JP1713190S - - Google Patents

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Publication number
JP1713190S
JP1713190S JP2021021414F JP2021021414F JP1713190S JP 1713190 S JP1713190 S JP 1713190S JP 2021021414 F JP2021021414 F JP 2021021414F JP 2021021414 F JP2021021414 F JP 2021021414F JP 1713190 S JP1713190 S JP 1713190S
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021021414F
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Japanese (ja)
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Priority to JP2021021414F priority Critical patent/JP1713190S/ja
Priority to TW111301062F priority patent/TWD230582S/zh
Priority to US29/832,777 priority patent/USD1086086S1/en
Application granted granted Critical
Publication of JP1713190S publication Critical patent/JP1713190S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021021414F 2021-10-01 2021-10-01 Active JP1713190S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021021414F JP1713190S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2021-10-01 2021-10-01
TW111301062F TWD230582S (zh) 2021-10-01 2022-03-04 半導體製造裝置用分流器
US29/832,777 USD1086086S1 (en) 2021-10-01 2022-03-30 Separator of substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021021414F JP1713190S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2021-10-01 2021-10-01

Publications (1)

Publication Number Publication Date
JP1713190S true JP1713190S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2022-04-21

Family

ID=81209963

Family Applications (1)

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JP2021021414F Active JP1713190S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2021-10-01 2021-10-01

Country Status (3)

Country Link
US (1) USD1086086S1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP1713190S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TWD230582S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8028978B2 (en) * 1996-07-15 2011-10-04 Semitool, Inc. Wafer handling system
EP1006562A3 (en) * 1998-12-01 2005-01-19 Greene, Tweed Of Delaware, Inc. Two-piece clamp ring for holding semiconductor wafer or other workpiece
JP4506125B2 (ja) * 2003-07-16 2010-07-21 信越半導体株式会社 熱処理用縦型ボート及びその製造方法
US20090197424A1 (en) * 2008-01-31 2009-08-06 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method for manufacturing semiconductor device
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
TWD163542S (zh) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 基板處理裝置用晶舟
KR101760316B1 (ko) * 2015-09-11 2017-07-21 주식회사 유진테크 기판처리장치
KR101731488B1 (ko) * 2015-10-27 2017-05-02 주식회사 유진테크 기판처리장치 및 튜브 조립체 조립방법
JP1568553S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2016-02-12 2017-02-06
JP1563649S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2016-02-12 2016-11-21
JP6664487B2 (ja) * 2016-07-26 2020-03-13 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 発熱体、基板処理装置、半導体装置の製造方法およびプログラム
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
JP7229266B2 (ja) * 2018-09-20 2023-02-27 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、及びプログラム
USD908103S1 (en) 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
JP1700776S (ja) * 2021-03-04 2021-11-29 基板処理装置用基板載置プレート
JP1700778S (ja) * 2021-03-15 2021-11-29 基板処理装置用遮蔽具
USD1023959S1 (en) * 2021-05-11 2024-04-23 Asm Ip Holding B.V. Electrode for substrate processing apparatus
JP1731671S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2022-03-15 2022-12-08

Also Published As

Publication number Publication date
USD1086086S1 (en) 2025-07-29
TWD230582S (zh) 2024-04-01

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