TWD183005S - Thermal insulation component outer cover of semiconductor manufacturing equipment - Google Patents

Thermal insulation component outer cover of semiconductor manufacturing equipment

Info

Publication number
TWD183005S
TWD183005S TW105304350F TW105304350F TWD183005S TW D183005 S TWD183005 S TW D183005S TW 105304350 F TW105304350 F TW 105304350F TW 105304350 F TW105304350 F TW 105304350F TW D183005 S TWD183005 S TW D183005S
Authority
TW
Taiwan
Prior art keywords
semiconductor manufacturing
article
insulating component
thermal insulation
outer cover
Prior art date
Application number
TW105304350F
Other languages
Chinese (zh)
Inventor
Takatomo Yamaguchi
Original Assignee
日立國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立國際電氣股份有限公司 filed Critical 日立國際電氣股份有限公司
Publication of TWD183005S publication Critical patent/TWD183005S/en

Links

Abstract

【物品用途】;本設計的物品是半導體製造裝置之隔熱組件外罩，是對於設置在用來處理半導體晶圓等的基板之反應管內，用來將從基板處理區域朝爐口方向的熱能量傳播予以阻隔的隔熱組件身上，為了抑制在隔熱組件身上形成薄膜而覆蓋隔熱組件的外罩。本物品形成為上端封閉的中空圓筒形狀，在其上表面外周形成有用來設置晶舟之落差部，該晶舟是用來將基板保持為多層。;【設計說明】;本物品為透明。[Use of the article] The article of this design is a heat-insulating component cover for a semiconductor manufacturing device. It is used to dissipate heat from the substrate processing area toward the furnace mouth when it is installed in a reaction tube used to process substrates such as semiconductor wafers. A cover that covers an insulating component that blocks energy propagation and prevents film from forming on the insulating component. This article is formed into a hollow cylindrical shape with a closed upper end, and a drop portion for placing a wafer boat is formed on the outer periphery of the upper surface thereof, and the wafer boat is used to hold the substrate in multiple layers. ;[Design Description];This item is transparent.

TW105304350F 2016-02-10 2016-07-28 Thermal insulation component outer cover of semiconductor manufacturing equipment TWD183005S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2016-2843F JP1565116S (en) 2016-02-10 2016-02-10

Publications (1)

Publication Number Publication Date
TWD183005S true TWD183005S (en) 2017-05-11

Family

ID=57482774

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105304350F TWD183005S (en) 2016-02-10 2016-07-28 Thermal insulation component outer cover of semiconductor manufacturing equipment

Country Status (3)

Country Link
US (1) USD818961S1 (en)
JP (1) JP1565116S (en)
TW (1) TWD183005S (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11631567B2 (en) * 2020-03-12 2023-04-18 Applied Materials, Inc. Ion source with single-slot tubular cathode
JP1706321S (en) 2021-06-28 2022-01-31
JP1706320S (en) 2021-06-28 2022-01-31
JP1733769S (en) * 2022-08-10 2023-01-06

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD493873S1 (en) * 2002-05-24 2004-08-03 Tokyo Electron Limited Heating gas supplier for semiconductor manufacturing equipment
JP3845370B2 (en) * 2002-11-29 2006-11-15 本田技研工業株式会社 Storage element module
USD522456S1 (en) * 2002-11-29 2006-06-06 Honda Giken Kogyo Kabushiki Kaisha Capacitor cell
US7440258B2 (en) * 2005-03-14 2008-10-21 Maxwell Technologies, Inc. Thermal interconnects for coupling energy storage devices
JP5031611B2 (en) * 2008-02-18 2012-09-19 株式会社日立国際電気 Substrate processing apparatus, semiconductor device manufacturing method, and ceiling insulator
US8098479B1 (en) * 2008-09-19 2012-01-17 Cornell Dubilier Marketing, Inc. Capacitor having zinc coated common edge with welded aluminum terminal
KR101049282B1 (en) * 2009-03-03 2011-07-13 주식회사 네스캡 Electrical energy storage
US8456795B2 (en) * 2009-11-13 2013-06-04 American Radionic Company, Inc. Hard start kit for multiple replacement applications
JP5645718B2 (en) * 2011-03-07 2014-12-24 東京エレクトロン株式会社 Heat treatment equipment
US8570767B2 (en) * 2011-03-21 2013-10-29 Deere & Company Capacitor assembly
JP6247566B2 (en) * 2014-02-28 2017-12-13 東洋炭素株式会社 Heat treatment container, heat treatment container assembly, and semiconductor device manufacturing apparatus
JP1541104S (en) * 2014-12-12 2016-01-12

Also Published As

Publication number Publication date
JP1565116S (en) 2016-12-12
USD818961S1 (en) 2018-05-29

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