TWI229782B - Resist composition suitable for short wavelength exposure and resist pattern forming method - Google Patents

Resist composition suitable for short wavelength exposure and resist pattern forming method Download PDF

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Publication number
TWI229782B
TWI229782B TW092126682A TW92126682A TWI229782B TW I229782 B TWI229782 B TW I229782B TW 092126682 A TW092126682 A TW 092126682A TW 92126682 A TW92126682 A TW 92126682A TW I229782 B TWI229782 B TW I229782B
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TW
Taiwan
Prior art keywords
group
polymer
photoresist
photoresist composition
monomer unit
Prior art date
Application number
TW092126682A
Other languages
English (en)
Chinese (zh)
Other versions
TW200403529A (en
Inventor
Koji Nozaki
Ei Yano
Original Assignee
Fujitsu Ltd
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Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15026701&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI229782(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of TW200403529A publication Critical patent/TW200403529A/zh
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Publication of TWI229782B publication Critical patent/TWI229782B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
TW092126682A 1997-05-20 1998-04-22 Resist composition suitable for short wavelength exposure and resist pattern forming method TWI229782B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13013197A JP3819531B2 (ja) 1997-05-20 1997-05-20 レジスト組成物及びレジストパターン形成方法

Publications (2)

Publication Number Publication Date
TW200403529A TW200403529A (en) 2004-03-01
TWI229782B true TWI229782B (en) 2005-03-21

Family

ID=15026701

Family Applications (2)

Application Number Title Priority Date Filing Date
TW092126682A TWI229782B (en) 1997-05-20 1998-04-22 Resist composition suitable for short wavelength exposure and resist pattern forming method
TW087106189A TW565739B (en) 1997-05-20 1998-04-22 Resist composition suitable for short wavelength exposure and resist pattern forming method

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW087106189A TW565739B (en) 1997-05-20 1998-04-22 Resist composition suitable for short wavelength exposure and resist pattern forming method

Country Status (4)

Country Link
US (1) US6656659B1 (enExample)
JP (1) JP3819531B2 (enExample)
KR (1) KR100301354B1 (enExample)
TW (2) TWI229782B (enExample)

Families Citing this family (37)

