pressing plate 112 is released, so as to adjust the pressing member 122, thereby increasing the flexibility of the pressing fixture 12.

It should be noted that the magnetic property, the number, the distribution and other parameters of the third magnetic element 1233 can be reasonably designed according to the actual magnetic adsorption requirement.

Based on the fixture assembly 10 of the present embodiment, an operator or a robot arm may first place six flexible circuit boards and six to-be-soldered pieces in six carrying areas 1111 on the carrying board 111, where each carrying area 1111 has a set of flexible circuit boards and to-be-soldered pieces. Then, the pressing plate 112 is disposed on the carrier plate 111, and the carrier plate 111 and the pressing plate 112 are positioned with respect to the bakelite base 113 through the matching relationship between the positioning posts 1131 and the first positioning holes 1115 and the second positioning holes 1124; and through the magnetic adsorption between the first magnetic member 1114 and the magnetic pressing plate 112, the six flexible circuit boards are clamped between the pressing plate 112 and the carrier plate 111, so that the six flexible circuit boards are fixed by the chip fixture 11 to meet the requirements of the welding process. Then, the pressing jig 12 is arranged on the surface mounting jig 11, and the pressing jig 12 and the surface mounting jig 11 are positioned through the matching relationship between the positioning column 1131 and the third positioning hole 1211; and the detachable connection between the pressing fixture 12 and the patch fixture 11 is realized through the magnetic attraction between the second magnetic piece 1215 and the magnetic pressure plate 112. Finally, each pressing piece 122 is rotated or six pressing pieces 122 are simultaneously rotated through the cross rod 124, and the pressing pieces 122 respectively press six pieces to be welded on the support plate 111 through the magnetic adsorption between the third magnetic piece 1223 and the magnetic press plate 112; each pressing element 122 can be finely adjusted, so that the reliability of the pressing fixture 12 is increased.

Through the mode of respectively fixing the flexible circuit board and the part to be welded, the part to be welded and the flexible circuit board are relatively fixed, and the relative positions of the part to be welded and the flexible circuit board meet the assembly requirements of a welding process, so that the part to be welded and the flexible circuit board are welded together in a reflow soldering mode and the like. Further, after the patch jig 11 fixes a plurality of flexible circuit boards simultaneously, each piece to be welded is fixed separately through the press-fit jig 12, so that each group of flexible circuit boards and pieces to be welded do not interfere with each other, clamping errors of a plurality of groups of flexible circuit boards and pieces to be welded are reduced, and reliability of the jig assembly 10 is improved.

Referring to fig. 10, fig. 10 is a schematic top view structure diagram of a jig assembly according to a second embodiment of the present disclosure. Fig. 10(a) is a schematic top view of the carrier 211, and fig. 10(b) is a schematic top view of the platen 212.

The jig assembly 20 of the present embodiment includes a surface mount jig 21 and two press-fit jigs (not shown). The surface mount device 21 includes a carrier 211 and a pressing plate 212. The carrier plate 211 is divided into two parts as shown by the dashed box in fig. 10 (a). Moreover, the structure of each part of the carrier 211 is the same as that of the carrier 111 in the first embodiment of the fixture assembly 10, and is not described herein again. Accordingly, the platen 212 is also divided into two parts as shown by the dashed line box in fig. 10 (b). Moreover, the structure of each part of the pressing plate 212 is the same as that of the pressing plate 112 in the first embodiment of the jig assembly 10, and is not described herein again. Further, the structure of the two pressing jigs is the same as that of the pressing jig 12 in the first embodiment of the jig assembly 10, and the description thereof is omitted.

Further, the two parts of the carrier plates 211 are arranged in a central symmetry manner, and the two parts of the press plates 212 are correspondingly arranged in a central symmetry manner, so that when the press plates 212 are arranged on the carrier plates 211 and the two press-fit jigs are respectively arranged at corresponding positions of the surface-mounted jig 21, the stability between the press plates 212 and the carrier plates 211 is increased, and the reliability of the surface-mounted jig 21 is increased; and the stability between the two pressing jigs and the surface mounting jig 21 is increased, thereby increasing the reliability of the jig assembly 20.

Through the mode, the clamping quantity of the jig assembly 20 to the flexible circuit board and the to-be-welded part can be multiplied, so that the clamping efficiency of the jig assembly 20 is increased.

Referring to fig. 11, fig. 11 is a schematic top view structure diagram of a jig assembly according to a third embodiment of the present disclosure. Fig. 11(a) is a schematic top view of the carrier 311, and fig. 11(b) is a schematic top view of the pressing plate 312.

