TWD225634S - 半導體製造裝置用隔熱組件外罩之部分 - Google Patents
半導體製造裝置用隔熱組件外罩之部分 Download PDFInfo
- Publication number
- TWD225634S TWD225634S TW110306503F TW110306503F TWD225634S TW D225634 S TWD225634 S TW D225634S TW 110306503 F TW110306503 F TW 110306503F TW 110306503 F TW110306503 F TW 110306503F TW D225634 S TWD225634 S TW D225634S
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- cover
- design
- manufacturing equipment
- semiconductor manufacturing
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract description 5
- 238000004519 manufacturing process Methods 0.000 title abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 1
Images
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-014031 | 2021-06-28 | ||
| JP2021014031F JP1706321S (enrdf_load_stackoverflow) | 2021-06-28 | 2021-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD225634S true TWD225634S (zh) | 2023-06-01 |
Family
ID=80218885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110306503F TWD225634S (zh) | 2021-06-28 | 2021-11-30 | 半導體製造裝置用隔熱組件外罩之部分 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD1003243S1 (enrdf_load_stackoverflow) |
| JP (1) | JP1706321S (enrdf_load_stackoverflow) |
| TW (1) | TWD225634S (enrdf_load_stackoverflow) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD390539S (en) * | 1996-07-29 | 1998-02-10 | Wakefield Engineering, Inc. | Heat sink |
| USD404369S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Manifold cover for use in a semiconductor wafer heat processing apparatus |
| US6450346B1 (en) * | 2000-06-30 | 2002-09-17 | Integrated Materials, Inc. | Silicon fixtures for supporting wafers during thermal processing |
| USD586498S1 (en) * | 2007-12-17 | 2009-02-10 | Lighthouse Technology Co., Ltd. | Heat dissipating structure of a lamp |
| USD655801S1 (en) * | 2011-06-28 | 2012-03-13 | Cps Products, Inc. | Portable submersible condenser/heat exchanger |
| TWD167985S (zh) * | 2013-06-28 | 2015-05-21 | 日立國際電氣股份有限公司 | 反應管之部分 |
| JP1565116S (enrdf_load_stackoverflow) | 2016-02-10 | 2016-12-12 | ||
| JP1564810S (enrdf_load_stackoverflow) * | 2016-02-10 | 2016-12-05 | ||
| JP1584146S (enrdf_load_stackoverflow) * | 2017-01-31 | 2017-08-21 |
-
2021
- 2021-06-28 JP JP2021014031F patent/JP1706321S/ja active Active
- 2021-11-30 TW TW110306503F patent/TWD225634S/zh unknown
- 2021-12-23 US US29/820,723 patent/USD1003243S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD1003243S1 (en) | 2023-10-31 |
| JP1706321S (enrdf_load_stackoverflow) | 2022-01-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWD208179S (zh) | 基板處理裝置用晶舟之部分 | |
| TWD197466S (zh) | 基板處理裝置用隔熱板 | |
| TWD215398S (zh) | 基板處理腔室的製程護罩 | |
| JP1711119S (ja) | サセプタリング | |
| JP1711120S (ja) | サセプタカバー | |
| TWD203444S (zh) | 基板處理裝置用氣體導入管 | |
| TWD218093S (zh) | 基板處理裝置用晶舟之部分 | |
| JP1741174S (ja) | サセプタ | |
| TWD202463S (zh) | 基板處理裝置用晶舟之部分 | |
| TWD211225S (zh) | 排氣管 | |
| TWD196950S (zh) | 基板處理裝置用電氣爐之部分 | |
| JP1745873S (ja) | サセプタ | |
| JP1741172S (ja) | サセプタカバー | |
| TWD183004S (zh) | 半導體製造裝置之隔熱組件 | |
| JP1741175S (ja) | サセプタ | |
| TWD209793S (zh) | 半導體晶圓架 | |
| TWD200031S (zh) | 基板處理裝置用電氣爐 | |
| TWD225036S (zh) | 基板處理裝置用隔熱板 | |
| TWD197467S (zh) | 基板處理裝置用氣體導入管 | |
| TWD225634S (zh) | 半導體製造裝置用隔熱組件外罩之部分 | |
| TWD225633S (zh) | 半導體製造裝置用隔熱組件外罩 | |
| JP1745924S (ja) | サセプタ | |
| TWD183005S (zh) | 半導體製造裝置之隔熱組件外罩 | |
| TWD209426S (zh) | 光罩傳送盒之底座 | |
| TWD187805S (zh) | Part of the substrate processing component |