JP6489525B2 - Electric device manufacturing method, manufacturing jig, and removal jig - Google Patents

Description

  The present invention relates to a method for manufacturing an electric device having a structure in which a board-side connection portion of a circuit board and a lead frame-side connection portion of a lead frame are bonded by a conductive bonding material, and a manufacturing method used for the method of manufacturing the electric device. The present invention relates to a jig and a removal jig used in the manufacturing method of the electric device.

2. Description of the Related Art Conventionally, a manufacturing method using a jig is known as a method for manufacturing an electric device including a circuit board (see, for example, Patent Document 1).
In the conventional method for manufacturing an electrical device, as shown in FIG. 21, after a circuit board 902 is sandwiched by a jig made of an upper plate 901 and a lower plate 903, an upper plate 901, a circuit board 902 and a lower plate are clipped by a clip 906. 903 is fixed and reflow is performed in that state. Although illustration is omitted, an electronic component is placed on the circuit board 902 via a bonding material such as solder before reflow, and is bonded to the electronic component by reflow. In FIG. 21, members denoted by reference numerals 904 and 905 are alignment pins.

  According to the conventional method for manufacturing an electrical device, it is possible to suppress warping of the circuit board during reflow.

Japanese Patent Laid-Open No. 7-154065

  By the way, a lead frame may be attached to the circuit board in order to exchange electrical signals between electronic components on the circuit board and electronic components outside the circuit board. It is necessary to attach the lead frame and the circuit board apart from each other except for necessary portions (connection portions). Therefore, when attaching the lead frame to the circuit board, a jig for aligning the circuit board and the lead frame is used to perform reflow while maintaining the positional relationship between the circuit board and the lead frame in an appropriate state. It is preferable to use it. In the technical field of electrical equipment, such a jig and a manufacturing method using the jig are always desired.

  Therefore, the present invention has been made in view of the above problems, and provides an electrical device manufacturing method capable of performing reflow while maintaining the positional relationship between the circuit board and the lead frame in an appropriate state. Objective. Another object of the present invention is to provide a jig for manufacturing an electric device for use in the method for manufacturing an electric device of the present invention and a removal jig for removing the manufacturing jig.

The present invention is constituted by the following technical features.
Note that an “electric device” in this specification refers to a device that operates with electric power and exchanges electric signals inside the device. The electrical equipment in this specification does not only refer to a device that can operate in a single unit (so-called final product) but also a unit that is incorporated into the final product and does not operate alone (so-called module). Including.
In addition, the “circuit board” in the present specification refers to a board on which an electronic component is placed, on which an electric circuit is formed. The circuit board of this specification includes both a board on which electronic components are not placed and a board on which electronic components are placed. In this specification, an electronic component bonded to the circuit board before the lead frame and an electronic component bonded to the circuit board at the same time as the lead frame are treated as a part of the circuit board.
Further, the “joining material” in the present specification is a material capable of electrically joining the board side connecting portion of the circuit board and the lead frame side connecting portion of the lead frame by performing reflow (for example, a solder material). I mean.

[1] A method for manufacturing an electric device according to the present invention is for manufacturing an electric device having a structure in which a board-side connection portion of a circuit board and a lead frame-side connection portion of a lead frame are bonded by a conductive bonding material. A method for manufacturing an electrical device, comprising: preparing a first jig having a substrate placement portion for placing the circuit board; and placing the circuit board on the first jig; A second jig having a second jig-side fixing member and a third jig having a third jig-side fixing member that attracts the second jig-side fixing member by a magnetic force are prepared. When the lead frame is sandwiched between the second jig and the third jig so that the lead frame side connection portion is exposed when viewed, the second jig and the third jig are connected to the second jig. Fix by the magnetic force between the jig side fixing member and the third jig side fixing member The second step, the second jig and the third jig are arranged such that the lead frame side connection portion is positioned on the substrate side connection portion via the bonding material, and the second jig With the first jig, the second jig, and the third jig attached, with the third step of placing the first jig on the first jig side And after removing the second jig and the third jig from the first jig, a fourth step of joining the board side connecting part and the lead frame side connecting part with the joining material. A fifth step of detaching the second jig and the third jig from the lead frame using a jig for the second jig-side fixing member and the third jig-side fixing member. At least one of the fixing members is made of a permanent magnet, and the third step, the fourth step, and the fifth step Which comprises carrying out in this order.

[2] In the method for manufacturing an electrical device of the present invention, it is preferable that both the second jig side fixing member and the third jig side fixing member are made of permanent magnets.

[3] In the method for manufacturing an electric device according to the present invention, it is preferable that at least one of the second jig side fixing member and the third jig side fixing member is made of a samarium-cobalt permanent magnet.

[4] In the method for manufacturing an electrical device according to the present invention, a second jig having a second jig-side fixing member at a central portion is used as the second jig, and the third jig is the first jig. It is preferable to use the 3rd jig | tool which has a 3 jig | tool side fixing member in a center part.

[5] In the method for manufacturing an electrical device according to the present invention, the second jig in which a substrate opening corresponding to the position of the substrate-side connecting portion is formed is used as the second jig. In the step, the lead frame is sandwiched between the second jig and the third jig so that the lead frame side connection portion is exposed from the substrate opening when viewed from the second jig side. It is preferable to do.

[6] In the method for manufacturing an electrical device according to the present invention, the second jig is a portion exposed as viewed from the third jig side when the second jig and the third jig are fixed. A portion exposed when viewed from the side of the second jig when the second jig and the third jig are fixed as the third jig using a second jig further having a certain pressing exposed portion. Using a third jig further having an exposure portion for removal, and using the removal jig having a third jig removal convex portion corresponding to the position of the removal exposure portion as the removal jig, In the fifth step, the second jig and the third jig are placed on the removal jig in a state where the convex part for removing the third jig and the exposed part for removal are in contact with each other. Then, the pressing exposed portion is pressed toward the removing jig. The second separate jig and a third jig, it is preferable to remove the said third jig and the second jig from the lead frame by the.

[7] In the method for manufacturing an electrical device of the present invention, the removal exposure portion is configured such that the first jig is disposed when the second jig and the third jig are placed on the first jig. In the fifth step, the first jig is placed on the removal jig in a state in which the third jig removal projection and the removal exposure part are in contact with each other. It is preferable to remove the second jig and the third jig from the first jig by placing a tool, the second jig, and the third jig.

[8] In the method for manufacturing an electrical device according to the present invention, the first jig is used when the second jig and the third jig are placed on the first jig as the second jig. Using the second jig further having a receiving exposed portion that is exposed when viewed from the tool side, as the removing jig, the length protruding from the third jig removing convex portion is short, and It is preferable to use a removal jig that further has a second jig receiving convex portion corresponding to the position of the receiving exposed portion.

[9] In the method for manufacturing an electrical device of the present invention, in the first step, it is preferable that the bonding material is disposed on the circuit board after the circuit board is placed on the first jig.

[10] In the method for manufacturing an electrical device of the present invention, the second jig and the third jig in a state where the lead frame is sandwiched are mounted on the first jig as the first jig. A first height adjusting portion that adjusts the height position of the second jig so that the height position of the lead frame side connecting portion becomes appropriate with respect to the substrate side connecting portion when placed; Using a jig, in the third step, placing the second jig and the third jig on the first jig so that the second jig is placed on the height adjustment unit. Is preferred.

[11] A manufacturing jig of the present invention is a manufacturing jig for use in the method for manufacturing an electrical device of the present invention, and includes a first mounting jig for mounting a circuit board. A set of three types of jigs, a second jig having a second jig-side fixing member and a third jig having a third jig-side fixing member that attracts the second jig-side fixing member by a magnetic force. The second jig and the third jig are arranged in a state where the lead frame is sandwiched so that the lead frame side connection portion of the lead frame is exposed when viewed from the second jig side. The first jig can be fixed by the magnetic force between the jig side fixing member and the third jig side fixing member, and the second jig and the third jig can be connected to the lead frame side connecting portion. Is positioned on the board-side connecting portion of the circuit board via a bonding material, and the second treatment is performed. Can be placed in a state facing the first jig side, and at least one of the second jig side fixing member and the third jig side fixing member is made of a permanent magnet. And

[12] In the manufacturing jig of the present invention, it is preferable that both the second jig side fixing member and the third jig side fixing member are made of permanent magnets.

