TWD223375S - 靜電卡盤 - Google Patents
靜電卡盤 Download PDFInfo
- Publication number
- TWD223375S TWD223375S TW110304948F TW110304948F TWD223375S TW D223375 S TWD223375 S TW D223375S TW 110304948 F TW110304948 F TW 110304948F TW 110304948 F TW110304948 F TW 110304948F TW D223375 S TWD223375 S TW D223375S
- Authority
- TW
- Taiwan
- Prior art keywords
- mark
- design
- case
- chip
- electrostatic chuck
- Prior art date
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- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000000007 visual effect Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
【物品用途】;用於對晶片進行承載和固定,避免晶片在製程中出現移位或錯位,並在連接射頻電源後,為晶片提供射頻偏壓和控制晶片表面的溫度;【設計說明】;本案設計係新穎獨特之樣式,藉由形狀和圖案的結合設計靜電卡盤,可顯現出現有技術所未有之視覺效果。;本案最能表明設計要點的圖片或照片為:立體圖1。本案省略無設計要點的後視圖。;A部放大圖中標記1為靜電卡盤上的凸起,凸起高度很小,在3至8微米之間;標記2為氣道;標記3為用於定位的槽;標記4為孔。B部放大圖中標記5為中心氣孔;標記6為C形塗層;標記7為長圓形槽。;圖式所揭露之文字,為本案不主張設計之部分。
Description
用於對晶片進行承載和固定,避免晶片在製程中出現移位或錯位,並在連接射頻電源後,為晶片提供射頻偏壓和控制晶片表面的溫度
本案設計係新穎獨特之樣式,藉由形狀和圖案的結合設計靜電卡盤,可顯現出現有技術所未有之視覺效果。
本案最能表明設計要點的圖片或照片為:立體圖1。本案省略無設計要點的後視圖。
A部放大圖中標記1為靜電卡盤上的凸起,凸起高度很小,在3至8微米之間;標記2為氣道;標記3為用於定位的槽;標記4為孔。B部放大圖中標記5為中心氣孔;標記6為C形塗層;標記7為長圓形槽。
圖式所揭露之文字,為本案不主張設計之部分。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202130170686.X | 2021-03-29 | ||
CN202130170686 | 2021-03-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD223375S true TWD223375S (zh) | 2023-02-01 |
Family
ID=83059681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110304948F TWD223375S (zh) | 2021-03-29 | 2021-09-14 | 靜電卡盤 |
Country Status (3)
Country | Link |
---|---|
US (1) | USD984972S1 (zh) |
JP (1) | JP1723603S (zh) |
TW (1) | TWD223375S (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1007449S1 (en) * | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD206653S (zh) | 2019-07-18 | 2020-08-21 | 日商國際電氣股份有限公司 | 基板處理裝置用吸頂式加熱器的保持板 |
Family Cites Families (38)
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---|---|---|---|---|
GB2106325A (en) * | 1981-09-14 | 1983-04-07 | Philips Electronic Associated | Electrostatic chuck |
GB2147459A (en) * | 1983-09-30 | 1985-05-09 | Philips Electronic Associated | Electrostatic chuck for semiconductor wafers |
JPS6131636U (ja) * | 1984-07-31 | 1986-02-26 | 株式会社 徳田製作所 | 静電チヤツク |
JP2665242B2 (ja) * | 1988-09-19 | 1997-10-22 | 東陶機器株式会社 | 静電チャック |
USD363464S (en) * | 1992-08-27 | 1995-10-24 | Tokyo Electron Yamanashi Limited | Electrode for a semiconductor processing apparatus |
JPH09213777A (ja) * | 1996-01-31 | 1997-08-15 | Kyocera Corp | 静電チャック |
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JP3983387B2 (ja) * | 1998-09-29 | 2007-09-26 | 日本碍子株式会社 | 静電チャック |
JP3551867B2 (ja) * | 1999-11-09 | 2004-08-11 | 信越化学工業株式会社 | シリコンフォーカスリング及びその製造方法 |
EP1435655A3 (en) * | 2000-05-10 | 2004-07-14 | Ibiden Co., Ltd. | Electrostatic chuck |
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JP4094262B2 (ja) * | 2001-09-13 | 2008-06-04 | 住友大阪セメント株式会社 | 吸着固定装置及びその製造方法 |
USD489739S1 (en) * | 2002-12-20 | 2004-05-11 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
USD490827S1 (en) * | 2002-12-20 | 2004-06-01 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
USD490096S1 (en) * | 2002-12-20 | 2004-05-18 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
USD490093S1 (en) * | 2002-12-20 | 2004-05-18 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
USD490094S1 (en) * | 2002-12-20 | 2004-05-18 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
KR20040070008A (ko) * | 2003-01-29 | 2004-08-06 | 쿄세라 코포레이션 | 정전척 |
US7430104B2 (en) * | 2003-03-11 | 2008-09-30 | Appiled Materials, Inc. | Electrostatic chuck for wafer metrology and inspection equipment |
US7697260B2 (en) * | 2004-03-31 | 2010-04-13 | Applied Materials, Inc. | Detachable electrostatic chuck |
USD553104S1 (en) * | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
WO2006001425A1 (ja) * | 2004-06-28 | 2006-01-05 | Kyocera Corporation | 静電チャック |
US8525418B2 (en) * | 2005-03-31 | 2013-09-03 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
USD552565S1 (en) * | 2005-09-08 | 2007-10-09 | Tokyo Ohka Kogyo Co., Ltd. | Supporting plate |
USD548705S1 (en) * | 2005-09-29 | 2007-08-14 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
USD548200S1 (en) * | 2005-09-29 | 2007-08-07 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
USD546784S1 (en) * | 2005-09-29 | 2007-07-17 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
JP2007173596A (ja) * | 2005-12-22 | 2007-07-05 | Ngk Insulators Ltd | 静電チャック |
USD587222S1 (en) * | 2006-08-01 | 2009-02-24 | Tokyo Electron Limited | Attracting plate of an electrostatic chuck for semiconductor manufacturing |
US7619870B2 (en) * | 2006-08-10 | 2009-11-17 | Tokyo Electron Limited | Electrostatic chuck |
US8690135B2 (en) * | 2006-12-18 | 2014-04-08 | Camtek Ltd. | Chuck and a method for supporting an object |
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USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
TWD135511S1 (zh) * | 2008-10-03 | 2010-06-21 | 日本碍子股份有限公司 | 靜電夾頭 |
EP2764408B1 (en) * | 2011-10-06 | 2019-08-21 | ASML Netherlands B.V. | Chuck, lithography apparatus and method of using a chuck |
USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD724553S1 (en) * | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD723077S1 (en) * | 2013-12-03 | 2015-02-24 | Applied Materials, Inc. | Chuck carrier film |
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2021
- 2021-09-14 TW TW110304948F patent/TWD223375S/zh unknown
- 2021-09-17 JP JP2021502987F patent/JP1723603S/ja active Active
- 2021-09-17 US US35/355,138 patent/USD984972S1/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD206653S (zh) | 2019-07-18 | 2020-08-21 | 日商國際電氣股份有限公司 | 基板處理裝置用吸頂式加熱器的保持板 |
Also Published As
Publication number | Publication date |
---|---|
USD984972S1 (en) | 2023-05-02 |
JP1723603S (ja) | 2022-08-31 |
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