TWD225633S - Heat-shielding component covers for semiconductor manufacturing equipment - Google Patents
Heat-shielding component covers for semiconductor manufacturing equipment Download PDFInfo
- Publication number
- TWD225633S TWD225633S TW110306502F TW110306502F TWD225633S TW D225633 S TWD225633 S TW D225633S TW 110306502 F TW110306502 F TW 110306502F TW 110306502 F TW110306502 F TW 110306502F TW D225633 S TWD225633 S TW D225633S
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- manufacturing equipment
- semiconductor manufacturing
- shielding component
- component covers
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract description 5
- 238000004519 manufacturing process Methods 0.000 title abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
Images
Abstract
【物品用途】;本設計的物品是半導體製造裝置用隔熱組件外罩，為用來包覆被設置在處理半導體晶圓等之基板的反應管之爐口部的隔熱組件之外罩。;【設計說明】;(無)[Use of article] The article of this design is a heat-insulating component cover for semiconductor manufacturing equipment. It is a heat-insulating component cover used to cover the furnace mouth of a reaction tube that processes substrates such as semiconductor wafers. ;[Design description];(none)
Description
本設計的物品是半導體製造裝置用隔熱組件外罩，為用來包覆被設置在處理半導體晶圓等之基板的反應管之爐口部的隔熱組件之外罩。The article of this design is a heat-insulating unit cover for semiconductor manufacturing equipment, which is a heat-insulating unit cover for covering the furnace mouth of a reaction tube installed on a substrate such as a semiconductor wafer.
(無)(none)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021014030F JP1706320S (en) | 2021-06-28 | 2021-06-28 | |
| JP2021-014030 | 2021-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD225633S true TWD225633S (en) | 2023-06-01 |
Family
ID=80218922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110306502F TWD225633S (en) | 2021-06-28 | 2021-11-30 | Heat-shielding component covers for semiconductor manufacturing equipment |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD1003834S1 (en) |
| JP (1) | JP1706320S (en) |
| TW (1) | TWD225633S (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD241472S (en) | 2024-01-18 | 2025-11-11 | 日商國際電氣股份有限公司 (日本) | Part of the heat shield ring for semiconductor manufacturing devices |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1733769S (en) * | 2022-08-10 | 2023-01-06 | ||
| JP1760960S (en) * | 2023-06-12 | 2024-01-10 | ||
| JP1778590S (en) * | 2024-03-08 | 2024-08-28 | ||
| USD1110288S1 (en) * | 2024-03-20 | 2026-01-27 | Kokusai Electric Corporation | Heat insulation pedestal of a semiconductor manufacturing apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD210787S (en) | 2020-05-28 | 2021-04-01 | 曾仁安 | plug |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD413659S (en) * | 1996-09-09 | 1999-09-07 | Swartz Mitchell R | Immersion apparatus to heat a solution |
| USD404369S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Manifold cover for use in a semiconductor wafer heat processing apparatus |
| USD407696S (en) * | 1997-08-20 | 1999-04-06 | Tokyo Electron Limited | Inner tube for use in a semiconductor wafer heat processing apparatus |
| USD615936S1 (en) * | 2009-03-06 | 2010-05-18 | Tokyo Electron Limited | Pedestal of heat insulating cylinder for manufacturing semiconductor wafers |
| JP5645718B2 (en) * | 2011-03-07 | 2014-12-24 | 東京エレクトロン株式会社 | Heat treatment equipment |
| USD655801S1 (en) * | 2011-06-28 | 2012-03-13 | Cps Products, Inc. | Portable submersible condenser/heat exchanger |
| USD694711S1 (en) * | 2012-03-23 | 2013-12-03 | Mitsubishi Electric Corporation | Insulator for vacuum circuit breaker |
| JP1564810S (en) * | 2016-02-10 | 2016-12-05 | ||
| JP1565116S (en) | 2016-02-10 | 2016-12-12 |
-
2021
- 2021-06-28 JP JP2021014030F patent/JP1706320S/ja active Active
- 2021-11-30 TW TW110306502F patent/TWD225633S/en unknown
- 2021-12-23 US US29/820,708 patent/USD1003834S1/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD210787S (en) | 2020-05-28 | 2021-04-01 | 曾仁安 | plug |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD241472S (en) | 2024-01-18 | 2025-11-11 | 日商國際電氣股份有限公司 (日本) | Part of the heat shield ring for semiconductor manufacturing devices |
Also Published As
| Publication number | Publication date |
|---|---|
| USD1003834S1 (en) | 2023-11-07 |
| JP1706320S (en) | 2022-01-31 |
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