TWD197468S - Part of the wafer boat for substrate processing equipment - Google Patents
Part of the wafer boat for substrate processing equipmentInfo
- Publication number
- TWD197468S TWD197468S TW107306772F TW107306772F TWD197468S TW D197468 S TWD197468 S TW D197468S TW 107306772 F TW107306772 F TW 107306772F TW 107306772 F TW107306772 F TW 107306772F TW D197468 S TWD197468 S TW D197468S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- substrate processing
- wafer boat
- case
- wafer
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 5
- 238000010586 diagram Methods 0.000 abstract 2
Abstract
【物品用途】;本設計的物品是基板處理裝置用晶舟，為一種將複數個基板水平的保持在基板處理裝置的反應室內的晶舟。如「使用狀態參考圖」所示，將晶圓（基板）放置在其形狀是朝前端部傾斜的晶圓支承部上。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。;圖式中一點鏈線所圍繞者，為界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。;「部分設計之主張部分的放大立體圖」中所繪製的細線，皆為用來表現立體表面的形狀。[Use of article] The article of this design is a wafer boat for a substrate processing device, which is a wafer boat that holds multiple substrates horizontally in the reaction chamber of the substrate processing device. As shown in the "Usage Reference Diagram", place the wafer (substrate) on the wafer support that is inclined toward the front end. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design. ; What is surrounded by the one-point chain line in the diagram is to define the scope of the claim in this case. The one-point chain line itself is the part of the design that is not claimed in this case. ;The thin lines drawn in the "enlarged three-dimensional view of the proposed part of the design" are all used to express the shape of the three-dimensional surface.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2018-20434F JP1638282S (en) | 2018-09-20 | 2018-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD197468S true TWD197468S (en) | 2019-05-11 |
Family
ID=67474810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107306772F TWD197468S (en) | 2018-09-20 | 2018-11-19 | Part of the wafer boat for substrate processing equipment |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD920935S1 (en) |
| JP (1) | JP1638282S (en) |
| TW (1) | TWD197468S (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6915037B2 (en) * | 2017-02-27 | 2021-08-04 | ミライアル株式会社 | Board storage container |
| USD937791S1 (en) * | 2018-12-26 | 2021-12-07 | Lg Chem, Ltd. | Flexible printed circuit board for battery module |
| USD936025S1 (en) * | 2018-12-26 | 2021-11-16 | Lg Chem, Ltd. | Flexible printed circuit board for battery module |
| TWD202895S (en) * | 2019-03-27 | 2020-02-21 | 家登精密工業股份有限公司 | Reticle pod connecting frame |
| USD954666S1 (en) * | 2019-05-03 | 2022-06-14 | Lumileds Holding B.V. | Flexible circuit board |
| JP1678278S (en) * | 2020-03-19 | 2021-02-01 | Boat for substrate processing equipment | |
| JP1731675S (en) * | 2022-05-30 | 2022-12-08 | ||
| JP1731673S (en) * | 2022-05-30 | 2022-12-08 | ||
| JP1731674S (en) * | 2022-05-30 | 2022-12-08 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD655255S1 (en) * | 2010-06-18 | 2012-03-06 | Hitachi Kokusai Electric Inc. | Boat of wafer processing apparatus |
| USD655682S1 (en) * | 2010-06-18 | 2012-03-13 | Hitachi Kokusai Electric Inc. | Boat of wafer processing apparatus |
| US9153466B2 (en) * | 2012-04-26 | 2015-10-06 | Asm Ip Holding B.V. | Wafer boat |
| USD734730S1 (en) * | 2012-12-27 | 2015-07-21 | Hitachi Kokusai Electric Inc. | Boat of substrate processing apparatus |
| TWD166332S (en) * | 2013-03-22 | 2015-03-01 | 日立國際電氣股份有限公司 | Part of the wafer boat for substrate processing equipment |
| TWD163542S (en) * | 2013-03-22 | 2014-10-11 | 日立國際電氣股份有限公司 | Wafer boat for substrate processing equipment |
| TWD167988S (en) * | 2013-07-29 | 2015-05-21 | 日立國際電氣股份有限公司 | Wafer boats for semiconductor manufacturing equipment |
| TWD165429S (en) * | 2013-07-29 | 2015-01-11 | 日立國際電氣股份有限公司 | Wafer boats for semiconductor manufacturing equipment |
| TWD168827S (en) * | 2013-07-29 | 2015-07-01 | 日立國際電氣股份有限公司 | Wafer boats for semiconductor manufacturing equipment |
| US9343304B2 (en) * | 2014-09-26 | 2016-05-17 | Asm Ip Holding B.V. | Method for depositing films on semiconductor wafers |
| JP1537629S (en) * | 2014-11-20 | 2015-11-09 | ||
| JP1537312S (en) * | 2014-11-20 | 2015-11-09 | ||
| JP1537630S (en) * | 2014-11-20 | 2015-11-09 | ||
| JP1537313S (en) * | 2014-11-20 | 2015-11-09 | ||
| JP1563649S (en) * | 2016-02-12 | 2016-11-21 | ||
| USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
| USD836572S1 (en) * | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| JP1584784S (en) * | 2017-01-31 | 2017-08-28 | ||
| JP1584241S (en) * | 2017-01-31 | 2017-08-21 | ||
| JP1605462S (en) * | 2017-08-10 | 2021-05-31 | ||
| JP1597807S (en) * | 2017-08-21 | 2018-02-19 | ||
| USD846514S1 (en) * | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| USD847105S1 (en) * | 2018-05-03 | 2019-04-30 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
-
2018
- 2018-09-20 JP JPD2018-20434F patent/JP1638282S/ja active Active
- 2018-11-19 TW TW107306772F patent/TWD197468S/en unknown
- 2018-12-11 US US29/672,957 patent/USD920935S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP1638282S (en) | 2019-08-05 |
| USD920935S1 (en) | 2021-06-01 |
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