TW595274B - Circuit device - Google Patents

Circuit device Download PDF

Info

Publication number
TW595274B
TW595274B TW092122459A TW92122459A TW595274B TW 595274 B TW595274 B TW 595274B TW 092122459 A TW092122459 A TW 092122459A TW 92122459 A TW92122459 A TW 92122459A TW 595274 B TW595274 B TW 595274B
Authority
TW
Taiwan
Prior art keywords
circuit
mentioned
conductive pattern
conductive
pattern
Prior art date
Application number
TW092122459A
Other languages
English (en)
Chinese (zh)
Other versions
TW200410604A (en
Inventor
Eiju Maehara
Hiroyuki Tamura
Atsushi Kato
Atsushi Nakano
Original Assignee
Sanyo Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co filed Critical Sanyo Electric Co
Publication of TW200410604A publication Critical patent/TW200410604A/zh
Application granted granted Critical
Publication of TW595274B publication Critical patent/TW595274B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW092122459A 2002-12-03 2003-08-15 Circuit device TW595274B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002350774A JP2004186362A (ja) 2002-12-03 2002-12-03 回路装置

Publications (2)

Publication Number Publication Date
TW200410604A TW200410604A (en) 2004-06-16
TW595274B true TW595274B (en) 2004-06-21

Family

ID=32752873

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092122459A TW595274B (en) 2002-12-03 2003-08-15 Circuit device

Country Status (4)

Country Link
JP (1) JP2004186362A (ko)
KR (1) KR100715409B1 (ko)
CN (1) CN1298203C (ko)
TW (1) TW595274B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173489A (ja) * 2004-12-17 2006-06-29 Tokai Rika Co Ltd 電子部品実装構造
JP2008053319A (ja) * 2006-08-22 2008-03-06 Nec Electronics Corp 半導体装置
JP4958526B2 (ja) * 2006-11-30 2012-06-20 三洋電機株式会社 回路装置および回路モジュール
JP4948160B2 (ja) * 2006-12-29 2012-06-06 三洋電機株式会社 回路モジュール
JP4975655B2 (ja) * 2007-02-01 2012-07-11 日本特殊陶業株式会社 配線基板、半導体パッケージ
WO2011034137A1 (ja) * 2009-09-16 2011-03-24 株式会社村田製作所 電子部品内蔵モジュール
TWI795644B (zh) * 2020-06-02 2023-03-11 大陸商上海兆芯集成電路有限公司 電子總成

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970001891B1 (ko) * 1991-02-08 1997-02-18 가부시키가이샤 도시바 반도체장치와 반도체장치의 제조방법
DE4329083A1 (de) * 1993-08-30 1995-03-02 Telefunken Microelectron Baugruppe zur Aufnahme elektronischer Bauelemente
JP3866777B2 (ja) * 1994-08-29 2007-01-10 富士通株式会社 半導体装置及びその製造方法
JP2001077232A (ja) * 1999-09-06 2001-03-23 Mitsubishi Electric Corp 半導体装置およびその製造方法
EP1143509A3 (en) * 2000-03-08 2004-04-07 Sanyo Electric Co., Ltd. Method of manufacturing the circuit device and circuit device
CN1265451C (zh) * 2000-09-06 2006-07-19 三洋电机株式会社 半导体装置及其制造方法
JP3945968B2 (ja) * 2000-09-06 2007-07-18 三洋電機株式会社 半導体装置およびその製造方法
TW511422B (en) * 2000-10-02 2002-11-21 Sanyo Electric Co Method for manufacturing circuit device

Also Published As

Publication number Publication date
TW200410604A (en) 2004-06-16
CN1298203C (zh) 2007-01-31
JP2004186362A (ja) 2004-07-02
KR20040048818A (ko) 2004-06-10
CN1505459A (zh) 2004-06-16
KR100715409B1 (ko) 2007-05-07

Similar Documents

Publication Publication Date Title
TWI385778B (zh) 具有堆疊分立電感器結構的半導體功率裝置
CN103370785B (zh) 具有中心触点的增强堆叠微电子组件
TW478137B (en) Semiconductor device
US6611434B1 (en) Stacked multi-chip package structure with on-chip integration of passive component
CN102790042B (zh) 半导体芯片堆叠构造
TW396473B (en) Ball grid array package
JPH10242210A (ja) 集積回路装置の実装構造およびその製造方法
US10582617B2 (en) Method of fabricating a circuit module
TW200807661A (en) Circuit board structure having passive component and stack structure thereof
TW200532823A (en) Circuit device
TW595274B (en) Circuit device
TW200531246A (en) Semiconductor package
TW501254B (en) Integrated circuits packaging system and method
TWI362741B (en) Stacked semiconductor package in which semiconductor package are connected using a connector
JP2765571B2 (ja) マルチチップモジュール
US20070108257A1 (en) Padless substrate for surface mounted components
CN107482002A (zh) 具有层叠封装结构的半导体组件及包括该组件的电子设备
JPH0362566A (ja) デカップリングコンデンサを備えた集積回路パッケージ
JP4237542B2 (ja) 半導体装置
TWI253156B (en) Providing in package power supplies for integrated circuits
JPH11126952A (ja) 混成集積回路装置およびその製造方法
TW200839994A (en) Packing structure and stacked structure using thereof
JPH0258356A (ja) 電子部品塔載装置
JP2865102B2 (ja) マルチチップモジュール
JP3053013B2 (ja) 半導体集積回路装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees