USD982537S1 - Separator of substrate processing apparatus - Google Patents

Separator of substrate processing apparatus Download PDF

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Publication number
USD982537S1
USD982537S1 US29/807,745 US202129807745F USD982537S US D982537 S1 USD982537 S1 US D982537S1 US 202129807745 F US202129807745 F US 202129807745F US D982537 S USD982537 S US D982537S
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US
United States
Prior art keywords
separator
processing apparatus
substrate processing
view
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/807,745
Inventor
Shinya Morita
Seiyo Nakashima
Satoru Murata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
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Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MURATA, SATORU, NAKASHIMA, SEIYO, MORITA, SHINYA
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FIG. 1 is a front, top and right side perspective view of a separator of substrate processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross sectional view taken along line 8-8 in FIG. 2 .

Claims (1)

    CLAIM
  1. The ornamental design for a separator of substrate processing apparatus, as shown and described.
US29/807,745 2021-03-15 2021-09-14 Separator of substrate processing apparatus Active USD982537S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2021-5259F JP1700778S (en) 2021-03-15 2021-03-15
JP2021-005259D 2021-03-15

Publications (1)

Publication Number Publication Date
USD982537S1 true USD982537S1 (en) 2023-04-04

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ID=78766339

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/807,745 Active USD982537S1 (en) 2021-03-15 2021-09-14 Separator of substrate processing apparatus

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US (1) USD982537S1 (en)
JP (1) JP1700778S (en)
TW (1) TWD225034S (en)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6231038B1 (en) * 1998-12-01 2001-05-15 Greene Tweed Of Delaware, Inc. Two-piece clamp ring for holding semiconductor wafer or other workpiece
US7484958B2 (en) * 2003-07-16 2009-02-03 Shin-Etsu Handotai Co., Ltd. Vertical boat for heat treatment and method for producing the same
US20090197424A1 (en) * 2008-01-31 2009-08-06 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method for manufacturing semiconductor device
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US8028978B2 (en) * 1996-07-15 2011-10-04 Semitool, Inc. Wafer handling system
US20170073813A1 (en) * 2015-09-11 2017-03-16 Eugene Technology Co., Ltd. Substrate processing apparatus
US20180211840A1 (en) * 2015-09-28 2018-07-26 Hitachi Kokusai Electric Inc. Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
US20190287828A1 (en) 2018-03-13 2019-09-19 Tokyo Electron Limited Heat insulation structure and vertical heat treatment apparatus
US20190330740A1 (en) * 2018-04-30 2019-10-31 Asm Ip Holding B.V. Substrate processing apparatus and method
US20200013646A1 (en) * 2017-03-09 2020-01-09 Kokusai Electric Corporation Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
US20200152490A1 (en) * 2016-07-26 2020-05-14 Kokusai Electric Corporation Heating element, substrate processing apparatus, and method of manufacturing semiconductor device
US10840118B2 (en) * 2015-10-27 2020-11-17 Eugene Technology Co., Ltd. Substrate processing apparatus and method for assembling tube assembly
US20210407865A1 (en) * 2019-03-18 2021-12-30 Kokusai Electric Corporation Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording Medium

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1638504S (en) 2018-12-06 2019-08-05

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8028978B2 (en) * 1996-07-15 2011-10-04 Semitool, Inc. Wafer handling system
US6231038B1 (en) * 1998-12-01 2001-05-15 Greene Tweed Of Delaware, Inc. Two-piece clamp ring for holding semiconductor wafer or other workpiece
US7484958B2 (en) * 2003-07-16 2009-02-03 Shin-Etsu Handotai Co., Ltd. Vertical boat for heat treatment and method for producing the same
US20090197424A1 (en) * 2008-01-31 2009-08-06 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method for manufacturing semiconductor device
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US20170073813A1 (en) * 2015-09-11 2017-03-16 Eugene Technology Co., Ltd. Substrate processing apparatus
US20180211840A1 (en) * 2015-09-28 2018-07-26 Hitachi Kokusai Electric Inc. Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
US10840118B2 (en) * 2015-10-27 2020-11-17 Eugene Technology Co., Ltd. Substrate processing apparatus and method for assembling tube assembly
US20200152490A1 (en) * 2016-07-26 2020-05-14 Kokusai Electric Corporation Heating element, substrate processing apparatus, and method of manufacturing semiconductor device
US20200013646A1 (en) * 2017-03-09 2020-01-09 Kokusai Electric Corporation Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
US20190287828A1 (en) 2018-03-13 2019-09-19 Tokyo Electron Limited Heat insulation structure and vertical heat treatment apparatus
US20190330740A1 (en) * 2018-04-30 2019-10-31 Asm Ip Holding B.V. Substrate processing apparatus and method
US20210407865A1 (en) * 2019-03-18 2021-12-30 Kokusai Electric Corporation Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording Medium

Also Published As

Publication number Publication date
JP1700778S (en) 2021-11-29
TWD225034S (en) 2023-05-01

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