USD982537S1 - Separator of substrate processing apparatus - Google Patents
Separator of substrate processing apparatus Download PDFInfo
- Publication number
- USD982537S1 USD982537S1 US29/807,745 US202129807745F USD982537S US D982537 S1 USD982537 S1 US D982537S1 US 202129807745 F US202129807745 F US 202129807745F US D982537 S USD982537 S US D982537S
- Authority
- US
- United States
- Prior art keywords
- separator
- processing apparatus
- substrate processing
- view
- elevational view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
Claims (1)
- The ornamental design for a separator of substrate processing apparatus, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2021-5259F JP1700778S (en) | 2021-03-15 | 2021-03-15 | |
JP2021-005259D | 2021-03-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD982537S1 true USD982537S1 (en) | 2023-04-04 |
Family
ID=78766339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/807,745 Active USD982537S1 (en) | 2021-03-15 | 2021-09-14 | Separator of substrate processing apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | USD982537S1 (en) |
JP (1) | JP1700778S (en) |
TW (1) | TWD225034S (en) |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6231038B1 (en) * | 1998-12-01 | 2001-05-15 | Greene Tweed Of Delaware, Inc. | Two-piece clamp ring for holding semiconductor wafer or other workpiece |
US7484958B2 (en) * | 2003-07-16 | 2009-02-03 | Shin-Etsu Handotai Co., Ltd. | Vertical boat for heat treatment and method for producing the same |
US20090197424A1 (en) * | 2008-01-31 | 2009-08-06 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and method for manufacturing semiconductor device |
USD616392S1 (en) * | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
US8028978B2 (en) * | 1996-07-15 | 2011-10-04 | Semitool, Inc. | Wafer handling system |
US20170073813A1 (en) * | 2015-09-11 | 2017-03-16 | Eugene Technology Co., Ltd. | Substrate processing apparatus |
US20180211840A1 (en) * | 2015-09-28 | 2018-07-26 | Hitachi Kokusai Electric Inc. | Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium |
US20190287828A1 (en) | 2018-03-13 | 2019-09-19 | Tokyo Electron Limited | Heat insulation structure and vertical heat treatment apparatus |
US20190330740A1 (en) * | 2018-04-30 | 2019-10-31 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US20200013646A1 (en) * | 2017-03-09 | 2020-01-09 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium |
US20200152490A1 (en) * | 2016-07-26 | 2020-05-14 | Kokusai Electric Corporation | Heating element, substrate processing apparatus, and method of manufacturing semiconductor device |
US10840118B2 (en) * | 2015-10-27 | 2020-11-17 | Eugene Technology Co., Ltd. | Substrate processing apparatus and method for assembling tube assembly |
US20210407865A1 (en) * | 2019-03-18 | 2021-12-30 | Kokusai Electric Corporation | Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording Medium |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1638504S (en) | 2018-12-06 | 2019-08-05 |
-
2021
- 2021-03-15 JP JPD2021-5259F patent/JP1700778S/ja active Active
- 2021-08-31 TW TW110304574F patent/TWD225034S/en unknown
- 2021-09-14 US US29/807,745 patent/USD982537S1/en active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8028978B2 (en) * | 1996-07-15 | 2011-10-04 | Semitool, Inc. | Wafer handling system |
US6231038B1 (en) * | 1998-12-01 | 2001-05-15 | Greene Tweed Of Delaware, Inc. | Two-piece clamp ring for holding semiconductor wafer or other workpiece |
US7484958B2 (en) * | 2003-07-16 | 2009-02-03 | Shin-Etsu Handotai Co., Ltd. | Vertical boat for heat treatment and method for producing the same |
US20090197424A1 (en) * | 2008-01-31 | 2009-08-06 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and method for manufacturing semiconductor device |
USD616392S1 (en) * | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
US20170073813A1 (en) * | 2015-09-11 | 2017-03-16 | Eugene Technology Co., Ltd. | Substrate processing apparatus |
US20180211840A1 (en) * | 2015-09-28 | 2018-07-26 | Hitachi Kokusai Electric Inc. | Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium |
US10840118B2 (en) * | 2015-10-27 | 2020-11-17 | Eugene Technology Co., Ltd. | Substrate processing apparatus and method for assembling tube assembly |
US20200152490A1 (en) * | 2016-07-26 | 2020-05-14 | Kokusai Electric Corporation | Heating element, substrate processing apparatus, and method of manufacturing semiconductor device |
US20200013646A1 (en) * | 2017-03-09 | 2020-01-09 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium |
US20190287828A1 (en) | 2018-03-13 | 2019-09-19 | Tokyo Electron Limited | Heat insulation structure and vertical heat treatment apparatus |
US20190330740A1 (en) * | 2018-04-30 | 2019-10-31 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US20210407865A1 (en) * | 2019-03-18 | 2021-12-30 | Kokusai Electric Corporation | Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording Medium |
Also Published As
Publication number | Publication date |
---|---|
JP1700778S (en) | 2021-11-29 |
TWD225034S (en) | 2023-05-01 |
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Legal Events
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |