TW588483B - Sharpened, oriented contact tip structures - Google Patents
Sharpened, oriented contact tip structures Download PDFInfo
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- TW588483B TW588483B TW088119533A TW88119533A TW588483B TW 588483 B TW588483 B TW 588483B TW 088119533 A TW088119533 A TW 088119533A TW 88119533 A TW88119533 A TW 88119533A TW 588483 B TW588483 B TW 588483B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/26—Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Description
588483 A7 B7____— 五、發明說明(5 ) 安裝在電子組件上之懸垂尖端結構之側面剖面圖。 圖6 A爲圖解說明本發明之具有金字塔形邊之尖端結 構。 圖6 B爲圖解說明本發明具有鑽石形邊緣之尖端結構 〇 圖7 A爲本發明具有二邊緣之尖端結構之頂視圖。 圖7 B爲本發明具有二葉片由橋路連接之尖端結構之 剖面圖。 圖7 C爲本發明具有二葉片成並列位置之尖端結構之 剖面圖。 圖8 A爲圖解說明本發明具有主葉片及後葉片之尖娜 結構之剖面圖。 圖8 B爲圖8 A之尖端結構之剖面圖。 圖9 A爲本發明尖端結構之剖面圖,及實際上平行之 葉片係附著在眼鏡蛇型探針上。 圖9 B爲眼鏡蛇型探針之剖面圖’其末端有一平订方 向之葉片。 圖1 0爲本發明具有直立葉片之尖端結構之剖面圖。 主要元件對照表 10 尖_結構 12 內聯元件 14 葉片. 2 0 尖_結構 _____一— -------"""""一 本紙張瓦度適用中國國家標準(CNS)A4規格(210 x 297公爱) -8 - (請先閱讀背面之注意事項再填寫本頁)
訂---------線I 經濟部智慧財產局員工消費合作社印製 588483 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(1(3) 尖端結構,其上表面有削尖之葉片,俾葉之長度在尖端結 構跨測試下電子組件之端點偏轉時,其水平移動方向與長 度成平行(在平行之正負1 5度)。利用本發明,在電子 元件間可建立一可靠之電接點。一但尖端結構接觸電子元 件之端點,內聯元件迫使尖端元件跨端點之表面偏轉,俾 尖v而結構之茱片芽入_點表面上之非導電層。電子組件可 爲積體電路,內聯板,半導體晶圓或印刷電路板。 圖2 A爲本發明之側面圖,顯示一彈簧接點元件2 4 耦合至基體2 6之一端,及尖端結構2 0耦合至其相反端 。圖2 B爲本發明尖端結構2 0之圖解說明,其具有一葉 片2 2在尖端結構2 0之上表面。在本發明之此一實施例 中,葉片2 2包括一接點元件,當展開時其表面形成空間 中之一條線。當尖端結構2 0與電子組件(未示出)之端 點接觸時,及加外力時,尖端結構2 0將跨端點表面偏轉 。當尖端結構2 0跨端點偏轉時,尖端結構2 0之葉片 2 2將穿入端點表面上之非導電層。圖2 C爲本發明之側 視圖。圖2 C之虛線顯示在跨端點偏轉後之內聯元件2 4 與尖端結構2 2。△ X代表尖端結構2 0之橫向(水平) 偏轉量。 葉片2 2定向在尖端結構2 0之上表面,俾葉之長度 (L )在尖端結構2 0跨端點表面偏轉時(見圖2 C ), 與尖端結構2 0之水平移動(ΔΧ)之方向平行。葉片 2 2之方向與尖端結構之水平運動方向平行,可使葉片 2 2切入(穿入)端點表面上之非導電層。 