TWD194248S - Air jet board for plasma processing equipment - Google Patents
Air jet board for plasma processing equipmentInfo
- Publication number
- TWD194248S TWD194248S TW107301129F TW107301129F TWD194248S TW D194248 S TWD194248 S TW D194248S TW 107301129 F TW107301129 F TW 107301129F TW 107301129 F TW107301129 F TW 107301129F TW D194248 S TWD194248 S TW D194248S
- Authority
- TW
- Taiwan
- Prior art keywords
- plasma processing
- article
- processing equipment
- air jet
- pores
- Prior art date
Links
- 239000011148 porous material Substances 0.000 abstract description 4
- 238000002347 injection Methods 0.000 abstract description 2
- 239000007924 injection Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 1
Abstract
【物品用途】;本物品主要是使用於製造半導體的電漿處理裝置中的噴氣板,如「使用狀態及標示各部名稱之參考圖」所示,(以面對著下部電極的形式)設置在電漿處理室上方。多數的細孔(噴氣孔)是以從本物品正面貫通至背面的方式進行分佈,從氣體供給管線所供給的氣體經由本物品的細孔被釋放到電漿處理室內。再者,本物品通常呈現於前視圖的這一側是配置成面向晶圓。;【設計說明】;(無)
Description
本物品主要是使用於製造半導體的電漿處理裝置中的噴氣板,如「使用狀態及標示各部名稱之參考圖」所示,(以面對著下部電極的形式)設置在電漿處理室上方。多數的細孔(噴氣孔)是以從本物品正面貫通至背面的方式進行分佈,從氣體供給管線所供給的氣體經由本物品的細孔被釋放到電漿處理室內。再者,本物品通常呈現於前視圖的這一側是配置成面向晶圓。
(無)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-024710 | 2017-11-06 | ||
JPD2017-24710F JP1605832S (zh) | 2017-11-06 | 2017-11-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD194248S true TWD194248S (zh) | 2018-11-21 |
Family
ID=62239122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107301129F TWD194248S (zh) | 2017-11-06 | 2018-02-27 | Air jet board for plasma processing equipment |
Country Status (3)
Country | Link |
---|---|
US (1) | USD868995S1 (zh) |
JP (1) | JP1605832S (zh) |
TW (1) | TWD194248S (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD976242S1 (en) * | 2019-06-03 | 2023-01-24 | Space Exploration Technologies Corp. | Antenna apparatus |
USD971192S1 (en) * | 2019-06-03 | 2022-11-29 | Space Exploration Technologies Corp. | Antenna apparatus |
USD971900S1 (en) * | 2019-06-03 | 2022-12-06 | Space Exploration Technologies Corp. | Antenna apparatus |
USD955217S1 (en) * | 2019-10-04 | 2022-06-21 | Coart Inc. | Cup lid |
JP1659287S (zh) * | 2019-10-18 | 2020-05-11 | ||
USD962906S1 (en) * | 2020-01-09 | 2022-09-06 | Space Exploration Technologies Corp. | Antenna apparatus |
USD963623S1 (en) * | 2020-01-09 | 2022-09-13 | Space Exploration Technologies Corp. | Antenna apparatus |
USD986228S1 (en) * | 2020-01-09 | 2023-05-16 | Space Exploration Technologies Corp. | Antenna apparatus |
USD962206S1 (en) * | 2020-01-09 | 2022-08-30 | Space Exploration Technologies Corp. | Antenna apparatus |
USD962908S1 (en) * | 2020-07-09 | 2022-09-06 | Space Exploration Technologies Corp. | Antenna apparatus |
USD1012249S1 (en) * | 2020-09-29 | 2024-01-23 | Brent Waterman | Pipe covering |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW460915B (en) | 1999-06-30 | 2001-10-21 | Lam Res Corp | Gas distribution apparatus for semiconductor processing |