[13] In the manufacturing jig of the present invention, it is preferable that at least one of the second jig side fixing member and the third jig side fixing member is made of a samarium-cobalt permanent magnet.

[14] In the manufacturing jig of the present invention, the second jig has the second jig side fixing member in a central portion thereof, and the third jig is the third jig side fixing member. It is preferable to have in the center.

[15] In the manufacturing jig of the present invention, it is preferable that a substrate opening corresponding to a position of the substrate side connection portion is formed in the second jig.

[16] In the manufacturing jig of the present invention, the second jig is a portion exposed when viewed from the third jig side when the second jig and the third jig are fixed. An exposure part for pressing is further provided, and the third jig is a part exposed when viewed from the second jig side when the second jig and the third jig are fixed. It is preferable to further have.

[17] In the manufacturing jig of the present invention, the removal exposure portion is configured such that the first jig is provided when the second jig and the third jig are placed on the first jig. It is preferable that it is the site | part exposed as seen from the side.

[18] In the manufacturing jig of the present invention, the second jig is the first jig when the second jig and the third jig are placed on the first jig. It is preferable to further have a receiving exposed portion which is a portion exposed when viewed from the side.

[19] In the manufacturing jig of the present invention, the first jig places the second jig and the third jig with the lead frame sandwiched therebetween on the first jig. In this case, it is preferable to further include a height adjustment unit that adjusts the height position of the second jig so that the height position of the lead frame side connection portion becomes appropriate with respect to the substrate side connection portion. .

[20] The removal jig of the present invention is a removal jig for use in the method of manufacturing an electrical device of the present invention, and is a third jig corresponding to the position of the removal exposure portion in the third jig. It has the convex part for removal, It is characterized by the above-mentioned.

[21] The removal jig of the present invention is a removal jig for use in the method of manufacturing an electrical device of the present invention, and is a third jig corresponding to the position of the removal exposure portion in the third jig. A removing projection, and a second jig receiving projection that is shorter than the third jig removing projection and that corresponds to the position of the receiving exposed portion of the second jig. It is characterized by having.

  Since the first jig, the second jig, and the third jig for aligning the circuit board and the lead frame are used in the method for manufacturing an electrical device according to the present invention, the positional relationship between the circuit board and the lead frame is appropriately set. It becomes the manufacturing method of the electric equipment which can perform reflow, keeping it in a state.

  According to the manufacturing jig of the present invention, the manufacturing jig of the present invention is used because the manufacturing jig of the present invention includes the first jig, the second jig, and the third jig that align the circuit board and the lead frame. When manufacturing an electrical device, it is possible to perform reflow while keeping the positional relationship between the circuit board and the lead frame in an appropriate state.

  According to the removing jig of the present invention, it is possible to smoothly remove the second jig and the third jig fixed by magnetic force.

It is a figure of the 1st jig | tool 10 in Embodiment 1. FIG. 1A is a top view of the first jig 10, FIG. 1B is a front view of the first jig 10, and FIG. 1C is a cross-sectional view taken along the line AA in FIG. FIG. In the following description, a sectional view corresponding to FIG. 1C is referred to as a “side sectional view”. In the drawing showing the jig, the z-axis (axis parallel to the direction in which the first jig, the second jig and the third jig of the present invention are stacked), the x-axis (one of the axes perpendicular to the z-axis) The direction of the viewpoint is displayed by the axis) and the y-axis (the other axis perpendicular to the z-axis). In this specification, the names “upper surface”, “front surface”, “lower surface (surface opposite to the upper surface; see FIG. 3B described later)” and “side cross section” are used for convenience. is there. Therefore, in the present invention, “upper surface”, “front surface”, and “side cross section” different from “upper surface”, “front surface”, and “side cross section” in the present specification may be set. It is a figure of the 2nd jig | tool 20 in Embodiment 1. FIG. 2A is a top view of the second jig 20, FIG. 2B is a front view of the second jig 20, and FIG. 2C is a side sectional view of the second jig 20. is there. It is a figure of the 3rd jig | tool 30 in Embodiment 1. FIG. 3A is a top view of the third jig 30, FIG. 3B is a bottom view of the third jig 30, and FIG. 3C is a front view of the third jig 30. FIG. 3D is a side sectional view of the third jig 30. It is a figure of the removal jig | tool 40 concerning Embodiment 1. FIG. 4A is a top view of the removal jig 40, FIG. 4B is a front view of the removal jig 40, and FIG. 4C is a side sectional view of the removal jig 40. is there. 3 is a flowchart of a method for manufacturing the electrical device according to the first embodiment. It is a figure shown in order to demonstrate 1st process S10 in Embodiment 1. FIG. 6A is a top view of the circuit board 100 placed on the first jig 10, and FIG. 6B is a side sectional view of FIG. 6A. FIG. 3 is a view for explaining a lead frame 110 in the first embodiment. 7A is a top view of the lead frame 110, FIG. 7B is a front view of the lead frame 110, and FIG. 7C is a side sectional view of the lead frame 110. It is a figure shown in order to demonstrate 2nd process S20 in Embodiment 1. FIG. FIG. 8A is a top view of a state in which the lead frame 110 is placed on the second jig 20, FIG. 8B is a front view of FIG. 8A, and FIG. It is a sectional side view of 8 (a). It is a figure shown in order to demonstrate 2nd process S20 in Embodiment 1. FIG. 9A is a top view of a state in which the lead frame 110 is sandwiched between the second jig 20 and the third jig 30, and FIG. 9B is a bottom view of FIG. 9A. (C) is a front view of FIG. 9 (a), and FIG. 9 (d) is a side sectional view of FIG. 9 (a). It is a figure shown in order to demonstrate 3rd process S30 in Embodiment 1. FIG. FIG. 10A is a top view of a state where the second jig 30 and the third jig 30 are placed on the first jig 10, and FIG. 10B is a front view of FIG. FIG. 10 (c) is a side sectional view of FIG. 10 (a). It is a sectional side view shown in order to demonstrate 4th process S40 in Embodiment 1. FIG. FIG. 11 can also be said to be a side sectional view of a state in which the board side connection portion 102 and the lead frame side connection portion 112 are joined by the joining material 122. It is a figure shown in order to demonstrate 5th process S50 in Embodiment 1. FIG. 12A is a front view showing a state where the second jig 20 and the third jig 30 are placed on the removal jig 40, and FIG. 12B is the side of FIG. 12A. FIG. 12C is a cross-sectional view, FIG. 12C is a front view showing a state where the second jig 20 and the third jig 30 are separated, and FIG. 12D is a side cross-sectional view of FIG. is there. 6 is a top view of a first jig 50 in Embodiment 2. FIG. It is a figure shown in order to demonstrate the 3rd process in Embodiment 2. 14A is a top view of the second jig 20 and the third jig 30 placed on the first jig 50, and FIG. 14B is a bottom view of FIG. 14A. It is. It is a figure shown in order to demonstrate the 5th process in Embodiment 2. FIG. FIG. 15A is a front view showing a state in which the first jig 50, the second jig 20, and the third jig 30 are placed on the removal jig 40, and FIG. 15 (a) is a side sectional view, and FIG. 15 (c) is a front view showing a state in which the first jig 50, the second jig 20, and the third jig 30 are separated, and FIG. FIG. 16 is a side sectional view of FIG. 10 is a top view of a first jig 60 in Embodiment 3. FIG. It is a figure of the 2nd jig | tool 70 in Embodiment 3. FIG. FIG. 17A is a top view of the second jig 70, and FIG. 17B is a bottom view of the second jig 70. It is a figure of the jig | tool 80 for removal which concerns on Embodiment 3. FIG. 18A is a top view of the removal jig 80, FIG. 18B is a front view of the removal jig 80, and FIG. 18C is a side sectional view of the removal jig 80. is there. It is a figure shown in order to demonstrate the 3rd process in Embodiment 3. FIG. 19A is a top view of the second jig 70 and the third jig 30 placed on the first jig 60, and FIG. 19B is a bottom view of FIG. 19A. It is. It is a figure shown in order to demonstrate the 5th process in Embodiment 3. FIG. 20A is a front view showing a state in which the first jig 60, the second jig 70, and the third jig 30 are placed on the removal jig 80, and FIG. 20 (a) is a side sectional view, and FIG. 20 (c) is a front view showing a state where the first jig 60, the second jig 70, and the third jig 30 are separated, and FIG. FIG. 21 is a side sectional view of FIG. It is a figure shown in order to demonstrate the manufacturing method of the conventional electric equipment.