本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) -13- I ^----- ----------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 588483 A7 B7 五、發明說明(11) (請先閱讀背面之注意事項再填寫本頁) 圖2 D說、明本發明另一實施例。其中之葉片2 6在彈 簧接點元件2 8本身之末端形成,而非獨立之尖端結構。 以此方式,實際上平行定向之葉片2 6即可形成而不需轉 移之尖端結構(如圖2 A之尖端結構2 0 )。葉片2 6可 在彈簧接點2 8之末端形成,其方法包括但不限於電渡或 機械程序(如利用沖壓,陷型模,電磨光或靜電放電)。 尖端結構2 0 (或彈簧元件2 8末端形成之葉片2 6 經濟部智慧財產局員工消費合作社印製 )之上表面上葉片2 2之方向實質上與尖端結構2 0之水 平移動之方向平行(今後稱平行方向),可提供較以往技 術尖端結構更多之優點。首先,葉片2 2沿長度(L )之 削尖邊緣之平行方向,可使葉片2 2穿入端點上之非導電 層,及建立測試下電組件之端點之良好電連接。對照之下 ,以往技術尖端結構之實際上垂直方向(即,當尖端結構 之上表面上之葉片長度之方向實質上與尖端結構跨測試下 端點之表面偏轉時水平移動之方向成垂直,如圖1 A及 1 B之葉片1 4 ),提供跨非導電層之摩擦運動。以往技 術葉片之摩擦跨過端點表面如推土機將雜物層刮掉。此種 垂直方向葉片之刮擦動作可能傷害端點之表面,通常造成 葉片之磨損及破裂,因而導致葉片之壽命降低。對比之下 ,本發明之平行方向葉片可對上述問題先發制人,即跟隨 尖端結構水平運動之方向及穿入端點上之非導電層。此外 ,在葉片2 2之表面上可能有極少之雜物堆積’其可導致 尖端結構與端點間較低之接觸電阻,及產生在測試期間更 準確之電壓位準。 -14 - 本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 588483 經濟部智慧財產局員工消費合作社印製 B7_____ 五、發明說明(15 ) ,因爲其內聯元件之全長及其相關之電感,及以高頻率( 速度)作業時之不良效應。同理,核心元件不需圓截面, 寧可爲一平片(彩帶)而具有一矩形截面及自薄片伸展。 其他非圓型截面,如C型,I型,L及T型截面亦可用供 內聯元件用。 外殼之材料或至少多層殼之一層(以下將說明)之材 料較核心之材料具有更高之屈服強度。因此,在建立最後 之內聯結構之機械特性(彈性)上,外殼較核心爲強。外 殼與核心之屈服強度比値爲最好至少爲2 : 1 ,可高至 1〇:1 。非常明顯,外殼或至少多層殻之外層應爲導電 ,特別在外殼蓋住核心之末端時爲甚。 核心(3 1 2 ,3 2 2 ,3 3 2 )適當材料包括但不 限於:金,銘,銅及其合金。此等材料可與少量之其他金 屬如鈹,鎘,矽,鎂等成爲合金以獲得理想之物理性質。 亦可用銀,鈀’白金;金屬或合金如元素之白金組。焊料 可爲給’錫’銦’鉍,錫,銻及其合金亦可用。任何材料 之線(如金)適於接合(利用溫度,壓力及/或超音能接 合)時均可使用於本發明。如任何材料適於覆蓋(電鍍) ,包括非金屬材料亦可供核心之用。 適於供外殼(3 14 ’ 324,334)之材料包括 但不限於:鎳及其合金;鈷及鐵及其合金;金(硬金)及 銀,二者均有良好電流載負及優異之接觸電阻率特性;白 金組元素;貴重金屬;半貴重金屬及其合金;鎢及鉬。如 需焊劑之表面磨光時,錫,鉛,鉍及銦亦可使用。施加此 本紙張又度適用中國國家標準(CNS)A4規格(210 X 297公釐) I ^----- I---------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) -18- 經濟部智慧財產局員工消費合作社印制农 588483 A7 B7 五、發明說明(16 ) 等塗層材料於核心材料上之技術在應用與應用上不伺。