The jig assembly 30 of the present embodiment includes a surface mount jig 31 and two press-fit jigs (not shown in the figure). The surface mount fixture 31 includes a carrier 311 and a pressing plate 312. The carrier plate 211 is divided into two parts as shown by the dashed box in fig. 11 (a). Moreover, the structure of a portion of the carrier 311 is the same as that of the carrier 111 in the first embodiment of the fixture assembly 10, and is not described herein again; the structure of the other part of the carrier 311 is similar to that of the carrier 111 in the first embodiment of the jig assembly 10, and is not repeated herein. Accordingly, the pressing plate 312 is also divided into two parts as shown by a dashed line box in fig. 11 (b). Moreover, the structure of a portion of the pressing plate 312 is the same as that of the pressing plate 112 in the first embodiment of the jig assembly 10, and is not described herein again; the structure of the other portion of the pressing plate 312 is similar to that of the pressing plate 112 in the first embodiment of the jig assembly 10, and therefore, the description thereof is omitted.

In this way, when the pressing plate 312 is disposed on the carrier 311, the chip assembly 31 forms two clamping areas. The structure of the two clamping areas can be not identical, reasonable design can be carried out according to specific to-be-welded parts, and the two pressing jigs can also be reasonably designed respectively along with the to-be-welded parts. So can make tool subassembly 30 simultaneously to flexible circuit board, multiple treat that the weldment carries out the clamping, for example: one part of the jig assembly 30 clamps the flexible circuit board and the first type of parts to be welded, and the other part of the jig assembly 30 clamps the flexible circuit board (the flexible circuit board can be a semi-finished product welded with the first type of parts to be welded) and the second type of parts to be welded, so that the clamping efficiency and the application range of the jig assembly 30 are increased.

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A jig assembly, comprising:

the chip mounting jig comprises a carrier plate and a pressing plate, wherein the carrier plate is provided with a plurality of bearing areas, each bearing area is used for bearing a group of flexible circuit boards and pieces to be welded, the pressing plate is provided with a plurality of through holes which correspond to the bearing areas one by one respectively, and the pressing plate is used for pressing the flexible circuit boards on the carrier plate and exposing the pieces to be welded through the through holes respectively;

the pressing fixture is detachably connected with the surface mounting fixture and comprises a support, a rotating shaft and a plurality of pressing pieces which are respectively in one-to-one correspondence to the through holes, each pressing piece is movably connected with the support through the rotating shaft, and when the support is arranged on the pressing plate, each pressing piece is respectively used for pressing one to-be-welded piece to the support plate, so that the to-be-welded piece and the flexible circuit board are relatively fixed.

2. The jig assembly according to claim 1, wherein the pressing member includes a fixing portion and a pressing portion, the fixing portion is disposed on the rotating shaft, so that the pressing member is rotatably connected to the bracket, and the pressing portion is used for pressing the member to be welded to the carrier plate.

3. The jig assembly as claimed in claim 2, wherein the frame is configured in a comb shape and forms a plurality of receiving spaces corresponding to the pressing members, and the pressing members are inserted into the receiving spaces such that the rotating shaft sequentially penetrates through the fixing portion and the comb teeth of the frame.

4. The jig assembly of claim 1, wherein the press plate is a magnetic press plate, the carrier plate is provided with a plurality of first magnetic members, and the plurality of first magnetic members are magnetically connected to the press plate, so that the press plate presses the flexible circuit board to the carrier plate.

5. The jig assembly according to claim 4, wherein the bracket is further provided with a plurality of second magnetic members, the plurality of second magnetic members are magnetically connected with the pressing plate, so that the pressing jig is detachably connected with the patch jig, the pressing member is provided with a plurality of third magnetic members, and the plurality of third magnetic members are magnetically connected with the pressing plate, so that the pressing member presses the to-be-welded member onto the carrier plate.

6. The jig assembly of claim 5, wherein the first magnetic member, the second magnetic member and the third magnetic member are permanent magnets or coils.

7. The jig assembly of claim 1, wherein the carrier plate is provided with a first avoiding region and a first air vent, the pressing plate is provided with a second avoiding region and a second air vent, the first avoiding region and the second avoiding region are used for avoiding electronic components mounted on a patch on the flexible circuit board, so that the pressing plate presses the flexible circuit board on the carrier plate, and the first air vent and the second air vent are used for increasing convection between a space formed by the pressing plate and the carrier plate and an external environment.

8. The jig assembly as claimed in claim 1, wherein the patch jig further comprises a bakelite base, the bakelite base is provided with a plurality of positioning posts, the support plate, the press plate and the support are provided with positioning holes corresponding to the positioning posts, and the positioning posts are inserted into the positioning holes and fit with the positioning holes, so that the support plate, the press plate and the support are sequentially stacked on the bakelite base.