  Hereinafter, a manufacturing method, a manufacturing jig, and a removing jig of an electric device according to the present invention will be described based on the embodiments shown in the drawings. It should be noted that the dimensions, shape, position, number, etc. of the components, through-holes, protrusions, dents, etc. displayed in each drawing are merely examples, and can be changed within a range not impairing the effects of the present invention.

[Embodiment 1]
First, the manufacturing jig and the removing jig 40 according to the first embodiment will be described.
The manufacturing jig according to the first embodiment is a manufacturing jig for use in a method for manufacturing an electrical device according to the first embodiment to be described later, and aligns the circuit board 100 and the lead frame 110. . The manufacturing jig according to the first embodiment includes a first jig 10, a second jig 20, and a third jig 30.
A specific method of using each jig will be described later, but simply speaking, the first jig 10 is a jig (see FIG. 6 described later) on which the circuit board 100 is placed, and the second jig 20. The third jig 30 is a jig for sandwiching the lead frame 110 (see FIG. 9 described later). Moreover, the 2nd jig | tool 20 and the 3rd jig | tool 30 can be mounted on the 1st jig | tool 10 (refer FIG. 10 mentioned later).

  Although not shown or described in detail, the manufacturing jig according to the first embodiment and the detaching jig 40 described later include protrusions, recesses, through holes, and the like in addition to the components described below. You may have. In addition, the manufacturing jig and the removing jig 40 according to the first embodiment have through holes for weight reduction and heat dissipation, notches used during transportation, and the like as long as the object of the present invention is not impaired. You may do it. The same applies to manufacturing jigs and removal jigs according to other embodiments and modifications described later.

As shown in FIG. 1, the first jig 10 according to the first embodiment includes a substrate platform 12 and a height adjuster 14.
The 1st jig | tool 10 is a jig | tool arrange | positioned at the lowest side, when the 1st jig | tool 10, the 2nd jig | tool 20, and the 3rd jig | tool 30 are combined (refer FIG. 10 mentioned later).

  The first jig 10 connects the second jig 20 and the third jig 30 to the board-side connection of the circuit board 100 via a bonding material 120 through a lead frame side connecting portion 112 (see FIG. 7 described later). The second jig 20 can be placed so as to be positioned on the portion 102 and facing the first jig 10 (see FIGS. 6 and 10 to be described later).

The board mounting part 12 is a part for mounting the circuit board 100. In the first embodiment, the three substrate platforms 12 are linearly arranged.
The number of the substrate mounting portions 12 in the first jig 10 is three because the three circuit boards 100 are reflowed at a time. The number of substrate placement portions in the first jig can be determined according to the number of circuit boards to be reflowed at a time, and may be one, two, or four or more. As will be described later, in the first embodiment, one substrate platform 12 corresponds to one circuit board 100, but one substrate platform corresponds to two or more circuit boards (a plurality of circuit boards). The substrate may be placed on one substrate placement unit), or two or more substrate placement units may correspond to one circuit board (one circuit board spans a plurality of substrate placement units). You may make it carry out.

A fixing recess 13 for fixing the position of the circuit board 100 by fitting the circuit board 100 is formed in the substrate mounting part 12 (see also FIG. 6 described later). The fixed recess 13 has a shape (rectangular shape in the first embodiment) corresponding to the outer shape when the circuit board 100 is viewed from the top when viewed from above. The above-described fixed recess 13 is an example, and a fixed recess having a shape different from that of the fixed recess 13 may be used in the present invention. In addition, the substrate mounting portion of the first substrate used in the present invention further includes a recess adjacent to the fixed recess (for example, for facilitating insertion or removal of the circuit board) as necessary. It may be formed.
In addition, when it is not necessary to fix the position of a circuit board, the 1st jig | tool in which the fixed recessed part is not formed can also be used.

As shown in FIG. 1, the height adjuster 14 is configured to lead the lead frame when the second jig 20 and the third jig 30 with the lead frame 110 interposed therebetween are placed on the first jig 10. This is a part for adjusting the height position of the second jig 20 so that the height position of the side connection portion 112 becomes an appropriate height position with respect to the board side connection portion 102 (see also FIG. 10 described later). . The height adjusting unit 14 according to the first embodiment is a flat surface formed between the substrate platform 12 and the outer edge of the first jig 10. The height adjusting portion in the present invention is not limited to the above-described one, and for example, includes a convex portion or a concave portion formed so as to correspond to the shape of the lower surface edge portion of the second jig. May be. Moreover, you may provide the site | part or component corresponding to a height adjustment part in a 2nd jig | tool.
In this specification, “the height position of the lead frame side connection portion is an appropriate height position with respect to the board side connection portion” means the distance between the lead frame side connection portion and the board side connection portion. Is a predetermined distance allowed in design. The predetermined distance can be appropriately set according to the electrical device to be manufactured.

  The first jig 10 is preferably made of a material that has a rigidity capable of supporting and fixing a circuit board, another jig, and the like, and that can withstand heat during reflow. Specific examples of the material constituting the first jig 10 include aluminum, aluminum alloy, stainless steel, and ceramics. The same applies to a second jig 20 and a third jig 30 described later.

As shown in FIG. 2, the second jig 20 in the first embodiment includes a second jig-side fixing member 22 and a pressing exposed portion 26, and a substrate opening 24 and a through hole 28 are formed. .
The second jig 20 is a jig disposed between the first jig 10 and the third jig 30 when the first jig 10, the second jig 20, and the third jig 30 are combined. (See FIG. 10 described later).

The 2nd jig | tool 20 has the 2nd jig | tool side fixing member 22 in the center part. Details of the second jig side fixing member 22 will be described later together with a third jig side fixing member 32 having a common configuration.
In this specification, the “center portion of the jig” refers to the shortest dimension of the outer dimensions of the jig when viewed from the top (for example, as viewed from the top like the second jig 20 in the first embodiment). In the case of a jig having a rectangular shape, when the length of a quarter of the short side) is set to a predetermined length, the distance from the outer shape of the jig is larger than the predetermined length. That means.
In this specification, “the jig is viewed from above” means that the first jig, the second jig, and the third jig are stacked in the direction in which the first jig, the second jig, and the third jig are stacked. When the second jig and the third jig are combined, the jig is viewed from the side where the third jig is arranged.

The substrate opening 24 is an opening (also referred to as a through hole) corresponding to the position of the substrate side connection portion 102. In the first embodiment, the substrate openings 24 are rectangular through holes, and the three substrate openings 24 are arranged in a straight line.
In the first embodiment, since one substrate opening 24 corresponds to one circuit board 100, the number of substrate openings 24 is three. However, the present invention is not limited to this. The number of substrate openings may be any number corresponding to the number of circuit boards. In addition, one substrate opening may correspond to two or more circuit boards, and two or more substrate openings may correspond to one circuit board.

The pressing exposed portion 26 is exposed when viewed from the third jig 30 side when the second jig 20 and the third jig 30 are fixed (the third jig 30 and a lead frame 110 described later). (It can also be said that it does not overlap.) (Refer to FIG. 9B described later). In the first embodiment, the pressing exposed portion 26 is a portion located on the outer edge of the second jig 20, and the outer edge of the third jig 30 when the second jig 20 and the third jig 30 are fixed. By being located outside, the third jig 30 is exposed as viewed from the side.
The through-hole 28 is a through-hole corresponding to a removal exposing portion 34 described later. The through hole 28 is a circular through hole having a shape corresponding to a third jig removing convex portion 42 described later. The through holes 28 are formed at four locations so as to surround the central substrate opening 24 corresponding to the removal exposure portion 34 and the third jig removal projection 42.

As shown in FIG. 3, the third jig 30 includes a third jig-side fixing member 32 and a removal exposure part 34, and an opening 36 is formed.
The third jig 30 is a jig arranged on the uppermost side when the first jig 10, the second jig 20, and the third jig 30 are combined (see FIG. 10 described later).