電 鍍及非電鍍爲較佳之技術。 另一種可用於本發明之電內聯元件爲彈性內聯元件, 該元件由石版印刷術形成。本發明之定向葉片可在石版印 刷形成之彈性內聯元件之接觸端上行成。本發明之一例中 ’ 一定向葉片可形成在一犠牲基帶上,之後轉移至石版印 刷形成之彈性內聯元件之一接觸端。 本發明之內聯元件(圖2A— 2D中之元件24)可 製造在或安裝在任何適當基體之適當表面上,包括犠牲基 體,於是自該處移除或安裝在電子組件之端點上。 將內聯元件耦合至尖端結構 圖4A說明本發明之通用實施例4 〇 〇 ,其中多個( 顯示4個)接觸尖端結4 0 2係預鑄在一支座(犠牲)基 體4 0 4上,以稍後說明之方式爲之。對應之多個內聯元 件4 0 6顯示在準備中,將彼等之自由端4 〇 6 a與尖端 結構4 0 2連接(反之亦然)。長形內聯元件4 0 6之自 由端4 0 6 a距長形內聯元件之相反端較遠,該端將自一 電子組件(未示出)如半導體裝置,及多層基體及半導體 包封之表面延伸。 圖4 B說明一側面圖’以銅鋅焊接接觸尖端結構 4 0 2於長形內聯元件4 0 6之次一步驟。圖中說明銅鋅 焊接輪廓4 0 8。接點尖端結構4 〇 2仍然以彼此空間關 係位於犠牲基體4 0 4上。圖4 B亦說明接點尖端結構 本紙張&度適用中國國家標準(CNS)A4規格(210 X 297公爱) 丨^----- ----------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) -19- 588483 經濟部智慧財產局員工消費合作社印製 A7 ______B7____ 五、發明說明(17 ) 4 0 2以導電黏劑(銀塡充環氧)連接在長形內聯元件上 。連接接觸尖端結構4 0 6至長形內聯元件4 0 6之另一 方法,爲利用電鍍金屬材料如鎳將接觸尖端結構4 0 2及 長形內聯元件4 0 6之末端附近加以過度塗層。 圖4 C說明一隨後步驟之側視圖,在連接接觸點結構 4〇2於長形內聯元件4 0 6之後’支持(犠牲)基體即 被移除。合成之 ''有尖端〃內聯元件4 0 6 ('、有尖端〃 內聯元件爲有另一接點尖端結構連接至該處之內聯元件) 顯不有一*接觸尖纟而結構4 0 2銅鉢焊接(4 0 8 )其上’ 其方式如圖4 B所說明。 在具體實例中說明自由挺立在犠牲基體上之內聯元件 之形成(由其本身或挺立在預鑄結構上),討論一直放在 將內聯兀件之一端點(或在混合內聯兀件情況下,接合一 長形核心)接合在犠牲基體上。除接合以外之技術(儀器 )亦可使用,亦在本發明範圍內。 尖端結構 圖5 A - 5 Η說明一技術5 0 0用以製造具有二平行 定向葉片之尖端結構,及將其安裝在可作爲電子元件之端 點之內聯元件上’圖5 I - 5 Κ說明利用該尖端結構之另 一技術5 5 0。此等技術特別適合安裝自由站立之內聯元 件在如半導體裝置,探針卡總成之空間變壓器基體等電子 組件上。 圖5 Α說明犠牲基體5 0 2 ,如單晶矽晶圓,在其表 本紙張尺度適用中國國家ί票準(CNS)A4規格(210 X 297公釐) ~ -----I---------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 588483 Α7 Β7 五、發明說明(18) 面上蝕刻許多槽溝5 0 4。如光阻材料之圖案掩蔽層(未 示出)首先圖案在基體5 0 2上,以限定槽溝5 0 4之長 度與寬度。之後,槽溝5 0 4在基體5 0 4上形成。在較 佳實施例中,在1 1 0及1 1 1晶體取向實施選擇性之氫 氧化鉀(K〇Η )貪虫刻。 Κ〇Η選擇性蝕刻以外之方法亦可使用,以構成作本 發明之葉片之槽溝5 0 4。槽溝亦可由反應離子蝕刻( R I Ε )。此外,非石版印刷法亦可用,包括但不限於磨 光(電磨光及機械磨光)沖壓,或磨擦尖端結構。直壁及 槽溝結構之組合亦可由結合不同技術而產生。