USD1003243S1 - Heat insulator cover of semiconductor manufacturing apparatus - Google Patents

Heat insulator cover of semiconductor manufacturing apparatus Download PDF

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Publication number
USD1003243S1
USD1003243S1 US29/820,723 US202129820723F USD1003243S US D1003243 S1 USD1003243 S1 US D1003243S1 US 202129820723 F US202129820723 F US 202129820723F US D1003243 S USD1003243 S US D1003243S
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United States
Prior art keywords
manufacturing apparatus
semiconductor manufacturing
heat insulator
insulator cover
cover
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Active
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US29/820,723
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English (en)
Inventor
Yusaku OKAJIMA
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Kokusai Electric Corp
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Kokusai Electric Corp
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Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKAJIMA, YUSAKU
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US29/820,723 2021-06-28 2021-12-23 Heat insulator cover of semiconductor manufacturing apparatus Active USD1003243S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-014031D 2021-06-28
JP2021014031F JP1706321S (enrdf_load_stackoverflow) 2021-06-28 2021-06-28

Publications (1)

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USD1003243S1 true USD1003243S1 (en) 2023-10-31

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US (1) USD1003243S1 (enrdf_load_stackoverflow)
JP (1) JP1706321S (enrdf_load_stackoverflow)
TW (1) TWD225634S (enrdf_load_stackoverflow)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD390539S (en) * 1996-07-29 1998-02-10 Wakefield Engineering, Inc. Heat sink
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US6450346B1 (en) * 2000-06-30 2002-09-17 Integrated Materials, Inc. Silicon fixtures for supporting wafers during thermal processing
USD586498S1 (en) * 2007-12-17 2009-02-10 Lighthouse Technology Co., Ltd. Heat dissipating structure of a lamp
USD655801S1 (en) * 2011-06-28 2012-03-13 Cps Products, Inc. Portable submersible condenser/heat exchanger
USD720707S1 (en) * 2013-06-28 2015-01-06 Hitachi Kokusai Electric Inc. Reaction tube
USD818960S1 (en) * 2016-02-10 2018-05-29 Hitachi Kokusai Electric Inc. Insulation unit of semiconductor manufacturing apparatus
USD818961S1 (en) 2016-02-10 2018-05-29 Hitachi Kokusai Electric Inc. Insulation unit cover of semiconductor manufacturing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD390539S (en) * 1996-07-29 1998-02-10 Wakefield Engineering, Inc. Heat sink
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US6450346B1 (en) * 2000-06-30 2002-09-17 Integrated Materials, Inc. Silicon fixtures for supporting wafers during thermal processing
USD586498S1 (en) * 2007-12-17 2009-02-10 Lighthouse Technology Co., Ltd. Heat dissipating structure of a lamp
USD655801S1 (en) * 2011-06-28 2012-03-13 Cps Products, Inc. Portable submersible condenser/heat exchanger
USD720707S1 (en) * 2013-06-28 2015-01-06 Hitachi Kokusai Electric Inc. Reaction tube
USD818960S1 (en) * 2016-02-10 2018-05-29 Hitachi Kokusai Electric Inc. Insulation unit of semiconductor manufacturing apparatus
USD818961S1 (en) 2016-02-10 2018-05-29 Hitachi Kokusai Electric Inc. Insulation unit cover of semiconductor manufacturing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus

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JP1706321S (enrdf_load_stackoverflow) 2022-01-31
TWD225634S (zh) 2023-06-01

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