The third jig side fixing member 32 attracts the second jig side fixing member 22 by a magnetic force. The 3rd jig | tool 30 has the 3rd jig | tool side fixing member 32 in the center part.
When the second jig 20 and the third jig 30 are fixed, the removal exposing portion 34 is exposed when viewed from the second jig 20 side (visible or overlapped with the second jig 20 and the lead frame 110). (It can also be said that it does not become.) It is a site | part (refer FIG.9 (b) mentioned later). In the first embodiment, the removal exposure portion 34 includes a through hole 28 formed in the second jig 20 (see FIG. 2) and a through hole 114 formed in the lead frame 110 (see FIG. 7 described later). Therefore, when the second jig 20 and the third jig 30 are fixed, they are exposed when viewed from the second jig 20 side. In addition, the shape of the exposure part for removal in this invention is not restricted to what was mentioned above, What is necessary is just a shape corresponding to the convex part for 3rd jig | tool removal mentioned later.

  When the second jig 20 and the third jig 30 are combined and fixed, the opening 36 overlaps with the substrate opening 24 of the second jig 20 and has an opening area larger than that of the substrate opening 24. Is small. The opening 36 has a function of reducing the weight of the third jig 30 and a function of releasing gas generated during reflow. If the above function is not necessary, a third jig having no opening may be used.

The second jig 20 and the third jig 30 are arranged on the second jig side in a state where the lead frame 110 is sandwiched so that the lead frame side connection portion 112 of the lead frame 110 is exposed when viewed from the second jig 20 side. It can be fixed by the magnetic force between the fixing member 22 and the third jig side fixing member 32 (see FIG. 9 described later).
Note that when the second jig 20 and the third jig 30 are fixed, the magnetic force between the second jig side fixing member 22 and the third jig side fixing member 32 is used. The side fixing member 22 and the third jig side fixing member 32 do not need to be in direct contact with each other.

At least one of the second jig side fixing member 22 and the third jig side fixing member 32 is made of a permanent magnet. In the first embodiment, both the second jig side fixing member 22 and the third jig side fixing member 32 are made of samarium cobalt-based permanent magnets.
The “samarium-cobalt permanent magnet” is a kind of rare earth magnet and refers to a permanent magnet containing samarium and cobalt. The samarium-cobalt permanent magnet has a high Curie temperature and can be used at a relatively high temperature (depending on the type, up to about 350 ° C.).

The removal jig 40 according to the first embodiment is a jig for removing the second jig 20 and the third jig 30 from the lead frame 110. As shown in FIG. 4, the removal jig 40 includes a base 41 and a third jig removal projection 42.
The base 41 is a member that supports the third jig removing convex part 42.
The third jig removing convex portion 42 is a convex portion corresponding to the position of the removing exposed portion 34 in the third jig 30. The third jig removing convex portion 42 has a cylindrical shape (pin shape). In addition, the shape of the convex part for 3rd jig | tool removal is not restricted to a column shape, What is necessary is just the shape corresponding to the exposure part for removal. The same applies to other protrusions (see, for example, Embodiment 3) that the removal jig of the present invention can have.

Next, a method for manufacturing the electrical device according to the first embodiment will be described.
Note that the present invention is a method (semiconductor) for manufacturing a semiconductor device which is a device having various semiconductor components (MOSFET, IGBT, diode, an integrated circuit in which these elements are integrated into one), among other electrical devices. The present invention can be suitably applied to a device manufacturing method).

In the method for manufacturing an electrical device according to the first embodiment, an electrical device having a structure in which the board-side connection portion 102 of the circuit board 100 and the leadframe-side connection portion 112 of the lead frame 110 are joined by the conductive joining material 120 is used. A method of manufacturing an electrical device for manufacturing, as shown in FIG. 5, includes a first step S10, a second step S20, a third step S30, a fourth step S40, and a fifth step S50. Include in this order. The method for manufacturing the electrical device is a method using the first jig 10, the second jig 20, and the third jig 30 for aligning the circuit board 100 and the lead frame 110.
Hereinafter, each step will be described.

As shown in FIG. 6, the first step S <b> 10 prepares a first jig 10 having a substrate placement portion 12 for placing the circuit board 100, and places the circuit board 100 on the first jig 10. It is a process to do.
In the present invention, various circuit boards can be used. In particular, a circuit board obtained by bonding a circuit made of a copper plate to a board made of alumina ceramics by a DCB method, that is, a so-called DCB board can be preferably used.

  The circuit board 100 includes a board-side connection part 102 that is connected to the lead frame-side connection part 112 via a bonding material 120. The board side connection part 102 is an end part of an electric circuit, for example. Although not shown, various electronic components and the like are mounted on the circuit board 100, and an electric circuit is formed.

  In the first embodiment, a total of three circuit boards 100 are placed, one on each of the three board placement parts 12. In the first embodiment, the circuit board 100 is placed so as to be fitted into the fixed recess 13 (see FIG. 1). Note that the above is an example, and in the present invention, the number of circuit boards placed on the board placement unit can be any number depending on the type of electrical equipment to be manufactured, the scale of production, and the like.

In the first step S <b> 10, after the circuit board 100 is placed on the first jig 10, the bonding material 120 is disposed on the board-side connection portion 102 of the circuit board 100.
As the bonding material 120, for example, a solder paste (a paste obtained by adding an organic solvent or the like to solder powder) can be suitably used. When solder paste is used as the bonding material, the bonding material can be arranged by using a screen printing method.

  In the first embodiment, when the second jig 20 and the third jig 30 sandwiching the lead frame 110 are placed on the first jig 10 as the first jig 10, the lead frame side The first jig having the height adjusting part 14 for adjusting the height position of the second jig 20 is used so that the height position of the connecting part 112 is appropriate with respect to the board-side connecting part 102.

Before describing the second step S20, the lead frame 110 used in the first embodiment will be described.
As shown in FIG. 7, the lead frame 110 has a lead frame side connection portion 112 and a through hole 114 is formed.
The through hole 114 is a through hole for allowing the third jig removing convex portion 42 to pass therethrough. The through holes 114 are circular through holes, and are formed at four locations so as to surround the central lead frame side connection portion 112.
The “lead frame” in this specification is a component made of a conductor for exchanging electrical signals between a circuit board or an electronic component on the circuit board and an electronic component outside the circuit board. In the present invention, a metal lead frame, particularly a lead frame made of copper can be preferably used.

  In the second step S20, the second jig 20 having the second jig-side fixing member 22 and the third jig 30 having the third jig-side fixing member 32 that attracts the second jig-side fixing member 22 by magnetic force. The lead frame 110 is sandwiched between the second jig 20 and the third jig 30 so that the lead frame side connection portion 112 is exposed when viewed from the second jig 20 side. This is a step of fixing the second jig 20 and the third jig 30 by the magnetic force between the second jig side fixing member 22 and the third jig side fixing member 32 (see FIGS. 8 and 9).

In the second step S20, first, the lead frame 110 is placed on the second jig 20 (see FIG. 8), and then the third jig 30 is placed on the second jig 20 and the lead frame 110. By placing, the lead frame 110 is sandwiched between the second jig 20 and the third jig 30 (see FIG. 9).
In the second step S20, as the second jig 20, a second jig in which the substrate opening 24 corresponding to the position of the substrate side connection portion 102 is formed is used.
In the second step S20, the lead frame 110 is sandwiched between the second jig 20 and the third jig 30 so that the lead frame side connection portion 112 is exposed from the substrate opening 24 when viewed from the second jig 20 side. (See FIG. 9B.)

  Although not shown in the drawings, in the method of manufacturing an electrical device according to the present invention, the first jig, the second jig, the third jig, and the lead frame having alignment protrusions, recesses, through holes, and the like are used. It can also be used.

In the third step S30, as shown in FIG. 10, the second jig 20 and the third jig 30 are placed so that the lead frame side connection portion 112 is positioned on the substrate side connection portion 102 via the bonding material 120. And it is the process of mounting the 2nd jig | tool 20 on the 1st jig | tool 10 toward the 1st jig | tool 10 side.
In the third step S <b> 30, the second jig 20 and the third jig 30 are placed on the first jig 10 so that the second jig 20 is placed on the height adjustment unit 14.

In the fourth step S40, as shown in FIG. 11, reflow is performed with the first jig 10, the second jig 20, and the third jig 30 attached, and the substrate side connection portion 102 and the lead frame side connection portion 112 are connected. Are joined by a joining material. The code | symbol 122 of FIG. 11 is the joining material solidified after reflow.
The reflow temperature and time can be appropriately determined depending on the type of bonding material, the type of circuit board, and the like.