此種結合在 圖1 0中建立挺立之結構甚爲理想。如上述討論之尖端結 構一樣,尖端結構9 8 0含一尖端基座9 8 2,及尖端葉 片9 8 4。結構9 8 0亦包括直壁部份9 8 6 ,其提供尖 端結構9 8 0之偏離距D。 較佳實施例包含在上表面具有葉片之尖端結構,其中 之葉片沿其長度有一削尖之邊緣,及一三角形剖面。槽溝 5 0 4僅爲說明尖端結構之任何表面晶體組織 ''模板〃, 其將在犠牲基體5 0 2上形成。槽溝5 0 4之布局(空間 及安排)可自半導體模(未示出)之接合墊布局演繹(複 製)而得,其最後目的爲被自由挺立之內聯元件予以接觸 ,尖端結構5 0 4即連接在該元件上。例如,槽溝5 0 4 可安排成一行,單一列於犠牲基體之中心。許多記憶體晶 片均以結合墊之中央行製造。 圖5 Β說明一硬 ''場〃層5 0 6澱積在犠牲基體 本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) I ^----- 1---------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) -21 - 經濟部智慧財產局員工消費合作社印製 588483 A7 --_ B7 五、發明說明(19) 5 ◦ 2之表面,包括在溝槽5 〇 4中。場層5 〇 6可作爲 釋放層。一可能之釋放層含具有約5 〇 〇 〇 A厚度之鋁構 成。如場層之材料不能電鍍時,另〜層5 〇 8可選擇性澱 積在場層5 0 6上。層5 0 8典型由具有厚度約5 〇〇〇 A之銅構成。(如層5 0 6無法去除,可用選擇性澱積施 加’(即經由一掩敝罩予以圖案,以避免移除)。接觸構 件在槽溝內製成後’犠牲基體5 0 2可用任何適當程序去 除,如選擇性化學刻法。 注意’除化學蝕刻劑之外適當之冶金術與熱共用以釋 放犠牲基體5 0 2。例如,在本發羽一實施例中,層 5 0 6包括非濕金屬如鎢(或鈦鎢)以潑濺方法澱積在基 體5 0 2上。其次,薄層5 0 8含非濕材料如可電鍍鉛( 或銦)澱積在鎢層5 0 6上。在接點尖端結構在槽溝中製 成後,利用再流技術(利用熱)將接觸尖端結構安裝在內 聯元件上。在再流期間鉛(材料5 0 8 )將被熔化並成球 ,因爲鎢(材料5 0 6 )無法與鉛共濕。因此造成接觸尖 端結構自犠牲基體5 0 2釋放。非濕材料(鎢)之第二層 可加在層5 0 8上,並變成合成之尖端結構之一部份,除 非加以除去(蝕刻法)。此外,當加熱時成球之另一材料 層(即鉛,銦)可加在非濕金屬(鎢)之第二層。在合成 接觸尖端結構表面上剩餘之鉛很容易除去,或留在原處。 此外,一種 ''障礙〃材料層可澱積在成球之材料之第二層 與製成之接觸尖端結構之間。 '' 障礙〃可爲鎢,氮化矽’ 鉬等。 本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) -22- I ^----- ----------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 588483 A7 B7 五、發明說明(22) 不限於混合內聯元件,及特別包括探針薄膜之接觸塊(此 情況下電子組件5 3 4爲一探針薄膜)及傳統探針卡之鎢 針。內聯元件可經由石版印刷’或接合及電鍍作業予以形 成,如美國專利號碼5 ,4 7 6 ,2 1 1所揭示者。升起 之內聯元件,雖然爲彈性並提供似彈簧之動作,但亦可爲 剛性柱。尖端結構附著之彈性元件形狀,在探測時,可影 響磨擦特性(即,尖端結構跨測試下之端點接觸之表面之 水平移動)。機械控制運動之外力亦可影響磨擦特性。因 此,內聯元件可設計爲具有最佳之理想接觸行爲。 圖5 I — 5 K說明利用尖端結構之另一技術5 5〇, 其中之尖端結構備有安裝在電子組件端點前之本身之升起 接點(內聯元件)。