TWD225034S - Mask for substrate processing equipment - Google Patents

Mask for substrate processing equipment Download PDF

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Publication number
TWD225034S
TWD225034S TW110304574F TW110304574F TWD225034S TW D225034 S TWD225034 S TW D225034S TW 110304574 F TW110304574 F TW 110304574F TW 110304574 F TW110304574 F TW 110304574F TW D225034 S TWD225034 S TW D225034S
Authority
TW
Taiwan
Prior art keywords
substrate processing
mask
processing equipment
shield
processing device
Prior art date
Application number
TW110304574F
Other languages
Chinese (zh)
Inventor
森田慎也
中嶋誠世
村田慧
Original Assignee
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司
Publication of TWD225034S publication Critical patent/TWD225034S/en

Links

Abstract

【物品用途】;本設計的物品是基板處理裝置用遮蔽具，係設置在基板處理裝置的爐口部，用於遮蔽在處理室內產生的氣體或熱流動的遮蔽具。;【設計說明】;(無)[Use of article]; The article designed in this design is a shield for a substrate processing device. It is installed at the furnace mouth of the substrate processing device and is used to shield the flow of gas or heat generated in the processing chamber. ;[Design description];(none)

TW110304574F 2021-03-15 2021-08-31 Mask for substrate processing equipment TWD225034S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-005259 2021-03-15
JP2021005259F JP1700778S (en) 2021-03-15 2021-03-15 Shielding device for substrate processing equipment

Publications (1)

Publication Number Publication Date
TWD225034S true TWD225034S (en) 2023-05-01

Family

ID=78766339

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110304574F TWD225034S (en) 2021-03-15 2021-08-31 Mask for substrate processing equipment

Country Status (3)

Country Link
US (1) USD982537S1 (en)
JP (1) JP1700778S (en)
TW (1) TWD225034S (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1713190S (en) * 2021-10-01 2022-04-21

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD203479S (en) 2018-12-06 2020-03-21 日商國際電氣股份有限公司 Entrance cover for substrate processing device

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Publication number Priority date Publication date Assignee Title
US8028978B2 (en) * 1996-07-15 2011-10-04 Semitool, Inc. Wafer handling system
EP1006562A3 (en) * 1998-12-01 2005-01-19 Greene, Tweed Of Delaware, Inc. Two-piece clamp ring for holding semiconductor wafer or other workpiece
JP4506125B2 (en) * 2003-07-16 2010-07-21 信越半導体株式会社 Vertical boat for heat treatment and manufacturing method thereof
US20090197424A1 (en) * 2008-01-31 2009-08-06 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method for manufacturing semiconductor device
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
KR101760316B1 (en) * 2015-09-11 2017-07-21 주식회사 유진테크 Substrate Processing Apparatus
WO2017056148A1 (en) * 2015-09-28 2017-04-06 株式会社日立国際電気 Method for manufacturing semiconductor device, substrate treatment apparatus, and program
KR101731488B1 (en) * 2015-10-27 2017-05-02 주식회사 유진테크 Substrate Processing Apparatus and Assembling Method for Tube Assembly
JP6664487B2 (en) * 2016-07-26 2020-03-13 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ Heating element, substrate processing apparatus, semiconductor device manufacturing method and program
WO2018163386A1 (en) * 2017-03-09 2018-09-13 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ Substrate processing device, semiconductor device manufacturing method, and program
JP7023147B2 (en) 2018-03-13 2022-02-21 東京エレクトロン株式会社 Insulation structure and vertical heat treatment equipment
US20190330740A1 (en) * 2018-04-30 2019-10-31 Asm Ip Holding B.V. Substrate processing apparatus and method
WO2020188675A1 (en) * 2019-03-18 2020-09-24 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ Method for manufacturing semiconductor device, substrate processing device, and program

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD203479S (en) 2018-12-06 2020-03-21 日商國際電氣股份有限公司 Entrance cover for substrate processing device

Also Published As

Publication number Publication date
JP1700778S (en) 2021-11-29
USD982537S1 (en) 2023-04-04

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