TWD230582S - Shunts for semiconductor manufacturing equipment - Google Patents
Shunts for semiconductor manufacturing equipment Download PDFInfo
- Publication number
- TWD230582S TWD230582S TW111301062F TW111301062F TWD230582S TW D230582 S TWD230582 S TW D230582S TW 111301062 F TW111301062 F TW 111301062F TW 111301062 F TW111301062 F TW 111301062F TW D230582 S TWD230582 S TW D230582S
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor manufacturing
- manufacturing equipment
- shunts
- article
- flow divider
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 3
- 239000004065 semiconductor Substances 0.000 title abstract description 3
- 235000012431 wafers Nutrition 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
Abstract
【物品用途】;本設計的物品是半導體製造裝置用分流器，為一種在處理複數個晶圓之基板處理裝置中，被設置在處理室內，用以在複數個晶圓間分開氣流的分流器。;【設計說明】;(無)[Purpose of the article]; The article of this design is a flow divider for semiconductor manufacturing equipment, which is a flow divider installed in a processing chamber in a substrate processing device that processes multiple wafers and is used to separate the airflow between multiple wafers. ;[Design description];(None)
Description
本設計的物品是半導體製造裝置用分流器，為一種在處理複數個晶圓之基板處理裝置中，被設置在處理室內，用以在複數個晶圓間分開氣流的分流器。The article of this design is a flow divider for semiconductor manufacturing equipment, which is a flow divider installed in a processing chamber in a substrate processing device for processing multiple wafers to divide the airflow between multiple wafers.
(無)(without)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-021414 | 2021-10-01 | ||
| JP2021021414F JP1713190S (en) | 2021-10-01 | 2021-10-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD230582S true TWD230582S (en) | 2024-04-01 |
Family
ID=81209963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111301062F TWD230582S (en) | 2021-10-01 | 2022-03-04 | Shunts for semiconductor manufacturing equipment |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD1086086S1 (en) |
| JP (1) | JP1713190S (en) |
| TW (1) | TWD230582S (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD209793S (en) | 2019-02-20 | 2021-02-11 | 美商維高儀器股份有限公司 | Transportable semiconductor wafer rack |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8028978B2 (en) * | 1996-07-15 | 2011-10-04 | Semitool, Inc. | Wafer handling system |
| EP1006562A3 (en) * | 1998-12-01 | 2005-01-19 | Greene, Tweed Of Delaware, Inc. | Two-piece clamp ring for holding semiconductor wafer or other workpiece |
| JP4506125B2 (en) * | 2003-07-16 | 2010-07-21 | 信越半導体株式会社 | Vertical boat for heat treatment and manufacturing method thereof |
| US20090197424A1 (en) * | 2008-01-31 | 2009-08-06 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and method for manufacturing semiconductor device |
| USD616392S1 (en) * | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| USD734730S1 (en) * | 2012-12-27 | 2015-07-21 | Hitachi Kokusai Electric Inc. | Boat of substrate processing apparatus |
| TWD163542S (en) * | 2013-03-22 | 2014-10-11 | 日立國際電氣股份有限公司 | Wafer boat for substrate processing equipment |
| TWD166332S (en) * | 2013-03-22 | 2015-03-01 | 日立國際電氣股份有限公司 | Part of the wafer boat for substrate processing equipment |
| KR101760316B1 (en) * | 2015-09-11 | 2017-07-21 | 주식회사 유진테크 | Substrate Processing Apparatus |
| KR101731488B1 (en) * | 2015-10-27 | 2017-05-02 | 주식회사 유진테크 | Substrate Processing Apparatus and Assembling Method for Tube Assembly |
| JP1568553S (en) * | 2016-02-12 | 2017-02-06 | ||
| JP1563649S (en) * | 2016-02-12 | 2016-11-21 | ||
| JP6664487B2 (en) * | 2016-07-26 | 2020-03-13 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | Heating element, substrate processing apparatus, semiconductor device manufacturing method and program |
| USD846514S1 (en) * | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| CN112740373B (en) * | 2018-09-20 | 2024-09-10 | 株式会社国际电气 | Substrate processing apparatus, method for manufacturing semiconductor device, and storage medium |
| JP1700776S (en) * | 2021-03-04 | 2021-11-29 | Substrate placement plate for substrate processing apparatus | |
| JP1700778S (en) * | 2021-03-15 | 2021-11-29 | Shielding device for substrate processing equipment | |
| USD1023959S1 (en) * | 2021-05-11 | 2024-04-23 | Asm Ip Holding B.V. | Electrode for substrate processing apparatus |
| JP1731671S (en) * | 2022-03-15 | 2022-12-08 |
-
2021
- 2021-10-01 JP JP2021021414F patent/JP1713190S/ja active Active
-
2022
- 2022-03-04 TW TW111301062F patent/TWD230582S/en unknown
- 2022-03-30 US US29/832,777 patent/USD1086086S1/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD209793S (en) | 2019-02-20 | 2021-02-11 | 美商維高儀器股份有限公司 | Transportable semiconductor wafer rack |
Also Published As
| Publication number | Publication date |
|---|---|
| USD1086086S1 (en) | 2025-07-29 |
| JP1713190S (en) | 2022-04-21 |
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