此種技術自犠牲基體5 0 2之表面中 形成槽溝5 0 4之相同步驟開始,施加一場層5 0 6 ,施 加一選擇性銅鋅焊層5 0 8,及施加一掩蔽材料5 1〇, 材料上之開口限定合成之尖端結構之位置及形狀。比較以 上之5 A — 5 C。 在下一步驟中,如圖5 I - 5 J說明(圖5 I爲側面 圖,圖5J爲正面圖),一自由挺立內聯元件552安裝 在尖端結構5 3 0之背部。於是,利用掩蔽層5 1 0 ,硬 (彈性)材料層5 5 4澱積在尖端結構上(及另一層可銅 鋅焊之層5 1 6 )。掩蔽層5 1 0被除去,尖端結構 5 7 0可用焊接或銅鋅焊將自由挺立5 5 2之尖端焊在端 點582上,如焊接圓角586所示。注意,圖5I— 5 K所示之另一安裝技術,耦合步驟(典型爲焊接或銅鋅 本紙張&度適用中國國家標準(CNS)A4規格(210 X 297公釐) 丨^-----1---------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) -25- 588483 經濟部智慧財產局員工消費合作社印制衣 Α7 Β7 五、發明說明(23 ) 焊)在耦合內聯元件至電子組件時發生,其中在圖5 A -5 Η說明之第一種安裝技術,耦合步驟將尖端結構連接至 內聯元件上。換言之,當對照二安裝技術時,焊接或銅鋅 焊之耦合步驟係在內聯元件之相反端執行。 在此等例中,說明內聯元件5 2 0及5 7 0爲具有彈 簧形狀之混合內聯元件,但應瞭解本發明並不受限制。二 情況下(5 0 0 ,5 5 0 ),結果爲,電子組件(5 3 4 ,5 8 4 )備有許多直立之內聯元件(5 3 0 ,5 5 2 ) 自其端點伸出,直立內聯元件之尖端(自由端)備有具表 面組織之尖端結構,該表面組織係在尖端結構預鑄在犠牲 基體5 0 2程序期間所限定。自上述之說明可知’僅內聯 元件(53 0 ,552 (即由554覆蓋之552552 ))不需爲彈性。彈性可由懸垂尖端結構(5 2〇’ 5 7 0 )之能力提供而偏轉,以響應與另一電子組件(未 示出)之壓力連接,因爲尖端結構5 0 4係沿懸垂樑配置 。最好,直立之內聯元件& 2 〇較懸垂樑硬許多’俾自壓 力連接之接觸力可予良好限定及控制。 在任何懸垂樑裝置中,最好,懸垂樑之一端爲''固定 ",另一端爲、、可動〃。懸垂樑可作爲尖端結構之一足’ 或作爲預鑄之尖端結構之一足’並可安裝在各別預鑄之樑 上。以此方式,彎曲動量可容易計算出。因此非常明顯’ 長型內聯元件(5 3 0 ,5 5 2 ) ’最好爲剛性。(在內 聯元件(5 3 0 )爲薄膜探針之接觸塊時’彈性由薄膜( 5 3 4 )本身提供)。但長型內聯元件以混合內聯元件實 丨^—----------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -26- 588483 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(24 ) 施亦屬合理,如以上討論之內聯元件,其將對尖端結構全 面偏轉有所貢獻,以響應對尖端結構之壓力連接。 利用本發明之其他實施例 上述之尖端部份之剖面爲三角形,但其他剖面亦可使 用。例如,截角之金字塔形可由上述之相似方式製造。注 意,在尖端結構長度方向具有削尖邊緣葉片容易隨使用磨 損而變成平頂。 ''平頂"導致與截角金字塔形極爲相似之 剖面。具有截角金字塔剖面之尖端結構仍可維持上述之平 行定向葉片之優點。 本發明之平行定向葉片之不同實施例,可有不同前及 後邊緣。例如,有時葉片可能有直線邊緣(即與尖端結構 成垂直之邊緣),如圖5D之葉片522。圖6A顯示另 一具有金字塔前及後邊緣6 0 2之另一葉片6 0 0。在葉 片6 0 0上,前及後邊緣6 0 2自尖端結構6 0 4之足部 互爲大於9 0度角。具有鑽石形之第二個葉片6 1 0見圖 6 B之說明。葉片6 1 0係在晶格之主軸成4 5度角,以 K〇Η蝕刻形成,於是限定具有六側(或具有六角形)之 光致抗蝕劑蝕刻窗。