JP1741512S - - Google Patents

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Publication number
JP1741512S
JP1741512S JP2022019754F JP2022019754F JP1741512S JP 1741512 S JP1741512 S JP 1741512S JP 2022019754 F JP2022019754 F JP 2022019754F JP 2022019754 F JP2022019754 F JP 2022019754F JP 1741512 S JP1741512 S JP 1741512S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022019754F
Other languages
Japanese (ja)
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Publication date
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Priority to JP2022019754F priority Critical patent/JP1741512S/ja
Priority to TW112300492F priority patent/TWD230464S/zh
Priority to US29/885,259 priority patent/USD1063875S1/en
Application granted granted Critical
Publication of JP1741512S publication Critical patent/JP1741512S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022019754F 2022-09-14 2022-09-14 Active JP1741512S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022019754F JP1741512S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2022-09-14 2022-09-14
TW112300492F TWD230464S (zh) 2022-09-14 2023-02-07 基板處理裝置用基板移動具
US29/885,259 USD1063875S1 (en) 2022-09-14 2023-02-22 Substrate lifter for semiconductor manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022019754F JP1741512S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2022-09-14 2022-09-14

Publications (1)

Publication Number Publication Date
JP1741512S true JP1741512S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2023-04-11

Family

ID=85802433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022019754F Active JP1741512S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2022-09-14 2022-09-14

Country Status (3)

Country Link
US (1) USD1063875S1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP1741512S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TWD230464S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Family Cites Families (41)

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USD378675S (en) * 1995-05-30 1997-04-01 Tokyo Electron Limited Wafer boat
USD378823S (en) * 1995-05-30 1997-04-15 Tokyo Electron Limited Wafer boat
JP3122364B2 (ja) * 1996-02-06 2001-01-09 東京エレクトロン株式会社 ウエハボート
USD404015S (en) * 1997-01-31 1999-01-12 Tokyo Electron Ltd. Wafer boat for use in a semiconductor wafer heat processing apparatus
USD411176S (en) * 1997-08-20 1999-06-22 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
USD409158S (en) * 1997-08-20 1999-05-04 Tokyo Electron Limited Wafer boat for use in a semiconductor wafer heat processing apparatus
KR20000002833A (ko) * 1998-06-23 2000-01-15 윤종용 반도체 웨이퍼 보트
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US6225594B1 (en) * 1999-04-15 2001-05-01 Integrated Materials, Inc. Method and apparatus for securing components of wafer processing fixtures
US6099645A (en) * 1999-07-09 2000-08-08 Union Oil Company Of California Vertical semiconductor wafer carrier with slats
US6287112B1 (en) * 2000-03-30 2001-09-11 Asm International, N.V. Wafer boat
US6341935B1 (en) * 2000-06-14 2002-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer boat having improved wafer holding capability
US20020130061A1 (en) * 2000-11-02 2002-09-19 Hengst Richard R. Apparatus and method of making a slip free wafer boat
US6727191B2 (en) * 2001-02-26 2004-04-27 Integrated Materials, Inc. High temperature hydrogen anneal of silicon wafers supported on a silicon fixture
JP4467028B2 (ja) * 2001-05-11 2010-05-26 信越石英株式会社 縦型ウェーハ支持治具
US6811040B2 (en) * 2001-07-16 2004-11-02 Rohm And Haas Company Wafer holding apparatus
JP4506125B2 (ja) * 2003-07-16 2010-07-21 信越半導体株式会社 熱処理用縦型ボート及びその製造方法
TWD119911S1 (zh) * 2006-05-01 2007-11-11 東京威力科創股份有限公司 晶舟
TWD119910S1 (zh) * 2006-05-01 2007-11-11 東京威力科創股份有限公司 晶舟
TWD130137S1 (zh) * 2006-10-25 2009-08-01 東京威力科創股份有限公司 晶舟
USD703161S1 (en) * 2012-10-15 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for ion implantation
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
TWD163542S (zh) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 基板處理裝置用晶舟
TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
TWD165429S (zh) * 2013-07-29 2015-01-11 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD167988S (zh) * 2013-07-29 2015-05-21 日立國際電氣股份有限公司 半導體製造裝置用晶舟
TWD168827S (zh) * 2013-07-29 2015-07-01 日立國際電氣股份有限公司 半導體製造裝置用晶舟
JP1537312S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2014-11-20 2015-11-09
JP1537629S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2014-11-20 2015-11-09
JP1563649S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2016-02-12 2016-11-21
JP1597807S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2017-08-21 2018-02-19
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
JP1638282S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2018-09-20 2019-08-05
JP1640260S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2018-11-19 2019-09-02
JP1665228S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2019-11-28 2020-08-03
JP1678274S (ja) 2020-03-10 2021-02-01 基板処理装置用ボート
JP1678278S (ja) * 2020-03-19 2021-02-01 基板処理装置用ボート
JP1700777S (ja) * 2021-03-15 2021-11-29 基板処理装置用ボート

Also Published As

Publication number Publication date
USD1063875S1 (en) 2025-02-25
TWD230464S (zh) 2024-03-21

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