USD1003243S1 - Heat insulator cover of semiconductor manufacturing apparatus - Google Patents
Heat insulator cover of semiconductor manufacturing apparatus Download PDFInfo
- Publication number
- USD1003243S1 USD1003243S1 US29/820,723 US202129820723F USD1003243S US D1003243 S1 USD1003243 S1 US D1003243S1 US 202129820723 F US202129820723 F US 202129820723F US D1003243 S USD1003243 S US D1003243S
- Authority
- US
- United States
- Prior art keywords
- manufacturing apparatus
- semiconductor manufacturing
- heat insulator
- insulator cover
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000012212 insulator Substances 0.000 title claims description 4
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000004065 semiconductor Substances 0.000 title claims description 4
Images
Description
The dashed-dot dashed broken lines define the bounds of the claimed design and form no part thereof. The evenly spaced broken lines represent the portions of the heat insulator cover of semiconductor manufacturing apparatus that form no part of the claimed design. The dot-dashed broken line arrows in FIG. 2 are used to identify the cross sectional views and form no part of the claimed design.
Claims (1)
- The ornamental design for a heat insulator cover of semiconductor manufacturing apparatus, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021014031F JP1706321S (en) | 2021-06-28 | 2021-06-28 | |
JP2021-014031D | 2021-06-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD1003243S1 true USD1003243S1 (en) | 2023-10-31 |
Family
ID=80218885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/820,723 Active USD1003243S1 (en) | 2021-06-28 | 2021-12-23 | Heat insulator cover of semiconductor manufacturing apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | USD1003243S1 (en) |
JP (1) | JP1706321S (en) |
TW (1) | TWD225634S (en) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD390539S (en) * | 1996-07-29 | 1998-02-10 | Wakefield Engineering, Inc. | Heat sink |
USD404369S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Manifold cover for use in a semiconductor wafer heat processing apparatus |
US6450346B1 (en) * | 2000-06-30 | 2002-09-17 | Integrated Materials, Inc. | Silicon fixtures for supporting wafers during thermal processing |
USD586498S1 (en) * | 2007-12-17 | 2009-02-10 | Lighthouse Technology Co., Ltd. | Heat dissipating structure of a lamp |
USD655801S1 (en) * | 2011-06-28 | 2012-03-13 | Cps Products, Inc. | Portable submersible condenser/heat exchanger |
USD720707S1 (en) * | 2013-06-28 | 2015-01-06 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD818960S1 (en) * | 2016-02-10 | 2018-05-29 | Hitachi Kokusai Electric Inc. | Insulation unit of semiconductor manufacturing apparatus |
USD818961S1 (en) | 2016-02-10 | 2018-05-29 | Hitachi Kokusai Electric Inc. | Insulation unit cover of semiconductor manufacturing apparatus |
USD840365S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
-
2021
- 2021-06-28 JP JP2021014031F patent/JP1706321S/ja active Active
- 2021-11-30 TW TW110306503F patent/TWD225634S/en unknown
- 2021-12-23 US US29/820,723 patent/USD1003243S1/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD390539S (en) * | 1996-07-29 | 1998-02-10 | Wakefield Engineering, Inc. | Heat sink |
USD404369S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Manifold cover for use in a semiconductor wafer heat processing apparatus |
US6450346B1 (en) * | 2000-06-30 | 2002-09-17 | Integrated Materials, Inc. | Silicon fixtures for supporting wafers during thermal processing |
USD586498S1 (en) * | 2007-12-17 | 2009-02-10 | Lighthouse Technology Co., Ltd. | Heat dissipating structure of a lamp |
USD655801S1 (en) * | 2011-06-28 | 2012-03-13 | Cps Products, Inc. | Portable submersible condenser/heat exchanger |
USD720707S1 (en) * | 2013-06-28 | 2015-01-06 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD818960S1 (en) * | 2016-02-10 | 2018-05-29 | Hitachi Kokusai Electric Inc. | Insulation unit of semiconductor manufacturing apparatus |
USD818961S1 (en) | 2016-02-10 | 2018-05-29 | Hitachi Kokusai Electric Inc. | Insulation unit cover of semiconductor manufacturing apparatus |
USD840365S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP1706321S (en) | 2022-01-31 |
TWD225634S (en) | 2023-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |