JP1700778S - - Google Patents
Info
- Publication number
- JP1700778S JP1700778S JPD2021-5259F JP2021005259F JP1700778S JP 1700778 S JP1700778 S JP 1700778S JP 2021005259 F JP2021005259 F JP 2021005259F JP 1700778 S JP1700778 S JP 1700778S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2021-5259F JP1700778S (ja) | 2021-03-15 | 2021-03-15 | |
| TW110304574F TWD225034S (zh) | 2021-03-15 | 2021-08-31 | 基板處理裝置用遮蔽具 |
| US29/807,745 USD982537S1 (en) | 2021-03-15 | 2021-09-14 | Separator of substrate processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2021-5259F JP1700778S (ja) | 2021-03-15 | 2021-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1700778S true JP1700778S (ja) | 2021-11-29 |
Family
ID=78766339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2021-5259F Active JP1700778S (ja) | 2021-03-15 | 2021-03-15 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD982537S1 (ja) |
| JP (1) | JP1700778S (ja) |
| TW (1) | TWD225034S (ja) |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8028978B2 (en) * | 1996-07-15 | 2011-10-04 | Semitool, Inc. | Wafer handling system |
| EP1006562A3 (en) * | 1998-12-01 | 2005-01-19 | Greene, Tweed Of Delaware, Inc. | Two-piece clamp ring for holding semiconductor wafer or other workpiece |
| JP4506125B2 (ja) * | 2003-07-16 | 2010-07-21 | 信越半導体株式会社 | 熱処理用縦型ボート及びその製造方法 |
| US20090197424A1 (en) * | 2008-01-31 | 2009-08-06 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and method for manufacturing semiconductor device |
| USD616392S1 (en) * | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| KR101760316B1 (ko) * | 2015-09-11 | 2017-07-21 | 주식회사 유진테크 | 기판처리장치 |
| JP6454425B2 (ja) * | 2015-09-28 | 2019-01-16 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 半導体装置の製造方法、基板処理装置およびプログラム |
| KR101731488B1 (ko) * | 2015-10-27 | 2017-05-02 | 주식회사 유진테크 | 기판처리장치 및 튜브 조립체 조립방법 |
| WO2018020733A1 (ja) * | 2016-07-26 | 2018-02-01 | 株式会社日立国際電気 | 発熱体、基板処理装置、半導体装置の製造方法およびプログラム |
| JP6821788B2 (ja) * | 2017-03-09 | 2021-01-27 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、半導体装置の製造方法およびプログラム |
| JP7023147B2 (ja) | 2018-03-13 | 2022-02-21 | 東京エレクトロン株式会社 | 断熱構造体及び縦型熱処理装置 |
| US20190330740A1 (en) * | 2018-04-30 | 2019-10-31 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
| JP1638504S (ja) | 2018-12-06 | 2019-08-05 | ||
| JP7391942B2 (ja) * | 2019-03-18 | 2023-12-05 | 株式会社Kokusai Electric | 半導体装置の製造方法、基板処理装置、プログラムおよび基板処理方法 |
-
2021
- 2021-03-15 JP JPD2021-5259F patent/JP1700778S/ja active Active
- 2021-08-31 TW TW110304574F patent/TWD225034S/zh unknown
- 2021-09-14 US US29/807,745 patent/USD982537S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWD225034S (zh) | 2023-05-01 |
| USD982537S1 (en) | 2023-04-04 |