因而導致一具有在頂表面上鑽石形狀 葉片6 1 0之尖端結構。 有許多其他實施例,可自本發明之平行定向葉片提供 之諸多優點獲益。例如,一個以上之葉片7 0 0可在其尖 端結構上構件,如圖7 Α之尖端結構7 0 2之頂視圖所示 。此一實施例在探測控制之崩潰晶片連接(C 4 )焊接球 本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 丨 I------------------訂---------線# (請先閱讀背面之注意事項再填寫本頁) -27- 588483 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(25 ) 或其他球形結構.,非常有用。 -Φ. 具有二個以上葉片構建在單一足上之本發明實施例之 另一變化,顯示於圖7 B中。圖7 B爲尖端結構7 1 4之 正面圖,其具有由橋體7 1 2連接之二葉片7 1 0及具有 一直·^部份7 1 6。此外,在尖端結構上形成之多個葉片 ’葉片間預定之節距對具有一良好節距球形探針非常有用 〇 圖7 C爲本發明之第三個實施例之側視圖,其在一足 上有二或以上之葉片。在尖端結構7 2 4上,二葉片 720成並列爲置,而分享一供同槽溝722 ,其具有一 高度Η。並列葉片7 2 0在接觸表面非常接近之應用節距 時’最爲有益。利用本發明另一實施例爲多高度葉片,如 圖8Α及8 Β所示之葉片8 0 0。葉片8 0 0有一主要葉 片8 0 2趨向尖端結構8 0 6之前邊緣,及一後緣葉片 8 0 4趨向尖端結構8 0 6之背部。葉片8 0 〇可利用掩 蔽程序構成,其中之掩蔽圍繞較短之後緣葉片8 〇 4 ,因 此可提供一較小之洞穴,俾由Κ〇Η蝕刻之槽溝很淺,圍 繞較高之前葉片之掩蔽可提供一較大之洞穴,俾由κ〇Η 貪虫刻之槽溝蝕刻較深及葉片8 0 6較高。 本發明可與傳統眼鏡蛇型探針共用,圖9 Α顯示其部 份圖。眼鏡蛇型探針利用預彎之接觸線9 0 6成直放置, 並由二導板9 0 8及9 1 0維持。穿孔導板9 0 8及 9 1 0將接觸線9 0 6固定及導引。眼鏡蛇型探針容易受 到限制,即接觸幾何形狀由使用之圓導線決定,接觸冶金 本紙張&度適用中國國家標準(CNS)A4規格(210 X 297公釐) I.—---------------訂--------- (請先閱讀背面之注意事項再填寫本頁) -28- 經濟部智慧財產局員工消費合作社印製 588483 A7 B7 五、發明說明(26) 爲彈簧本身使用本發明之轉移尖端結構可產生一可控制之 幾何形狀,去耦合接觸及彈簧冶金。·因此,將尖端結構 9 0 0附加在接觸導線9 0 6之末端將甚爲有益。導板 9〇8及9 1 0將導引接觸導線9 0 6 ,及具有本發明之 平行定向葉片9 0 2之尖端結構9 0 0 ,跨過測試下電子 組件之端點。以此方式,本發明之不同實施例可與眼鏡蛇 型探針共用,以担供更可靠之眼鏡蛇型探針9 0 6及測試 下電子組件端點間之電連接。 或者,圖9 B說明本發明另一實施例,及具有位於接 觸導線9 0 6末端之平行定向葉片9 1 2。以相同方式, 如圖2 D所說明者,葉片9 1 2可用電鍍或機械程序在接 觸導線9 0 6之末端形成。因此,接觸導線9 0 6有一葉 片尖或 ''鑿子頭〃 9 1 2而不用轉移尖端結構。注意,上 述之各實施例及以下參考圖6A,6B,7A,7B, 7 C,8 A及8 B均可以修改,俾與在不用轉移尖端結構 之內聯元件末端形成之葉片共用(如葉片9 1 2 )。 雖然本發明之較佳實施例具有尖端結構之削尖葉片, 其方向可使葉片之長度,在尖端結構跨測試下電子組件之 端點表面偏轉時,與尖端結構之水平方向平行,另一實施 例之葉片之方向可使葉片之長度以平行稍偏之角度配置。 例如,一實施例可含一葉片,其定向之角度使葉片之長度 與尖端結構跨測試下電子組件端點表面偏轉時,與其水平 運平行之軸成4 5度角。葉片想之角度應與平行向軸成正 負3 0度。