TWD225634S - Part of the cover of heat-insulating components for semiconductor manufacturing equipment - Google Patents
Part of the cover of heat-insulating components for semiconductor manufacturing equipment Download PDFInfo
- Publication number
- TWD225634S TWD225634S TW110306503F TW110306503F TWD225634S TW D225634 S TWD225634 S TW D225634S TW 110306503 F TW110306503 F TW 110306503F TW 110306503 F TW110306503 F TW 110306503F TW D225634 S TWD225634 S TW D225634S
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- cover
- design
- manufacturing equipment
- semiconductor manufacturing
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract description 5
- 238000004519 manufacturing process Methods 0.000 title abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 1
Images
Abstract
【物品用途】;本設計的物品是半導體製造裝置用隔熱組件外罩，為用來包覆被設置在處理半導體晶圓等之基板的反應管之爐口部的隔熱組件之外罩。;【設計說明】;圖式中所揭露之虛線部分，為本案不主張設計之部分；圖式中一點鏈線所圍繞者，係界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。[Use of article] The article of this design is a heat-insulating component cover for semiconductor manufacturing equipment. It is a heat-insulating component cover used to cover the furnace mouth of a reaction tube for processing substrates such as semiconductor wafers. ;[Design explanation];The dotted line part disclosed in the drawing is the part of the design that is not claimed in this case; the one-point chain line in the drawing is surrounded by the scope of the intended claim of this case, and the one-point chain line itself is not claimed in this case. Advocate for the design part.
Description
本設計的物品是半導體製造裝置用隔熱組件外罩，為用來包覆被設置在處理半導體晶圓等之基板的反應管之爐口部的隔熱組件之外罩。The article of this design is a heat insulating unit cover for semiconductor manufacturing equipment, which is a heat insulating unit cover for covering the furnace mouth of a reaction tube installed on a substrate such as a semiconductor wafer.
圖式中所揭露之虛線部分，為本案不主張設計之部分；圖式中一點鏈線所圍繞者，係界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。The part of the dotted line disclosed in the drawing is the part of the design not claimed in this case; the part surrounded by a chain line in the diagram is to define the scope of the claim in this case, and the chain line itself is the part of the design not claimed in this case.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-014031 | 2021-06-28 | ||
| JP2021014031F JP1706321S (en) | 2021-06-28 | 2021-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD225634S true TWD225634S (en) | 2023-06-01 |
Family
ID=80218885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110306503F TWD225634S (en) | 2021-06-28 | 2021-11-30 | Part of the cover of heat-insulating components for semiconductor manufacturing equipment |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD1003243S1 (en) |
| JP (1) | JP1706321S (en) |
| TW (1) | TWD225634S (en) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD390539S (en) * | 1996-07-29 | 1998-02-10 | Wakefield Engineering, Inc. | Heat sink |
| USD404369S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Manifold cover for use in a semiconductor wafer heat processing apparatus |
| US6450346B1 (en) * | 2000-06-30 | 2002-09-17 | Integrated Materials, Inc. | Silicon fixtures for supporting wafers during thermal processing |
| USD586498S1 (en) * | 2007-12-17 | 2009-02-10 | Lighthouse Technology Co., Ltd. | Heat dissipating structure of a lamp |
| USD655801S1 (en) * | 2011-06-28 | 2012-03-13 | Cps Products, Inc. | Portable submersible condenser/heat exchanger |
| TWD167985S (en) * | 2013-06-28 | 2015-05-21 | 日立國際電氣股份有限公司 | part of reaction tube |
| JP1565116S (en) | 2016-02-10 | 2016-12-12 | ||
| JP1564810S (en) * | 2016-02-10 | 2016-12-05 | ||
| JP1584146S (en) * | 2017-01-31 | 2017-08-21 |
-
2021
- 2021-06-28 JP JP2021014031F patent/JP1706321S/ja active Active
- 2021-11-30 TW TW110306503F patent/TWD225634S/en unknown
- 2021-12-23 US US29/820,723 patent/USD1003243S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP1706321S (en) | 2022-01-31 |
| USD1003243S1 (en) | 2023-10-31 |
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