TWD190344S - Shield ring for plasma processing unit - Google Patents

Shield ring for plasma processing unit

Info

Publication number
TWD190344S
TWD190344S TW106301395F TW106301395F TWD190344S TW D190344 S TWD190344 S TW D190344S TW 106301395 F TW106301395 F TW 106301395F TW 106301395 F TW106301395 F TW 106301395F TW D190344 S TWD190344 S TW D190344S
Authority
TW
Taiwan
Prior art keywords
plasma processing
processing unit
shield ring
cover
article
Prior art date
Application number
TW106301395F
Other languages
Chinese (zh)
Inventor
一野貴雅
佐藤浩平
中本和則
Original Assignee
日立全球先端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立全球先端科技股份有限公司 filed Critical 日立全球先端科技股份有限公司
Publication of TWD190344S publication Critical patent/TWD190344S/en

Links

Abstract

【物品用途】;本設計的物品是電漿處理裝置用罩環,為一種在半導體製造時所使用之作為電漿處理裝置之試料台的遮罩,以不讓電漿等進入到試料台內部的方式加以覆蓋。;【設計說明】[Use of article] The article of this design is a cover ring for a plasma processing device. It is a cover for the sample table of the plasma processing device used in semiconductor manufacturing to prevent plasma from entering the interior of the sample table. way to cover it. ;【Design description】

Description

電漿處理裝置用罩環 Shield ring for plasma processing unit

本設計的物品是電漿處理裝置用罩環,為一種在半導體製造時所使用之作為電漿處理裝置之試料台的遮罩,以不讓電漿等進入到試料台內部的方式加以覆蓋。 The article of the present invention is a cover ring for a plasma processing apparatus, and is a mask used as a sample stage of a plasma processing apparatus used in semiconductor manufacturing, and is covered so as not to allow plasma or the like to enter the inside of the sample stage.

TW106301395F 2017-01-31 2017-03-17 Shield ring for plasma processing unit TWD190344S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2017-1755F JP1584146S (en) 2017-01-31 2017-01-31
JP2017-001755 2017-01-31

Publications (1)

Publication Number Publication Date
TWD190344S true TWD190344S (en) 2018-05-11

Family

ID=59593506

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106301395F TWD190344S (en) 2017-01-31 2017-03-17 Shield ring for plasma processing unit

Country Status (3)

Country Link
US (1) USD840365S1 (en)
JP (1) JP1584146S (en)
TW (1) TWD190344S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD203479S (en) 2018-12-06 2020-03-21 日商國際電氣股份有限公司 Entrance cover for substrate processing device

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USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD882536S1 (en) * 2017-04-28 2020-04-28 Applied Materials, Inc. Plasma source liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
JP1640255S (en) * 2018-10-25 2019-09-02
USD918273S1 (en) * 2019-05-14 2021-05-04 Dana Gonzalez Shoe and float collar device
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
JP1678672S (en) * 2019-11-07 2021-02-08
JP1682812S (en) * 2020-08-11 2021-04-05 rectifier
JP1682810S (en) * 2020-08-11 2023-03-28 rectifier
JP1682813S (en) * 2020-08-11 2021-04-05 rectifier
JP1682811S (en) * 2020-08-11 2021-04-05 rectifier
JP1706321S (en) * 2021-06-28 2022-01-31
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector

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USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
JP2003100713A (en) * 2001-09-26 2003-04-04 Kawasaki Microelectronics Kk Cover for plasma electrode
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
USD494551S1 (en) 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US20050150452A1 (en) * 2004-01-14 2005-07-14 Soovo Sen Process kit design for deposition chamber
JP2005340251A (en) * 2004-05-24 2005-12-08 Shin Etsu Chem Co Ltd Plasma processing apparatus and shower plate therefor
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US7186171B2 (en) * 2005-04-22 2007-03-06 Applied Materials, Inc. Composite retaining ring
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD557425S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US20080121620A1 (en) * 2006-11-24 2008-05-29 Guo G X Processing chamber
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
USD638550S1 (en) * 2009-11-13 2011-05-24 3M Innovative Properties Company Sample processing disk cover
USD667561S1 (en) * 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
JP1551512S (en) * 2015-06-12 2016-06-13
JP1546801S (en) * 2015-06-12 2016-03-28
JP1546800S (en) 2015-06-12 2016-03-28

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD203479S (en) 2018-12-06 2020-03-21 日商國際電氣股份有限公司 Entrance cover for substrate processing device

Also Published As

Publication number Publication date
JP1584146S (en) 2017-08-21
USD840365S1 (en) 2019-02-12

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