TWD206653S - 基板處理裝置用吸頂式加熱器的保持板 - Google Patents

基板處理裝置用吸頂式加熱器的保持板 Download PDF

Info

Publication number
TWD206653S
TWD206653S TW108307122F TW108307122F TWD206653S TW D206653 S TWD206653 S TW D206653S TW 108307122 F TW108307122 F TW 108307122F TW 108307122 F TW108307122 F TW 108307122F TW D206653 S TWD206653 S TW D206653S
Authority
TW
Taiwan
Prior art keywords
processing device
substrate processing
holding plate
ceiling heater
ceiling
Prior art date
Application number
TW108307122F
Other languages
English (en)
Chinese (zh)
Inventor
杉浦忍
小杉哲也
山口天和
Original Assignee
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司
Publication of TWD206653S publication Critical patent/TWD206653S/zh

Links

Images

TW108307122F 2019-07-18 2019-11-21 基板處理裝置用吸頂式加熱器的保持板 TWD206653S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-016134 2019-01-31
JPD2019-16134F JP1651623S (cs) 2019-07-18 2019-07-18

Publications (1)

Publication Number Publication Date
TWD206653S true TWD206653S (zh) 2020-08-21

Family

ID=69183226

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108307122F TWD206653S (zh) 2019-07-18 2019-11-21 基板處理裝置用吸頂式加熱器的保持板

Country Status (3)

Country Link
US (1) USD918848S1 (cs)
JP (1) JP1651623S (cs)
TW (1) TWD206653S (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD223375S (zh) 2021-03-29 2023-02-01 大陸商北京北方華創微電子裝備有限公司 靜電卡盤

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD954567S1 (en) 2019-06-25 2022-06-14 Ebara Corporation Measurement jig
JP1651619S (cs) * 2019-07-11 2020-01-27
JP1651618S (cs) * 2019-07-11 2020-01-27
USD940131S1 (en) * 2019-07-29 2022-01-04 Samsung Display Co., Ltd. Display panel
USD966276S1 (en) 2019-07-29 2022-10-11 Samsung Display Co., Ltd. Display module for wearable device
USD958094S1 (en) 2019-07-29 2022-07-19 Samsung Display Co., Ltd. Display panel
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
JP1684469S (ja) * 2020-09-24 2021-05-10 基板処理装置用天井ヒータ
JP1684468S (ja) * 2020-09-24 2021-05-10 基板処理装置用天井ヒータ
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5533924A (en) * 1994-09-01 1996-07-09 Micron Technology, Inc. Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers
USD405427S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
US6030487A (en) * 1997-06-19 2000-02-29 International Business Machines Corporation Wafer carrier assembly
US6116992A (en) * 1997-12-30 2000-09-12 Applied Materials, Inc. Substrate retaining ring
US6531397B1 (en) * 1998-01-09 2003-03-11 Lsi Logic Corporation Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6390904B1 (en) * 1998-05-21 2002-05-21 Applied Materials, Inc. Retainers and non-abrasive liners used in chemical mechanical polishing
US6390905B1 (en) * 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
US6719874B1 (en) * 2001-03-30 2004-04-13 Lam Research Corporation Active retaining ring support
TW504460B (en) * 2001-05-25 2002-10-01 Benq Corp Chip protection device
DE10247179A1 (de) * 2002-10-02 2004-04-15 Ensinger Kunststofftechnologie Gbr Haltering zum Halten von Halbleiterwafern in einer chemisch-mechanischen Poliervorrichtung
CN1910012B (zh) * 2003-11-13 2012-03-21 应用材料公司 具有成型表面的固定环
US7326105B2 (en) * 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
TWD125598S1 (zh) * 2006-09-28 2008-10-21 東京威力科創股份有限公司 半導體製造用加熱器
TWD125599S1 (zh) * 2006-09-28 2008-10-21 東京威力科創股份有限公司 半導體製造用加熱器
JP2008229790A (ja) * 2007-03-22 2008-10-02 Nec Electronics Corp リテーナリングおよび研磨装置
USD600220S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
TWD130834S1 (zh) * 2008-03-28 2009-09-11 東京威力科創股份有限公司 半導體製造用保溫筒之散熱翼片
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD615937S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US8517803B2 (en) * 2009-09-16 2013-08-27 SPM Technology, Inc. Retaining ring for chemical mechanical polishing
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
USD732094S1 (en) * 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
KR102152964B1 (ko) * 2013-01-11 2020-09-07 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 폴리싱 장치 및 방법
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
JP6306151B2 (ja) * 2014-03-20 2018-04-04 株式会社日立国際電気 基板処理装置、断熱構造体及び半導体装置の製造方法
JP1541874S (cs) * 2015-03-16 2016-01-18
US10174437B2 (en) * 2015-07-09 2019-01-08 Applied Materials, Inc. Wafer electroplating chuck assembly
JP1556433S (cs) * 2015-10-06 2016-08-15
JP1560719S (cs) * 2015-12-01 2016-10-11
USD814432S1 (en) * 2016-02-09 2018-04-03 Witricity Corporation Resonator coil
JP1581406S (cs) * 2016-10-14 2017-07-18
KR102384004B1 (ko) * 2016-12-01 2022-04-06 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 천장 히터 및 반도체 장치의 제조 방법
USD825503S1 (en) * 2017-06-07 2018-08-14 Witricity Corporation Resonator coil
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
KR20190008101A (ko) * 2017-07-14 2019-01-23 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 기판 보지구 및 반도체 장치의 제조 방법
TWD191614S (zh) * 2017-08-04 2018-07-11 合利億股份有限公司 無線充電線圈

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD223375S (zh) 2021-03-29 2023-02-01 大陸商北京北方華創微電子裝備有限公司 靜電卡盤

Also Published As

Publication number Publication date
USD918848S1 (en) 2021-05-11
JP1651623S (cs) 2020-01-27

Similar Documents

Publication Publication Date Title
TWD206653S (zh) 基板處理裝置用吸頂式加熱器的保持板
TWD187001S (zh) 基板處理裝置用頂置式加熱器
TWD211408S (zh) 消毒裝置之部分
TWD209275S (zh) 氣體供應單元用溫度控制裝置
EA202190918A1 (ru) Устройство, генерирующее аэрозоль, и нагревательная камера для него
TWD212933S (zh) 用於處理腔室基板支撐件的基底板
TWD217779S (zh) 基板處理裝置用置頂式加熱器
TWD208179S (zh) 基板處理裝置用晶舟之部分
TWD221687S (zh) 連接器
TWD210894S (zh) 用於基材處理室的處理遮罩件
TWD204319S (zh) 蒸發器裝置
TWD211786S (zh) 醫用桿裝置夾子
TWD176076S (zh) 基板處理裝置用氣體供給噴嘴
TWD213398S (zh) 基板支撐底座
TWD216508S (zh) 連接器
TWD197466S (zh) 基板處理裝置用隔熱板
TWD209446S (zh) 用於呼吸支持系統的單元端連接件
TWD204806S (zh) 水平儀之部分
TWD190862S (zh) 頭髮照護用具的支架（二）
TWD213486S (zh) 鉗子之部分
TWD174342S (zh) 排氣處理裝置用內筒之部分
TWD217778S (zh) 基板處理裝置用置頂式加熱器
TWD211989S (zh) 管夾
TWD212772S (zh) 基板處理裝置用吸頂式加熱器的保持板
TWD207699S (zh) 基板處理裝置用吸頂式加熱器的保持板