In the fifth step S50, as shown in FIG. 12, after the second jig 20 and the third jig 30 are removed from the first jig 10, the second jig 20 and the second jig 20 are removed using the removal jig 40. 3 is a step of removing the jig 30 from the lead frame 110.
In the first embodiment, the removal of the second jig 20 and the third jig 30 from the first jig 10 can be performed, for example, by lifting the second jig 20 and the third jig 30 manually. it can.

  In the fifth step S50, the second jig 20 and the third jig 30 are placed on the removal jig 40 with the third jig removal convex portion 42 and the removal exposure portion 34 in contact with each other. After that (see FIGS. 12A and 12B), the second jig 20 and the third jig 30 are separated by pressing the pressing exposed portion 26 toward the removing jig 40. Then, the second jig 20 and the third jig 30 are removed from the lead frame 110 (see FIGS. 12C and 12D). The pressing may be performed manually or using a machine.

  In Embodiment 1, what joined the circuit board 100 and the lead frame 110 can be taken out by 5th process S50. Thereafter, the electrical device can be manufactured through a process of separating the lead frame 110 for each circuit board 100 and a process of combining the circuit board 100 and the lead frame 110 with other components of the electrical equipment. About processes other than 1st process S10-5th process S50 other than above-mentioned, since a general process can be used in the technical field of an electric equipment, description is abbreviate | omitted.

  Hereinafter, the effects of the method for manufacturing the electrical device according to the first embodiment, the manufacturing jig (the first jig 10, the second jig 20, and the third jig 30) and the removal jig 40 will be described.

  The method for manufacturing an electrical device according to the first embodiment uses the first jig 10, the second jig 20, and the third jig 30 that align the circuit board 100 and the lead frame 110. This is a method for manufacturing an electrical device capable of performing reflow while maintaining a proper positional relationship with the frame.

  In addition, according to the method for manufacturing an electrical device according to the first embodiment, the second jig 20 and the third jig 30 are connected to the second jig 20 and the third jig 30 with the lead frame 110 sandwiched between the second jig 20 and the third jig 30. Since the second step S20 for fixing with the magnetic force between the 2 jig side fixing member 22 and the third jig side fixing member 32 is included, the lead frame is formed by the second jig side fixing member and the third jig side fixing member. By applying a pressing force, it is possible to suppress the occurrence of poor bonding due to the elasticity of the lead frame.

  In addition, according to the method for manufacturing an electrical device according to the first embodiment, since the fourth step S40 is performed in which reflow is performed with the first jig 10, the second jig 20, and the third jig 30 being attached, It is possible to suppress the warpage of the circuit board and the lead frame in the step, and as a result, it is possible to suppress the occurrence of bonding failure due to the warp of the circuit board and the lead frame during reflow.

  In addition, according to the method for manufacturing an electrical device according to the first embodiment, since the second jig 20 and the third jig 30 are removed from the lead frame 110 using the removal jig 40, the fifth step S50 is included. The second jig and the third jig fixed by the magnetic force can be removed smoothly.

  Moreover, according to the manufacturing method of the electric equipment which concerns on Embodiment 1, since both the 2nd jig | tool side fixing member 22 and the 3rd jig | tool side fixing member 32 consist of permanent magnets, the magnetic force from both fixing members is produced. By using this, it is possible to suppress the occurrence of bonding failure due to the elasticity of the lead frame with higher accuracy.

  In addition, according to the method for manufacturing an electrical device according to the first embodiment, at least one of the second jig side fixing member 22 and the third jig side fixing member 32 is made of a samarium-cobalt permanent magnet. It is possible to suppress a decrease in fixing force during reflow using a strong permanent magnet.

  Further, according to the method for manufacturing an electrical device according to the first embodiment, the second jig 20 is a second jig having the second jig side fixing member 22 at the center, and the third jig 30 is the first jig. Since the third jig having the three jig side fixing member 32 in the central portion is used, the second jig and the third jig are relatively comparatively compared with the case of using the jig having the fixing member in the peripheral portion. It becomes possible to apply a uniform fixing force.

  In addition, according to the method for manufacturing an electrical device according to the first embodiment, the second jig 20 in which the substrate opening 24 is formed is used as the second jig 20, and in the second step S20, the lead frame side connection portion 112 is used. Since the lead frame 110 is sandwiched between the second jig 20 and the third jig 30 such that the lead frame 110 is exposed from the board opening 24, the position of the board opening is set appropriately. Compared to the case where no opening is used, it is possible to cope with lead frames having various shapes.

  In addition, according to the method of manufacturing an electrical device according to the first embodiment, the second jig 20 further includes the pressing exposure portion 26 and the third jig 30 further includes the removal exposure portion 34. The third jig is used, and the removal jig having the third jig removal convex portion 42 is used as the removal jig 40. In the fifth step S50, the third jig removal convex portion 42 and the removal jig 40 are removed. After placing the second jig 20 and the third jig 30 on the removal jig 40 in contact with the exposed portion 34, the pressing exposed portion 26 faces the direction of the removal jig 40. To separate the second jig 20 and the third jig 30 from each other and to remove the second jig 20 and the third jig 30 from the lead frame 110. Remove the fixed second jig and third jig smoothly. It can be removed to become.

  In the method for manufacturing an electrical device according to the first embodiment, in the first step S10, the circuit board 100 is placed on the first jig 10 and then the bonding material 120 is disposed on the circuit board 100. By disposing the bonding material on the bonding material, it is possible to reduce the possibility that impurities are mixed into the bonding material.

  Moreover, in the manufacturing method of the electrical equipment according to the first embodiment, the first jig having the height adjustment unit 14 is used as the first jig 10, and the second jig 20 is the height adjustment unit in the third step S <b> 30. 14, the second jig 20 and the third jig 30 are placed on the first jig 10 so that the distance between the board-side connecting portion and the lead frame-side connecting portion is set by the height adjusting portion. Can be kept appropriate.

  The manufacturing jig according to the first embodiment includes the first jig 10, the second jig 20, and the third jig 30 that align the circuit board 100 and the lead frame 110. When an electrical apparatus is manufactured using the manufacturing jig according to the above, it is possible to perform reflow while keeping the positional relationship between the circuit board and the lead frame in an appropriate state.

  Further, according to the manufacturing jig according to the first embodiment, the second jig 20 and the third jig 30 are the second jig 20 and the third jig 30 in the state where the lead frame 110 is sandwiched. Since it can be fixed by the magnetic force between the 2 jig side fixing member 22 and the 3rd jig side fixing member 32, a pressing force is applied to the lead frame by the 2nd jig side fixing member and the 3rd jig side fixing member. Thus, it is possible to suppress the occurrence of poor bonding due to the elasticity of the lead frame.

  In addition, according to the manufacturing jig according to the first embodiment, by performing reflowing with the first jig 10, the second jig 20, and the third jig 30 attached to the lead frame, the circuit board at the time of reflowing In addition, it is possible to suppress the warping of the lead frame, and as a result, it is possible to suppress the occurrence of bonding failure due to the warping of the circuit board and the lead frame during reflow.

  Further, according to the manufacturing jig according to the first embodiment, since both the second jig side fixing member 22 and the third jig side fixing member 32 are made of permanent magnets, the magnetic force from both the fixing members is used. As a result, it is possible to suppress the occurrence of poor bonding due to the elasticity of the lead frame with higher accuracy.

  Further, according to the manufacturing jig according to the first embodiment, at least one of the second jig-side fixing member 22 and the third jig-side fixing member 32 is made of a samarium-cobalt permanent magnet, and is resistant to high temperatures. It becomes possible to suppress a reduction in fixing force during reflow using a permanent magnet.

  Further, according to the manufacturing jig according to the first embodiment, the second jig 20 has the second jig side fixing member 22 in the center portion, and the third jig 30 has the third jig side fixing member 32. Therefore, it is possible to apply a relatively uniform fixing force to the entire second jig and the third jig as compared with the case where a jig having a fixing member in the peripheral portion is used.

  Further, according to the manufacturing jig according to the first embodiment, since the substrate opening 24 is formed in the second jig 20, the position of the substrate opening can be set appropriately, so Compared to the case where no opening is used, it is possible to cope with lead frames having various shapes.

  Further, according to the manufacturing jig according to the first embodiment, the second jig 20 has the pressing exposed portion 26, and the third jig 30 has the removing exposed portion 34. By using together with the tool, the second jig and the third jig fixed by magnetic force can be smoothly removed by a simple method of pressing.