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KR20000056355A (ko) * 1999-02-19 2000-09-15 김영환 고농도의 아민 존재하에서 우수한 특성을 갖는 포토레지스트 조성물
EP1041442B1 (en) 1999-03-31 2004-10-27 Sumitomo Chemical Company, Limited Chemical amplification type positive resist
US6479211B1 (en) * 1999-05-26 2002-11-12 Fuji Photo Film Co., Ltd. Positive photoresist composition for far ultraviolet exposure
KR100533361B1 (ko) * 1999-08-23 2005-12-06 주식회사 하이닉스반도체 유기 난반사 방지막 중합체 및 그의 제조방법
JP4282185B2 (ja) 1999-11-02 2009-06-17 株式会社東芝 フォトレジスト用高分子化合物及びフォトレジスト用樹脂組成物
TW581939B (en) * 1999-11-02 2004-04-01 Toshiba Corp A high molecular compound for photoresist and a photoresist resin composition
JP2001215704A (ja) 2000-01-31 2001-08-10 Sumitomo Chem Co Ltd 化学増幅型ポジ型レジスト組成物
US6406828B1 (en) * 2000-02-24 2002-06-18 Shipley Company, L.L.C. Polymer and photoresist compositions
JP4576737B2 (ja) 2000-06-09 2010-11-10 Ｊｓｒ株式会社 感放射線性樹脂組成物
KR100360412B1 (ko) * 2000-07-11 2002-11-13 삼성전자 주식회사 백본에 락톤이 포함된 감광성 폴리머로 이루어지는레지스트 조성물
JP4441104B2 (ja) 2000-11-27 2010-03-31 東京応化工業株式会社 ポジ型レジスト組成物
JP3945741B2 (ja) 2000-12-04 2007-07-18 東京応化工業株式会社 ポジ型レジスト組成物
TWI291953B (enExample) 2001-10-23 2008-01-01 Mitsubishi Rayon Co
JP3895224B2 (ja) 2001-12-03 2007-03-22 東京応化工業株式会社 ポジ型レジスト組成物及びそれを用いたレジストパターン形成方法
JP4881002B2 (ja) 2003-01-31 2012-02-22 三菱レイヨン株式会社 レジスト用重合体およびレジスト組成物
JP4772288B2 (ja) 2003-06-05 2011-09-14 東京応化工業株式会社 ホトレジスト組成物用樹脂、ホトレジスト組成物、およびレジストパターン形成方法
JP2005031233A (ja) 2003-07-09 2005-02-03 Tokyo Ohka Kogyo Co Ltd レジスト組成物、積層体、及びレジストパターン形成方法
TWI300165B (en) * 2003-08-13 2008-08-21 Tokyo Ohka Kogyo Co Ltd Resin for resist, positive resist composition and resist pattern formation method
JP4188265B2 (ja) 2003-10-23 2008-11-26 東京応化工業株式会社 レジスト組成物およびレジストパターン形成方法
JP2005164633A (ja) * 2003-11-28 2005-06-23 Tokyo Ohka Kogyo Co Ltd ポジ型レジスト組成物及びレジストパターン形成方法
US7494759B2 (en) * 2004-05-31 2009-02-24 Tokyo Ohka Kogyo Co., Ltd. Positive resist compositions and process for the formation of resist patterns with the same
US7763412B2 (en) 2004-06-08 2010-07-27 Tokyo Ohka Kogyo Co., Ltd. Polymer, positive resist composition and method for forming resist pattern
JP2006003781A (ja) * 2004-06-21 2006-01-05 Tokyo Ohka Kogyo Co Ltd ポジ型レジスト組成物及びレジストパターン形成方法
US8476401B2 (en) 2004-09-10 2013-07-02 Mitsubishi Rayon Co., Ltd. Resist polymer, process for production thereof, resist composition, and process for production of substrated with patterns thereon
DE102004047249A1 (de) * 2004-09-24 2006-04-06 Infineon Technologies Ag Lithographieverfahren zur Herstellung hochaufgelöster Fotoresiststrukturen
KR101646813B1 (ko) 2009-03-03 2016-08-08 미츠비시 가스 가가쿠 가부시키가이샤 아다만탄 유도체, 그의 제조방법 및 그것을 원료로 하는 중합체, 및 수지 조성물
KR101432395B1 (ko) 2009-07-07 2014-08-20 미츠비시 레이온 가부시키가이샤 중합체의 제조 방법, 리소그라피용 중합체, 레지스트 조성물, 및 기판의 제조 방법
WO2011004787A1 (ja) 2009-07-07 2011-01-13 三菱レイヨン株式会社 リソグラフィー用共重合体およびその評価方法
KR101738480B1 (ko) * 2009-07-30 2017-05-23 주식회사 동진쎄미켐 자가정렬 이중 패턴 형성용 포토레지스트 조성물
WO2011086933A1 (ja) 2010-01-14 2011-07-21 三菱瓦斯化学株式会社 ビシクロヘキサン誘導体化合物及びその製造方法
JP5660483B2 (ja) * 2010-03-12 2015-01-28 国立大学法人東北大学 レジスト用重合体組成物、レジスト組成物、およびパターンが形成された基板の製造方法
CN105143291B (zh) 2013-04-23 2017-03-22 三菱瓦斯化学株式会社 新型脂环式酯化合物、(甲基)丙烯酸类共聚物以及包含它的感光性树脂组合物
JP6287552B2 (ja) 2013-06-14 2018-03-07 三菱ケミカル株式会社 レジスト用共重合体、およびレジスト用組成物
CN105934448B (zh) 2014-01-31 2018-02-09 三菱瓦斯化学株式会社 (甲基)丙烯酸酯化合物、(甲基)丙烯酸类共聚物和包含其的感光性树脂组合物
US10005714B2 (en) 2014-02-14 2018-06-26 Mitsubishi Gas Chemical Company, Inc. (Meth)acrylic acid ester compound and production method therefor
CN105980347B (zh) 2014-02-14 2019-08-16 三菱瓦斯化学株式会社 新型脂环式酯化合物的制造方法、新型脂环式酯化合物、将其聚合的(甲基)丙烯酸系共聚物、和包含其的感光性树脂组合物
JP7515995B2 (ja) * 2020-04-01 2024-07-16 株式会社日本触媒 Ｎ－置換マレイミド系重合体、及びその製造方法

Family Cites Families (3)

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Publication number Priority date Publication date Assignee Title
US6013416A (en) * 1995-06-28 2000-01-11 Fujitsu Limited Chemically amplified resist compositions and process for the formation of resist patterns
JP3751065B2 (ja) 1995-06-28 2006-03-01 富士通株式会社 レジスト材料及びレジストパターンの形成方法
JP3297272B2 (ja) 1995-07-14 2002-07-02 富士通株式会社 レジスト組成物及びレジストパターンの形成方法

Also Published As

Publication number Publication date
TW565739B (en) 2003-12-11
JPH10319595A (ja) 1998-12-04
TW200403529A (en) 2004-03-01
JP3819531B2 (ja) 2006-09-13
KR19980087046A (ko) 1998-12-05
US6656659B1 (en) 2003-12-02
KR100301354B1 (ko) 2001-11-22

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