TWD218093S - Part of wafer boat for substrate processing equipment - Google Patents
Part of wafer boat for substrate processing equipment Download PDFInfo
- Publication number
- TWD218093S TWD218093S TW109305096F TW109305096F TWD218093S TW D218093 S TWD218093 S TW D218093S TW 109305096 F TW109305096 F TW 109305096F TW 109305096 F TW109305096 F TW 109305096F TW D218093 S TWD218093 S TW D218093S
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate processing
- wafer boat
- design
- case
- processing equipment
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract description 7
- 238000010586 diagram Methods 0.000 abstract description 2
Images
Abstract
【物品用途】;本設計的物品是基板處理裝置用晶舟，係用來將複數個基板呈水平地保持在基板處理裝置的反應室內的晶舟。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。;圖式中一點鏈線所圍繞者，為界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。[Use of article] The article of this design is a wafer boat for a substrate processing device. It is a wafer boat used to hold multiple substrates horizontally in the reaction chamber of the substrate processing device. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design. ; What is surrounded by the one-point chain line in the diagram is to define the scope of the claim in this case. The one-point chain line itself is the part of the design that is not claimed in this case.
Description
本設計的物品是基板處理裝置用晶舟，係用來將複數個基板呈水平地保持在基板處理裝置的反應室內的晶舟。The article of this design is a wafer boat for a substrate processing apparatus, which is a wafer boat for holding a plurality of substrates horizontally in a reaction chamber of a substrate processing apparatus.
圖式所揭露之虛線部分，為本案不主張設計之部分。The dotted line part disclosed in the drawing is the part that does not claim design in this case.
圖式中一點鏈線所圍繞者，為界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。The one-point chain line in the diagram is used to define the scope of the claim in this case, and the point-and-point chain line itself is the part of the design that is not claimed in this case.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020005341F JP1678278S (en) | 2020-03-19 | 2020-03-19 | Boat for substrate processing equipment |
| JP2020-005341 | 2020-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD218093S true TWD218093S (en) | 2022-04-11 |
Family
ID=74312790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109305096F TWD218093S (en) | 2020-03-19 | 2020-09-09 | Part of wafer boat for substrate processing equipment |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD965542S1 (en) |
| JP (1) | JP1678278S (en) |
| TW (1) | TWD218093S (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1731673S (en) * | 2022-05-30 | 2022-12-08 | ||
| JP1731675S (en) * | 2022-05-30 | 2022-12-08 | ||
| JP1731674S (en) * | 2022-05-30 | 2022-12-08 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD655255S1 (en) * | 2010-06-18 | 2012-03-06 | Hitachi Kokusai Electric Inc. | Boat of wafer processing apparatus |
| US9153466B2 (en) * | 2012-04-26 | 2015-10-06 | Asm Ip Holding B.V. | Wafer boat |
| USD734730S1 (en) * | 2012-12-27 | 2015-07-21 | Hitachi Kokusai Electric Inc. | Boat of substrate processing apparatus |
| TWD166332S (en) * | 2013-03-22 | 2015-03-01 | 日立國際電氣股份有限公司 | Part of the wafer boat for substrate processing equipment |
| TWD163542S (en) * | 2013-03-22 | 2014-10-11 | 日立國際電氣股份有限公司 | Wafer boat for substrate processing equipment |
| TWD167988S (en) * | 2013-07-29 | 2015-05-21 | 日立國際電氣股份有限公司 | Wafer boats for semiconductor manufacturing equipment |
| TWD168827S (en) * | 2013-07-29 | 2015-07-01 | 日立國際電氣股份有限公司 | Wafer boats for semiconductor manufacturing equipment |
| TWD165429S (en) * | 2013-07-29 | 2015-01-11 | 日立國際電氣股份有限公司 | Wafer boats for semiconductor manufacturing equipment |
| US9343304B2 (en) * | 2014-09-26 | 2016-05-17 | Asm Ip Holding B.V. | Method for depositing films on semiconductor wafers |
| JP1537313S (en) * | 2014-11-20 | 2015-11-09 | ||
| JP1537630S (en) * | 2014-11-20 | 2015-11-09 | ||
| JP1537629S (en) * | 2014-11-20 | 2015-11-09 | ||
| JP1537312S (en) * | 2014-11-20 | 2015-11-09 | ||
| JP1563649S (en) * | 2016-02-12 | 2016-11-21 | ||
| JP1597807S (en) * | 2017-08-21 | 2018-02-19 | ||
| USD847105S1 (en) * | 2018-05-03 | 2019-04-30 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| USD846514S1 (en) * | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| JP1638282S (en) * | 2018-09-20 | 2019-08-05 | ||
| JP1640260S (en) * | 2018-11-19 | 2019-09-02 |
-
2020
- 2020-03-19 JP JP2020005341F patent/JP1678278S/en active Active
- 2020-09-09 TW TW109305096F patent/TWD218093S/en unknown
- 2020-09-14 US US29/750,438 patent/USD965542S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP1678278S (en) | 2021-02-01 |
| USD965542S1 (en) | 2022-10-04 |
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