TWD230464S - 基板處理裝置用基板移動具 - Google Patents

基板處理裝置用基板移動具 Download PDF

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Publication number
TWD230464S
TWD230464S TW112300492F TW112300492F TWD230464S TW D230464 S TWD230464 S TW D230464S TW 112300492 F TW112300492 F TW 112300492F TW 112300492 F TW112300492 F TW 112300492F TW D230464 S TWD230464 S TW D230464S
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TW
Taiwan
Prior art keywords
substrate
moving tool
processing equipment
substrate processing
article
Prior art date
Application number
TW112300492F
Other languages
English (en)
Chinese (zh)
Inventor
神田達輝
森田慎也
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD230464S publication Critical patent/TWD230464S/zh

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TW112300492F 2022-09-14 2023-02-07 基板處理裝置用基板移動具 TWD230464S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-019754 2022-09-14
JP2022019754F JP1741512S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2022-09-14 2022-09-14

Publications (1)

Publication Number Publication Date
TWD230464S true TWD230464S (zh) 2024-03-21

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ID=85802433

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112300492F TWD230464S (zh) 2022-09-14 2023-02-07 基板處理裝置用基板移動具

Country Status (3)

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US (1) USD1063875S1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP1741512S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TWD230464S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD218088S (zh) 2020-03-10 2022-04-11 日商國際電氣股份有限公司 基板處理裝置用晶舟

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JP3122364B2 (ja) * 1996-02-06 2001-01-09 東京エレクトロン株式会社 ウエハボート
USD404015S (en) * 1997-01-31 1999-01-12 Tokyo Electron Ltd. Wafer boat for use in a semiconductor wafer heat processing apparatus
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TWD165429S (zh) * 2013-07-29 2015-01-11 日立國際電氣股份有限公司 半導體製造裝置用晶舟
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JP1640260S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2018-11-19 2019-09-02
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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD218088S (zh) 2020-03-10 2022-04-11 日商國際電氣股份有限公司 基板處理裝置用晶舟

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Publication number Publication date
USD1063875S1 (en) 2025-02-25
JP1741512S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2023-04-11

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