TWD231991S - Gas supply nozzle for substrate processing equipment - Google Patents

Gas supply nozzle for substrate processing equipment Download PDF

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Publication number
TWD231991S
TWD231991S TW111305740F TW111305740F TWD231991S TW D231991 S TWD231991 S TW D231991S TW 111305740 F TW111305740 F TW 111305740F TW 111305740 F TW111305740 F TW 111305740F TW D231991 S TWD231991 S TW D231991S
Authority
TW
Taiwan
Prior art keywords
gas supply
supply nozzle
substrate processing
processing equipment
design
Prior art date
Application number
TW111305740F
Other languages
Chinese (zh)
Inventor
平野敦士
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD231991S publication Critical patent/TWD231991S/en

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Abstract

【物品用途】;本設計的物品是基板處理裝置用氣體供給噴嘴,係一種應用在對於在反應管內部的垂直方向上被保持成多層的基板進行處理的基板處理裝置之氣體供給噴嘴。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分。[Application of the article]; The article of this design is a gas supply nozzle for a substrate processing device, which is a gas supply nozzle used in a substrate processing device for processing substrates held in multiple layers in a vertical direction inside a reaction tube. ;[Design description]; The dotted line part disclosed in the figure is the part that this case does not advocate the design of.

Description

基板處理裝置用氣體供給噴嘴之部分Gas supply nozzle for substrate processing equipment

本設計的物品是基板處理裝置用氣體供給噴嘴,係一種應用在對於在反應管內部的垂直方向上被保持成多層的基板進行處理的基板處理裝置之氣體供給噴嘴。The article of the present invention is a gas supply nozzle for a substrate processing apparatus, and is a gas supply nozzle used in a substrate processing apparatus for processing substrates held in multiple layers in a vertical direction inside a reaction tube.

圖式所揭露之虛線部分,為本案不主張設計之部分。The dotted line part in the diagram is not the design advocated by this case.

TW111305740F 2022-05-30 2022-11-18 Gas supply nozzle for substrate processing equipment TWD231991S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-011412 2022-05-30
JP2022011412F JP1731676S (en) 2022-05-30 2022-05-30

Publications (1)

Publication Number Publication Date
TWD231991S true TWD231991S (en) 2024-07-01

Family

ID=84322281

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111305740F TWD231991S (en) 2022-05-30 2022-11-18 Gas supply nozzle for substrate processing equipment

Country Status (3)

Country Link
US (1) USD1042731S1 (en)
JP (1) JP1731676S (en)
TW (1) TWD231991S (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD176076S (en) 2015-05-28 2016-06-01 日立國際電氣股份有限公司 Gas supply nozzle for substrate processing equipment

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0276796B1 (en) * 1987-01-27 1992-04-08 Asahi Glass Company Ltd. Gas feeding nozzle for a chemical vapor deposition apparatus
JP3076809B2 (en) * 1990-09-26 2000-08-14 株式会社パウレック Cleaning nozzle
AU114000S (en) * 1990-11-26 1992-05-13 Electrolux Ab A gas burner
USD641830S1 (en) * 2010-11-17 2011-07-19 Fna Ip Holdings, Inc. Spray nozzle
KR101205436B1 (en) * 2011-01-04 2012-11-28 삼성전자주식회사 Chemical Vapor Deposition Apparatus
JP6320824B2 (en) * 2014-03-31 2018-05-09 株式会社東芝 Gas supply pipe and gas processing apparatus
JP1520999S (en) * 2014-09-02 2015-04-06
JP1534651S (en) 2015-01-28 2015-10-05
JP1563647S (en) * 2016-01-29 2016-11-21
JP1563524S (en) 2016-03-30 2016-11-21
US10960415B1 (en) * 2016-12-23 2021-03-30 Bete Fog Nozzle, Inc. Spray nozzle and method
JP1589673S (en) * 2017-04-14 2017-10-30
JP1605945S (en) 2017-12-27 2018-06-04
USD888196S1 (en) * 2018-07-05 2020-06-23 Kokusai Electric Corporation Gas nozzle for substrate processing apparatus
JP1624354S (en) * 2018-07-19 2019-02-12
JP1644261S (en) 2019-03-20 2019-10-28
JP1684258S (en) * 2020-07-27 2021-04-26
JP1706319S (en) * 2021-06-16 2022-01-31

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD176076S (en) 2015-05-28 2016-06-01 日立國際電氣股份有限公司 Gas supply nozzle for substrate processing equipment

Also Published As

Publication number Publication date
JP1731676S (en) 2022-12-08
USD1042731S1 (en) 2024-09-17

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