TWD193438S - Jet ring for plasma processing unit - Google Patents

Jet ring for plasma processing unit

Info

Publication number
TWD193438S
TWD193438S TW107300619F TW107300619F TWD193438S TW D193438 S TWD193438 S TW D193438S TW 107300619 F TW107300619 F TW 107300619F TW 107300619 F TW107300619 F TW 107300619F TW D193438 S TWD193438 S TW D193438S
Authority
TW
Taiwan
Prior art keywords
plasma processing
processing unit
jet ring
article
design
Prior art date
Application number
TW107300619F
Other languages
Chinese (zh)
Inventor
奥田浩司
田中基裕
Original Assignee
日商日立全球先端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日立全球先端科技股份有限公司 filed Critical 日商日立全球先端科技股份有限公司
Publication of TWD193438S publication Critical patent/TWD193438S/en

Links

Abstract

【物品用途】;本設計的物品係如「使用狀態及標示各部名稱之參考圖」所示，是用於製造半導體所使用的電漿處理設備的電漿處理裝置用噴氣環，可將氣體經由本物品所設有的多數細孔釋放至真空室內。;【設計說明】;(無)[Usage of the article]; The article of this design is shown in the "reference drawing showing the usage status and the name of each part". It is a gas ring for a plasma processing device used in plasma processing equipment used in manufacturing semiconductors. It can pass gas through Most of the pores provided by this product are released into the vacuum chamber. ;[Design description];(none)

Description

電漿處理裝置用噴氣環Jet ring for plasma processing unit

本設計的物品係如「使用狀態及標示各部名稱之參考圖」所示，是用於製造半導體所使用的電漿處理設備的電漿處理裝置用噴氣環，可將氣體經由本物品所設有的多數細孔釋放至真空室內。The article of the design is a jet ring for a plasma processing apparatus for manufacturing a plasma processing apparatus used for semiconductors, as shown in the "Reference Diagram of the State of Use and the Names of Parts", and the gas can be supplied through the article. Most of the pores are released into the vacuum chamber.

(無)(no)

TW107300619F 2017-07-31 2018-01-31 Jet ring for plasma processing unit TWD193438S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-016497 2017-02-01
JPD2017-16497F JP1598984S (en) 2017-07-31 2017-07-31

Publications (1)

Publication Number Publication Date
TWD193438S true TWD193438S (en) 2018-10-11

Family

ID=61274621

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107300619F TWD193438S (en) 2017-07-31 2018-01-31 Jet ring for plasma processing unit

Country Status (3)

Country Link
US (1) USD871608S1 (en)
JP (1) JP1598984S (en)
TW (1) TWD193438S (en)

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US12387913B2 (en) 2022-07-08 2025-08-12 Tosoh Smd, Inc. Dynamic vacuum seal system for physical vapor deposition sputter applications

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USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
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USD1063595S1 (en) * 2023-03-30 2025-02-25 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12387913B2 (en) 2022-07-08 2025-08-12 Tosoh Smd, Inc. Dynamic vacuum seal system for physical vapor deposition sputter applications

Also Published As

Publication number Publication date
JP1598984S (en) 2018-03-05
USD871608S1 (en) 2019-12-31

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