USD1003243S1 - Heat insulator cover of semiconductor manufacturing apparatus - Google Patents

Heat insulator cover of semiconductor manufacturing apparatus Download PDF

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Publication number
USD1003243S1
USD1003243S1 US29/820,723 US202129820723F USD1003243S US D1003243 S1 USD1003243 S1 US D1003243S1 US 202129820723 F US202129820723 F US 202129820723F US D1003243 S USD1003243 S US D1003243S
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US
United States
Prior art keywords
manufacturing apparatus
semiconductor manufacturing
heat insulator
insulator cover
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/820,723
Inventor
Yusaku OKAJIMA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
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Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKAJIMA, YUSAKU
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FIG. 1 is a front, top and right side perspective view of a heat insulator cover of semiconductor manufacturing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and
FIG. 8 is a cross sectional view taken along line 8-8 in FIG. 2 thereof; and,
FIG. 9 is a cross sectional view taken along line 9-9 in FIG. 2 .
The dashed-dot dashed broken lines define the bounds of the claimed design and form no part thereof. The evenly spaced broken lines represent the portions of the heat insulator cover of semiconductor manufacturing apparatus that form no part of the claimed design. The dot-dashed broken line arrows in FIG. 2 are used to identify the cross sectional views and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a heat insulator cover of semiconductor manufacturing apparatus, as shown and described.
US29/820,723 2021-06-28 2021-12-23 Heat insulator cover of semiconductor manufacturing apparatus Active USD1003243S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021014031F JP1706321S (en) 2021-06-28 2021-06-28
JP2021-014031D 2021-06-28

Publications (1)

Publication Number Publication Date
USD1003243S1 true USD1003243S1 (en) 2023-10-31

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ID=80218885

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US29/820,723 Active USD1003243S1 (en) 2021-06-28 2021-12-23 Heat insulator cover of semiconductor manufacturing apparatus

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US (1) USD1003243S1 (en)
JP (1) JP1706321S (en)
TW (1) TWD225634S (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD390539S (en) * 1996-07-29 1998-02-10 Wakefield Engineering, Inc. Heat sink
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US6450346B1 (en) * 2000-06-30 2002-09-17 Integrated Materials, Inc. Silicon fixtures for supporting wafers during thermal processing
USD586498S1 (en) * 2007-12-17 2009-02-10 Lighthouse Technology Co., Ltd. Heat dissipating structure of a lamp
USD655801S1 (en) * 2011-06-28 2012-03-13 Cps Products, Inc. Portable submersible condenser/heat exchanger
USD720707S1 (en) * 2013-06-28 2015-01-06 Hitachi Kokusai Electric Inc. Reaction tube
USD818960S1 (en) * 2016-02-10 2018-05-29 Hitachi Kokusai Electric Inc. Insulation unit of semiconductor manufacturing apparatus
USD818961S1 (en) 2016-02-10 2018-05-29 Hitachi Kokusai Electric Inc. Insulation unit cover of semiconductor manufacturing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD390539S (en) * 1996-07-29 1998-02-10 Wakefield Engineering, Inc. Heat sink
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US6450346B1 (en) * 2000-06-30 2002-09-17 Integrated Materials, Inc. Silicon fixtures for supporting wafers during thermal processing
USD586498S1 (en) * 2007-12-17 2009-02-10 Lighthouse Technology Co., Ltd. Heat dissipating structure of a lamp
USD655801S1 (en) * 2011-06-28 2012-03-13 Cps Products, Inc. Portable submersible condenser/heat exchanger
USD720707S1 (en) * 2013-06-28 2015-01-06 Hitachi Kokusai Electric Inc. Reaction tube
USD818960S1 (en) * 2016-02-10 2018-05-29 Hitachi Kokusai Electric Inc. Insulation unit of semiconductor manufacturing apparatus
USD818961S1 (en) 2016-02-10 2018-05-29 Hitachi Kokusai Electric Inc. Insulation unit cover of semiconductor manufacturing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus

Also Published As

Publication number Publication date
JP1706321S (en) 2022-01-31
TWD225634S (en) 2023-06-01

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