  Further, according to the manufacturing jig according to the first embodiment, since the first jig 10 has the height adjusting portion 14, the distance between the substrate side connecting portion and the lead frame side connecting portion by the height adjusting portion. Can be kept appropriate.

  According to the removal jig 40 according to the first embodiment, since the third jig removal convex portion 42 is provided, the second jig and the third jig fixed by magnetic force can be used together with the corresponding production jig. It is possible to remove the jig smoothly.

[Embodiment 2]
The manufacturing jig according to the second embodiment basically has the same configuration as the manufacturing jig according to the first embodiment, but the configuration of the first jig is the same as the manufacturing jig according to the first embodiment. Different.

  The manufacturing jig according to the second embodiment includes a first jig 50, a second jig 20, and a third jig 30. Among these, since the 2nd jig | tool 20 and the 3rd jig | tool 30 have the structure similar to the 2nd jig | tool 20 and the 3rd jig | tool 30 in Embodiment 1, description is abbreviate | omitted.

The first jig 50 basically has the same configuration as that of the first jig 10 in the first embodiment, and includes a substrate platform 12 and a height adjuster 14 as shown in FIG. The first jig 50 is different from the first jig 10 in that a through hole 52 corresponding to the removal exposure portion 34 is formed. The through holes 52 are formed at four positions overlapping the through holes 28 of the second jig 20 when viewed from above.
Since the through hole 52 is formed in the first jig 50, the removal exposure part 34 of the third jig 30 connects the second jig 20 and the third jig 30 to the first as shown in FIG. 14. When placed on the jig 50, it becomes a portion exposed (not overlapping the first jig 50, the second jig 20, and the lead frame 110) when viewed from the first jig 50 side.

  Since the removal jig 40 according to the second embodiment has the same configuration as the removal jig 40 according to the first embodiment, the description thereof is omitted.

Next, a method for manufacturing an electrical device according to the second embodiment will be described.
The manufacturing method of the electric device according to the second embodiment is basically the same method as the manufacturing method of the electric device according to the first embodiment. However, the fifth step is a point using the first jig 50 in the second embodiment. However, this is different from the method for manufacturing the electrical apparatus according to the first embodiment.

  The first step to the fourth step in the second embodiment are exactly the same as the first step S10 to the fourth step S40 in the first embodiment except that the first jig 50 is used, and thus description thereof is omitted.

  In the fifth step in the second embodiment, as shown in FIG. 15, the first jig is placed on the removal jig 40 with the third jig removal projection 42 and the removal exposure part 34 in contact with each other. 50, the second jig 20 and the third jig 30 are placed, and the second jig 20 and the third jig 30 are removed from the first jig 50.

  The details are as follows. That is, when the first jig 50, the second jig 20, and the third jig 30 are placed on the removal jig 40 as described above (see FIGS. 15A and 15B), Since the first jig 50, the second jig 20, and the third jig 30 are not fixed, the first jig 50 pulled by gravity is separated from the second jig 20 and the third jig 30. The After that, the second jig 20 and the third jig 30 are separated by pressing the pressing exposed portion 26 of the second jig 20 in the direction of the detaching jig 40 as in the first embodiment, The second jig 20 and the third jig 30 can be removed from the lead frame 110 (see FIGS. 15C and 15D).

  The fifth step S50 in the first embodiment and the fifth step in the second embodiment are different from each other as described above, but “after removing the second jig and the third jig from the first jig, This is common in that the second jig and the third jig are removed from the lead frame using a removal jig.

  As described above, the method for manufacturing the electrical device according to the second embodiment is different from the method for manufacturing the electrical device according to the first embodiment in that the first jig 50 is used and the fifth step is different from that in the first embodiment. Since the first jig, the second jig, and the third jig for aligning the circuit board and the lead frame are used, the positional relationship between the circuit board and the lead frame is determined in the same manner as in the electrical device manufacturing method according to FIG. It becomes the manufacturing method of the electric equipment which can perform reflow, maintaining at an appropriate state.

  Further, according to the method of manufacturing an electrical device according to the second embodiment, in the fifth step, the third jig removing convex portion 42 and the removing exposed portion 34 are in contact with each other on the removing jig 40. Since the first jig 50, the second jig 20, and the third jig 30 are placed on the first jig 50, the second jig 20 and the third jig 30 are removed from the first jig 50. The second jig 20 and the third jig 30 can be smoothly separated from 50.

  Note that the electrical device manufacturing method according to the second embodiment has a corresponding effect among the effects of the electrical device manufacturing method according to the first embodiment.

  As described above, the manufacturing jig according to the second embodiment is the same as the manufacturing jig according to the first embodiment, although the configuration of the first jig is different from that of the manufacturing jig according to the first embodiment. In addition, since the first jig, the second jig, and the third jig for aligning the circuit board and the lead frame are included, the positional relationship between the circuit board and the lead frame is appropriately set when manufacturing an electrical device. It is possible to perform reflow while maintaining a stable state.

  In addition, according to the manufacturing jig according to the second embodiment, the removal exposure portion 34 has the first jig when the second jig 20 and the third jig 30 are placed on the first jig 50. Since the portion is exposed when viewed from the tool 50 side, the second jig 20 and the third jig 30 can be smoothly separated from the first jig 50 by using together with the corresponding removal jig 40. Become.

  The manufacturing jig according to the second embodiment has a corresponding effect among the effects of the manufacturing jig according to the first embodiment.

[Embodiment 3]
The manufacturing jig according to the third embodiment basically has the same configuration as the manufacturing jig according to the second embodiment, but the configuration of the first jig and the second jig is the manufacturing according to the second embodiment. It is different from the jig for use.

The manufacturing jig according to the third embodiment includes a first jig 60, a second jig 70, and a third jig 30. Since the third jig 30 has the same configuration as the third jig 30 in the first embodiment, the description thereof is omitted.
The manufacturing jig according to the third embodiment is for finishing the fifth step in a state where all the jigs and the lead frame are separated, as shown in a method for manufacturing an electrical device according to the third embodiment to be described later. Yes (see FIG. 20 described later). The exposed portion and the through hole of the manufacturing jig according to the third embodiment exist for the fifth step.

  The first jig 60 basically has the same configuration as that of the first jig 50 according to the second embodiment, and has a substrate mounting portion 12 and a height adjusting portion 14 as shown in FIG. A through hole 52 is formed. The first jig 60 differs from the first jig 50 in that a through hole 62 corresponding to a receiving exposed portion 72 and a second jig receiving convex portion 82 to be described later and a lead frame receiving convex portion 84 to be described later. The through-hole 64 corresponding to is formed. The through holes 62 are formed at positions different from the through holes 52, specifically, at four locations outside the through holes 52. Further, the through holes 64 are arranged at four locations further outside the through hole 62.

The second jig 70 basically has the same configuration as the second jig 20 in the second embodiment. As shown in FIG. 17, the second jig-side fixing member 22 and the pressing exposed portion 26 are provided. The substrate opening 24 and the through hole 28 are formed. The second jig 70 is different from the second jig 20 when the second jig 70 and the third jig 30 are placed on the first jig 60 as viewed from the first jig 60 side. This is a point having a receiving exposed portion 72 that is an exposed portion (a portion that does not overlap the first jig 60; see FIG. 19 described later). The receiving exposed portion 72 has the through hole 62 of the first jig 60, so that the second exposed jig 70 and the third jig 30 are placed on the first jig 60 when the second jig 70 and the third jig 30 are placed on the first jig 60. It becomes a part exposed as viewed from the side of one jig 60.
Further, a through hole 74 is formed in the second jig 70. The through hole 74 is a through hole corresponding to a lead frame receiving convex portion 84 described later. The through holes 74 are arranged at four locations outside the through holes 28.

  The removal jig 80 according to the third embodiment basically has the same configuration as the removal jig 40 according to the second embodiment, but includes a second jig receiving convex portion and a lead frame receiving convex portion. It differs from the removal jig | tool 40 which concerns on Embodiment 2 by the point which has.

As shown in FIG. 18, the removal jig 80 includes a base 41, a third jig removal convex part 42, a second jig receiving convex part 82, and a lead frame receiving convex part 84.
The second jig receiving convex portion 82 is a convex portion having a shorter length than the third jig removing convex portion 42 and corresponding to the position of the receiving exposed portion 72 in the second jig 70. is there.
The lead frame receiving convex portion 84 has a shorter protruding length than the third jig removing convex portion 42, a longer protruding length than the second jig receiving convex portion 82, and the second jig. It is a convex portion corresponding to the position of the through hole 74 in the tool 70.