TWM557450U (zh) | 2017-09-06 | 2018-03-21 | K Max Technology Co Ltd | 離子植入機之電弧室 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD411516S (en) * | 1996-03-15 | 1999-06-29 | Tokyo Electron Limited | Gas diffusion plate for electrode of semiconductor wafer processing apparatus |
USD589473S1 (en) * | 2007-05-30 | 2009-03-31 | Nitto Denko Corporation | Adhesive film material for use in manufacturing semiconductors |
KR101036156B1 (ko) * | 2009-07-01 | 2011-05-23 | 이장우 | 살수판 |
USD638550S1 (en) * | 2009-11-13 | 2011-05-24 | 3M Innovative Properties Company | Sample processing disk cover |
USD667561S1 (en) * | 2009-11-13 | 2012-09-18 | 3M Innovative Properties Company | Sample processing disk cover |
USD648289S1 (en) * | 2010-10-21 | 2011-11-08 | Novellus Systems, Inc. | Electroplating flow shaping plate having offset spiral hole pattern |
USD672050S1 (en) * | 2012-01-13 | 2012-12-04 | Samsung Electronics Co., Ltd. | Disk for a medical testing machine |
USD734483S1 (en) * | 2013-12-31 | 2015-07-14 | Alamak Biosciences Incorporation Company Limited | Tissue cell block for cancer detection |
USD794210S1 (en) * | 2014-04-15 | 2017-08-08 | Q-Linea Ab | Sample holding disc and master used in its manufacture |
JP1545222S (zh) * | 2015-06-10 | 2016-03-07 | ||
TWD178425S (zh) * | 2016-01-08 | 2016-09-21 | Asm知識產權私人控股有限公司 | 用於半導體製造設備的電極板 |
JP6815894B2 (ja) * | 2017-02-27 | 2021-01-20 | 株式会社ディスコ | 静電チャックテーブルの使用方法 |
-
2017
- 2017-11-06 JP JPD2017-24710F patent/JP1605832S/ja active Active
-
2018
- 2018-02-27 TW TW107301129F patent/TWD194248S/zh unknown
- 2018-02-27 US US29/638,441 patent/USD868995S1/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW460915B (en) | 1999-06-30 | 2001-10-21 | Lam Res Corp | Gas distribution apparatus for semiconductor processing |
TWM557450U (zh) | 2017-09-06 | 2018-03-21 | K Max Technology Co Ltd | 離子植入機之電弧室 |
Also Published As
Publication number | Publication date |
---|---|
USD868995S1 (en) | 2019-12-03 |
JP1605832S (zh) | 2018-06-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWD194248S (zh) | Air jet board for plasma processing equipment | |
TWD177427S (zh) | 電漿處理裝置用電極板 | |
TWD193438S (zh) | Jet ring for plasma processing unit | |
TWD178425S (zh) | 用於半導體製造設備的電極板 | |
TWD199478S (zh) | 半導體製造裝置用離子遮蔽板 | |
TWD196097S (zh) | 用於半導體製造設備的氣體供應板 | |
SG10201901224SA (en) | Substrate processing method | |
TWD175855S (zh) | 電漿處理裝置用下腔室 | |
TWD175119S (zh) | 反應管 | |
TWD202287S (zh) | 半導體製造裝置用離子遮蔽板保持具 | |
TWD204223S (zh) | 電漿處理裝置用接地電極 | |
MY182999A (en) | Air-permeable sheet | |
TWD199479S (zh) | 半導體製造裝置用離子遮蔽器 | |
TWD163542S (zh) | 基板處理裝置用晶舟 | |
MY186300A (en) | Electrostatic chuck | |
TWD171078S (zh) | 基板處理裝置用氣體供給噴嘴之部分 | |
TWD194954S (zh) | Elastic film for semiconductor wafer polishing | |
TWD194953S (zh) | Elastic film for semiconductor wafer polishing | |
MY179208A (en) | Chuck table | |
TWD193203S (zh) | Elastic film for semiconductor wafer polishing | |
MX2013006590A (es) | Dispositivo de suministro de solapa. | |
JP1727811S (ja) | 半導体製造用ガス供給ノズル | |
JP1727852S (ja) | 半導体製造用ガス供給ノズル | |
JP1727812S (ja) | 半導体製造用ガス供給ノズル | |
TWD168373S (zh) | 半導體晶圓硏磨裝置用彈性膜之部分 |