JP1706321S - - Google Patents

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Publication number
JP1706321S
JP1706321S JP2021014031F JP2021014031F JP1706321S JP 1706321 S JP1706321 S JP 1706321S JP 2021014031 F JP2021014031 F JP 2021014031F JP 2021014031 F JP2021014031 F JP 2021014031F JP 1706321 S JP1706321 S JP 1706321S
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021014031F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2021014031F priority Critical patent/JP1706321S/ja
Priority to TW110306503F priority patent/TWD225634S/zh
Priority to US29/820,723 priority patent/USD1003243S1/en
Application granted granted Critical
Publication of JP1706321S publication Critical patent/JP1706321S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021014031F 2021-06-28 2021-06-28 Active JP1706321S (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021014031F JP1706321S (ja) 2021-06-28 2021-06-28
TW110306503F TWD225634S (zh) 2021-06-28 2021-11-30 半導體製造裝置用隔熱組件外罩之部分
US29/820,723 USD1003243S1 (en) 2021-06-28 2021-12-23 Heat insulator cover of semiconductor manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021014031F JP1706321S (ja) 2021-06-28 2021-06-28

Publications (1)

Publication Number Publication Date
JP1706321S true JP1706321S (ja) 2022-01-31

Family

ID=80218885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021014031F Active JP1706321S (ja) 2021-06-28 2021-06-28

Country Status (3)

Country Link
US (1) USD1003243S1 (ja)
JP (1) JP1706321S (ja)
TW (1) TWD225634S (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD390539S (en) * 1996-07-29 1998-02-10 Wakefield Engineering, Inc. Heat sink
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US6450346B1 (en) * 2000-06-30 2002-09-17 Integrated Materials, Inc. Silicon fixtures for supporting wafers during thermal processing
USD586498S1 (en) * 2007-12-17 2009-02-10 Lighthouse Technology Co., Ltd. Heat dissipating structure of a lamp
USD655801S1 (en) * 2011-06-28 2012-03-13 Cps Products, Inc. Portable submersible condenser/heat exchanger
TWD167985S (zh) * 2013-06-28 2015-05-21 日立國際電氣股份有限公司 反應管之部分
JP1564810S (ja) * 2016-02-10 2016-12-05
JP1565116S (ja) 2016-02-10 2016-12-12
JP1584146S (ja) * 2017-01-31 2017-08-21

Also Published As

Publication number Publication date
USD1003243S1 (en) 2023-10-31
TWD225634S (zh) 2023-06-01

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