Next, a method for manufacturing an electrical device according to the third embodiment will be described.
The manufacturing method of the electrical device according to the third embodiment is basically the same method as the manufacturing method of the electrical device according to the second embodiment, but the first jig 60, the second jig 70, and the The point of using the removal jig 80 according to the third embodiment and the fifth step are different from the method for manufacturing the electrical device according to the second embodiment.

  The first step to the fourth step according to the third embodiment are the same as the first step to the fourth step according to the second embodiment except that the first jig 60 and the second jig 70 are used. The detailed explanation is omitted. Since the first jig 60 and the second jig 70 are used, the first jig 60, the second jig 70, the third jig 30, and the lead frame 110 when the third step in the third embodiment is finished. Is in a state as shown in FIG.

In the fifth step according to Embodiment 3, a removal jig 80 is used as shown in FIG.
The details are as follows. That is, when the first jig 60, the second jig 70, and the third jig 30 are placed on the removal jig 80 (see FIGS. 20A and 20B), the first jig 60 is used. Since the second jig 70 and the third jig 30 are not fixed, the first jig 60 pulled by gravity is separated from the second jig 70 and the third jig 30. After that, the second jig 70 and the third jig 30 are separated by pressing the pressing exposed portion 26 of the second jig 70 in the direction of the detaching jig 80 as in the second embodiment, When the second jig 70 and the third jig 30 are removed from the lead frame 110, the second jig 70 stops on the second jig receiving projection 82, and the lead frame 110 is the lead frame receiving projection 84. The fifth step is finished with the first jig 60, the second jig 70, the lead frame 110, and the third jig 30 separated (see FIGS. 20C and 20D).

  The fifth step S50 in the first embodiment and the fifth step in the second embodiment and the fifth step in the third embodiment have the above differences, but “from the first jig to the second jig and the second jig. After removing the three jigs, the second jig and the third jig are removed from the lead frame using the removal jig.

  As described above, the method of manufacturing the electrical device according to the third embodiment uses the first jig 60 and the second jig 70 according to the third embodiment and the removal jig 80 according to the third embodiment, and fifth. The first jig for aligning the circuit board and the lead frame is similar to the method for manufacturing the electric device according to the second embodiment, although the process is different from that of the method for manufacturing the electric device according to the second embodiment. Since the second jig and the third jig are used, the manufacturing method of the electrical device is capable of performing reflow while keeping the positional relationship between the circuit board and the lead frame in an appropriate state.

  Further, according to the method of manufacturing an electrical device according to the third embodiment, the second jig having the receiving exposed portion 72 is used as the second jig 70, and the second jig receiving convex portion is used as the removing jig 80. Since the removal jig having 82 is used, the fifth step can be completed in a state where the first jig and the second jig are separated. It is possible to increase the production efficiency by easily separating the two jigs.

  In addition, according to the method for manufacturing an electrical device according to the third embodiment, the second jig 70 in which the through hole 74 is formed is used as the second jig 70, and the lead frame receiving convex portion 84 is used as the removal jig 80. Since the removal jig is used, the fifth step can be completed with the lead frame separated from the jig. As a result, it is easy to separate the jig from the lead frame when collecting the jig. Production efficiency can be further increased.

  Note that the electrical device manufacturing method according to Embodiment 3 has a corresponding effect among the effects of the electrical device manufacturing method according to Embodiment 2.

  As described above, the manufacturing jig according to the third embodiment is different from the manufacturing jig according to the second embodiment in that the second jig further including a receiving exposed portion is used as the second jig. Like the manufacturing jig according to the second embodiment, the first jig, the second jig, and the third jig that align the circuit board and the lead frame are included. Reflow can be performed while maintaining a proper positional relationship between the circuit board and the lead frame.

  Further, according to the manufacturing jig according to the third embodiment, since the second jig 70 has the receiving exposed portion 72, the first jig and the second jig can be used together with the corresponding removal jig. It is possible to finish the fifth step in a separated state, and as a result, it is possible to facilitate the separation of the first jig and the second jig at the time of collecting the jig and increase the production efficiency. Become.

  Further, according to the manufacturing jig according to the third embodiment, since the through hole 74 is formed in the second jig 70, the lead frame is separated from the jig by using it with the corresponding removing jig. In this state, the fifth step can be completed. As a result, it is possible to easily separate the jig and the lead frame at the time of collecting the jig, and to further increase the production efficiency.

  The manufacturing jig according to the third embodiment has a corresponding effect among the effects of the manufacturing jig according to the second embodiment.

  As described above, the removal jig 80 according to the third embodiment is different from the removal jig 40 according to the second embodiment in that the removal jig 80 according to the third embodiment has a second jig receiving projection 82. Similar to the removal jig 40, since it has the third jig removal convex part 42, the second jig and the third jig fixed by magnetic force can be smoothly used by using together with the corresponding production jig. Can be removed.

  Moreover, according to the removal jig | tool 80 which concerns on Embodiment 3, since it has the 2nd jig | tool receiving convex part 82, a 1st jig | tool and a 2nd jig | tool are used by using with the corresponding manufacturing jig | tool. As a result, the fifth step can be completed in a separated state, and as a result, the first jig and the second jig can be easily separated at the time of collecting the jig, and the production efficiency can be increased. .

  Further, according to the removal jig 80 according to the third embodiment, since the lead frame receiving convex portion 84 is provided, it is used together with the corresponding manufacturing jig so that the lead frame is separated from the jig in the fifth state. It is possible to finish the process, and as a result, it is possible to facilitate the separation of the jig and the lead frame at the time of collecting the jig and further increase the production efficiency.

  As mentioned above, although this invention was demonstrated based on said each embodiment, this invention is not limited to each said embodiment. The present invention can be carried out in various modes without departing from the spirit thereof, and for example, the following modifications are possible.

(1) The dimensions, shapes, positions, numbers, etc. of the components, through-holes, protrusions, dents, etc. described in the above embodiments are exemplifications, and can be changed within a range not impairing the effects of the present invention. .

(2) In the above embodiments, the second jig side fixing member and the third jig side fixing member made of permanent magnets are used. However, the present invention is not limited to this. The permanent magnet may be one of the second jig side fixing member and the third jig side fixing member. In addition, when the fixing member which consists of a permanent magnet is only one side, what consists of a material attracted | sucked with a permanent magnet is used as the other fixing member.

(3) In each of the above embodiments, a samarium-cobalt permanent magnet is used, but the present invention is not limited to this. A permanent magnet other than samarium cobalt may be used as long as it can withstand the temperature during reflow (it does not demagnetize or the magnetic force does not weaken to the extent that it cannot be used).

(4) In each of the above-described embodiments, the present invention has been described with reference to an example of a method for manufacturing an electrical device in which the first step S10 and the second step S20 are performed in this order. However, the present invention is not limited to this. is not. In the method for manufacturing an electrical device of the present invention, the first step and the second step may be performed simultaneously, or the second step may be performed prior to the first step.

(5) In each of the above embodiments, the pressing exposed portion 26 is a portion protruding from the outer edge of the second jig 20, 70, and the removing exposed portion 34 is formed in the second jig 20, 70 at the through hole 28. However, the present invention is not limited to this. For example, the exposed portion for pressing may be a portion exposed when the third jig has a through hole (in this case, in the fifth step, the second jig is pressed through the through hole of the third jig. Then, the second jig and the third jig are separated), and the exposed portion for removal may be a portion protruding from the outer edge of the third jig. The same applies to the receiving exposed portion 72 in the third embodiment. For example, the receiving exposed portion may be a portion protruding from the outer edge of the second jig.

(6) In each of the above embodiments, the first step S10 in which the bonding material 120 is disposed on the circuit board 100 after the circuit board 100 is placed on the first jig 10 has been described as an example. It is not limited to this. In the method for manufacturing an electrical device of the present invention, the first step of placing a bonding material on the circuit board can be employed before the circuit board is placed on the first jig.

(7) In each of the above embodiments, the description has been given using the lead frame 110 in which the through hole 114 is formed, but the present invention is not limited to this. A lead frame in which no through hole is formed can also be used. In this case, it is preferable that the exposed portion for removing the third jig is in a position that does not overlap the lead frame when viewed from above.

