TWD230582S - 半導體製造裝置用分流器 - Google Patents

半導體製造裝置用分流器 Download PDF

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Publication number
TWD230582S
TWD230582S TW111301062F TW111301062F TWD230582S TW D230582 S TWD230582 S TW D230582S TW 111301062 F TW111301062 F TW 111301062F TW 111301062 F TW111301062 F TW 111301062F TW D230582 S TWD230582 S TW D230582S
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TW
Taiwan
Prior art keywords
semiconductor manufacturing
manufacturing equipment
shunts
article
flow divider
Prior art date
Application number
TW111301062F
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English (en)
Chinese (zh)
Inventor
岡嶋優作
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
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Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD230582S publication Critical patent/TWD230582S/zh

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TW111301062F 2021-10-01 2022-03-04 半導體製造裝置用分流器 TWD230582S (zh)

Applications Claiming Priority (2)

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JP2021021414F JP1713190S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2021-10-01 2021-10-01
JP2021-021414 2021-10-01

Publications (1)

Publication Number Publication Date
TWD230582S true TWD230582S (zh) 2024-04-01

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TW111301062F TWD230582S (zh) 2021-10-01 2022-03-04 半導體製造裝置用分流器

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US (1) USD1086086S1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP1713190S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TWD230582S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD209793S (zh) 2019-02-20 2021-02-11 美商維高儀器股份有限公司 半導體晶圓架

Family Cites Families (19)

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US8028978B2 (en) * 1996-07-15 2011-10-04 Semitool, Inc. Wafer handling system
EP1006562A3 (en) * 1998-12-01 2005-01-19 Greene, Tweed Of Delaware, Inc. Two-piece clamp ring for holding semiconductor wafer or other workpiece
JP4506125B2 (ja) * 2003-07-16 2010-07-21 信越半導体株式会社 熱処理用縦型ボート及びその製造方法
US20090197424A1 (en) * 2008-01-31 2009-08-06 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method for manufacturing semiconductor device
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
TWD163542S (zh) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 基板處理裝置用晶舟
KR101760316B1 (ko) * 2015-09-11 2017-07-21 주식회사 유진테크 기판처리장치
KR101731488B1 (ko) * 2015-10-27 2017-05-02 주식회사 유진테크 기판처리장치 및 튜브 조립체 조립방법
JP1568553S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2016-02-12 2017-02-06
JP1563649S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2016-02-12 2016-11-21
JP6664487B2 (ja) * 2016-07-26 2020-03-13 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 発熱体、基板処理装置、半導体装置の製造方法およびプログラム
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
JP7229266B2 (ja) * 2018-09-20 2023-02-27 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、及びプログラム
JP1700776S (ja) * 2021-03-04 2021-11-29 基板処理装置用基板載置プレート
JP1700778S (ja) * 2021-03-15 2021-11-29 基板処理装置用遮蔽具
USD1023959S1 (en) * 2021-05-11 2024-04-23 Asm Ip Holding B.V. Electrode for substrate processing apparatus
JP1731671S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2022-03-15 2022-12-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD209793S (zh) 2019-02-20 2021-02-11 美商維高儀器股份有限公司 半導體晶圓架

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JP1713190S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2022-04-21
USD1086086S1 (en) 2025-07-29

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