DESCRIPTION OF SYMBOLS 10, 50, 60 ... 1st jig | tool, 12 ... Board | substrate mounting part, 13 ... Fixed recessed part, 14 ... Height adjustment part, 20, 70 ... 2nd jig, 22 ... 2nd jig side fixing member, 24 ... Opening for substrate, 26 ... Exposed part for pressing, 28, 52, 62, 64, 74, 114 ... Through hole, 30 ... Third jig, 32 ... Third jig side fixing member, 34 ... Exposure for removal 36, opening, 40, 80 ... removal jig, 41 ... base, 42 ... third jig removal convex part, 72 ... receiving exposure part, 82 ... second jig receiving convex part, 84: convex part for receiving the lead frame, 100 ... circuit board, 102 ... board side connection part, 110 ... lead frame, 112 ... lead frame side connection part, 120 ... bonding material

Claims (21)

A method of manufacturing an electrical device for manufacturing an electrical device having a structure in which a board-side connection portion of a circuit board and a lead frame-side connection portion of a lead frame are joined by a conductive joining material,
Preparing a first jig having a substrate placement portion for placing the circuit board, and placing the circuit board on the first jig;
A second jig having a second jig-side fixing member and a third jig having a third jig-side fixing member that attracts the second jig-side fixing member by a magnetic force are prepared. When the lead frame is sandwiched between the second jig and the third jig so that the lead frame side connection portion is exposed when viewed, the second jig and the third jig are connected to the second jig. A second step of fixing with a magnetic force between the jig side fixing member and the third jig side fixing member;
The second jig and the third jig are arranged such that the lead frame side connecting portion is positioned on the substrate side connecting portion via the bonding material, and the second jig is attached to the first jig. A third step of placing on the first jig toward the tool side;
Reflowing with the first jig, the second jig, and the third jig attached, and a fourth step of joining the substrate side connection portion and the lead frame side connection portion with the joining material;
A fifth step of removing the second jig and the third jig from the lead frame using a removal jig after removing the second jig and the third jig from the first jig. Including
At least one of the second jig side fixing member and the third jig side fixing member is made of a permanent magnet,
The method for manufacturing an electrical device, wherein the third step, the fourth step, and the fifth step are performed in this order. In the manufacturing method of the electric equipment according to claim 1,
Both the 2nd jig side fixing member and the 3rd jig side fixing member consist of permanent magnets, The manufacturing method of the electric equipment characterized by the above-mentioned. In the manufacturing method of the electric equipment of Claim 1 or 2,
At least one of the second jig side fixing member and the third jig side fixing member is made of a samarium cobalt-based permanent magnet. In the manufacturing method of the electric equipment in any one of Claims 1-3,
As the second jig, a second jig having the second jig side fixing member at the center is used.
A method of manufacturing an electrical device, wherein a third jig having a third jig-side fixing member at a central portion is used as the third jig. In the manufacturing method of the electric equipment in any one of Claims 1-4,
As the second jig, a second jig in which an opening for a substrate corresponding to the position of the substrate side connection portion is formed,
In the second step, the lead frame is sandwiched between the second jig and the third jig so that the lead frame side connection portion is exposed from the substrate opening when viewed from the second jig side. A method for manufacturing an electrical device, characterized in that the device is in an open state. In the manufacturing method of the electric equipment in any one of Claims 1-5,
As the second jig, a second jig further having a pressing exposed portion, which is a portion exposed when viewed from the third jig side when the second jig and the third jig are fixed, is used. ,
As the third jig, there is used a third jig further having a removal exposure part which is a part exposed when viewed from the second jig side when the second jig and the third jig are fixed. ,
As the removal jig, using a removal jig having a third jig removal projection corresponding to the position of the removal exposure portion,
In the fifth step, the second jig and the third jig are placed on the removal jig in a state where the convex part for removing the third jig and the exposed part for removal are in contact with each other. After that, the second jig and the third jig are separated by pressing the exposed portion for pressing in the direction of the removal jig, and the second jig and the third jig. Is removed from the lead frame. In the manufacturing method of the electric equipment according to claim 6,
The removal exposure portion is a portion exposed when viewed from the first jig side when the second jig and the third jig are placed on the first jig,
In the fifth step, the first jig, the second jig, and the second jig are placed on the removal jig in a state where the third jig removal convex portion and the removal exposed portion are in contact with each other. A method of manufacturing an electrical device, wherein the second jig and the third jig are removed from the first jig by placing three jigs. In the manufacturing method of the electric equipment according to claim 7,
As the second jig, a receiving exposed portion which is a portion exposed when viewed from the first jig side when the second jig and the third jig are placed on the first jig. In addition, using the second jig that has
The detaching jig further has a second jig receiving convex part that is shorter than the third jig detaching convex part and that further corresponds to the position of the receiving exposed part. A method for manufacturing an electrical device, wherein a jig is used. In the manufacturing method of the electric equipment in any one of Claims 1-8,
In the first step, after the circuit board is placed on the first jig, the bonding material is disposed on the circuit board. In the manufacturing method of the electric equipment in any one of Claims 1-9,
As the first jig, when the second jig and the third jig sandwiching the lead frame are placed on the first jig, the height of the lead frame side connecting portion Using the first jig further having a height adjusting part for adjusting the height position of the second jig so that the position is appropriate with respect to the substrate side connecting part,
In the third step, the second jig and the third jig are placed on the first jig so that the second jig is placed on the height adjusting portion. Device manufacturing method. A manufacturing jig for use in the method for manufacturing an electrical device according to claim 1,
A first jig having a substrate placement portion for placing a circuit board; a second jig having a second jig side fixing member; and a third jig attracting the second jig side fixing member by a magnetic force. It consists of a set of three types of jigs with a third jig having a fixture side fixing member,
The second jig and the third jig are fixed to the second jig side in a state where the lead frame is sandwiched so that the lead frame side connection portion of the lead frame is exposed when viewed from the second jig side. It can be fixed by the magnetic force between the member and the third jig side fixing member,
The first jig includes the second jig and the third jig such that the lead frame side connection portion is positioned on the substrate side connection portion of the circuit board via a bonding material, and It can be placed with the second jig facing the first jig side,
The manufacturing jig, wherein at least one of the second jig side fixing member and the third jig side fixing member is made of a permanent magnet. The manufacturing jig according to claim 11,
Both the second jig side fixing member and the third jig side fixing member are made of permanent magnets. In the manufacturing jig according to claim 11 or 12,
At least one of the second jig side fixing member and the third jig side fixing member is made of a samarium-cobalt permanent magnet. In the manufacturing jig according to any one of claims 11 to 13,
The second jig has the second jig side fixing member in a central portion,
The third jig has a third jig-side fixing member at a central portion thereof, and is a manufacturing jig. In the manufacturing jig according to any one of claims 11 to 14,
The manufacturing jig according to claim 1, wherein a substrate opening corresponding to the position of the substrate side connection portion is formed in the second jig. In the manufacturing jig according to any one of claims 11 to 15,
The second jig further includes a pressing exposed portion that is a portion exposed when viewed from the third jig side when the second jig and the third jig are fixed.
The third jig further includes an exposed portion for removal which is a portion exposed when viewed from the second jig side when the second jig and the third jig are fixed. Jig. The manufacturing jig according to claim 16, wherein
The removal exposure portion is a portion exposed when viewed from the first jig side when the second jig and the third jig are placed on the first jig. Manufacturing jig. The manufacturing jig according to claim 17,
The second jig includes a receiving exposed portion which is a portion exposed when viewed from the first jig side when the second jig and the third jig are placed on the first jig. Furthermore, the manufacturing jig characterized by having. In the manufacturing jig according to any one of claims 11 to 18,
The first jig has a height of the lead frame side connecting portion when the second jig and the third jig with the lead frame sandwiched therebetween are placed on the first jig. A manufacturing jig, further comprising a height adjusting section that adjusts a height position of the second jig so that the position is appropriate with respect to the substrate-side connecting section. A removal jig for use in the method of manufacturing an electrical device according to claim 6,
A removal jig having a third jig removal projection corresponding to the position of the removal exposure part in the third jig. A removal jig for use in the method of manufacturing an electrical device according to claim 8,
A third jig removing convex part corresponding to the position of the removing exposed part in the third jig;
The second jig receiving convex part has a shorter projecting length than the third jig removing convex part and has a second jig receiving convex part corresponding to the position of the receiving exposed part in the second jig. Removal jig.

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