因此本實施例亦可提供修改之刮過行動以橫跨 本紙張&度適用中國國家標準(CNS)A4規格(210 X 297公釐) -29- ΙΓΙΤΙ-------------訂---------線· (請先閱讀背面之注意事項再填寫本頁) 588483 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(27) 測試下之端點表面,同時可使沿葉片8 〇 〇積聚之量最低 〇 探針裝備通常包括一校正性。此種校正裝備可包含利 用光束偵測尖端結構外反射之光偵感器。每一上述裝備均 可進一步改進以包括具有較佳反射之葉片設計。更多反射 葉片及/或尖端結構可提供一方法供分類及校正目的之自 動辨認(即,在晶圓探測器中自動實施之探測作業)。葉 片之反射能力與葉片尖端之平坦上表面有關(即,葉片具 有一截角金字塔形剖面)。反射之量由控制最初槽溝蝕刻 之時間長度加以控制(即用來形成葉片之槽溝),俾槽溝 在其尖端並非一削尖之點。第二種方法以控制每一葉片之 反射量’涉及在槽溝底部在澱積鋁與銅層之前,插入再流 玻璃。槽溝尖端之玻璃可軟化葉片之邊緣(尖端),及導 致具有與截角金字塔形剖面相似之葉片。或者,葉片尖端 可使其具有削尖之邊緣,如上所述,於是將削尖之邊緣用 加以硏磨俾葉片有一可反射之平頂邊緣。此等建立反射葉 片之方法可容易倂入製造程序中。 因此,揭示一裝置及一方法可提供改進之內聯元件及 尖端結構用以實施電子組件間之壓力連接,削尖之葉片定 向於尖端結構之上表面,俾在尖端結構跨測試下電子組件 端點偏轉時,葉片之長度實質上與尖端結構水平移動之方 向平行,此一方法較以往技術有更多優點。實質上平行定 向之葉片可使本發明之尖端結構穿入端點表面上之非導電 層,及實施一可靠之電接觸,而不損壞端點之表面及在葉 本纸張又度適用中國國家標準(CNS)A4規格(210 X 297公釐) -30- •丨 r!T —-------------訂---------^0 (請先閱讀背面之注意事項再填寫本頁) 588483 A7 B7 五、發明說明(28) 片表面上無粘狀堆積。此外,本發明葉片之平行方向可使 尖端結構與端點間之接觸最大,故當尖端結構跨端點偏轉 時,即使端點具有一較小之接觸面積,亦不致失去電接觸 I-----續--------訂---------華 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本纸張义度適用中國國家標準(CNS)A4規格(210 X 297公釐) -31 -
Claims (1)
- 588483 C8 ____ D8 六'申請專利範圍 附件二A: 第881 19533號專利申請案 中文申請專利範圍修正本 (請先閱讀背面之注意事項再填寫本頁) 民國90年10月修正 1 · 一種電裝置,包含: 在一內聯元件之一末端之至少一葉片,該葉片具有固 定長度並在內聯元件上定向,俾當內聯元件被置於與電端 點之擦拭接觸時該長度實質上與該葉片對一電端點之水平 擦拭移動成平行。 2 ·如申請專利範圍第1項之電裝置,其中該葉片之 水平運動在該葉片與電端點成電接觸時發生。 3 .如申請專利範圍第2項之電裝置,其中該葉片有 一截角金字塔形剖面結構。 4 ·如申請專利範圍第2項之電裝置,其中該葉片有 一沿該葉片長度之削尖邊緣。 經濟部智慧財產局員工消費合作社印製 5 .如申請專利範圍第4項之電裝置,其中該葉片有 一剖面結構,其前緣在該葉片之長度之第一末端,及在該 葉片之長度之第二末端之背緣。 6 ·如申請專利範圍第5項之電裝置,其中該前緣及 背緣爲一直線。 . 7 .如申請專利範圍第5項之電裝置,其中該前緣及 背緣爲金字塔形。 8 .如申請專利範圍第5項之電裝置,其中該前緣及 背緣具有二側面,俾該葉片有一六角形狀。 本紙張尺度適用中國國家梂準(CNS ) A4規格(210X297公釐) 經濟部智慧財產局員工消費合作社印製 588483 A8 B8 C8 D8 ___ 六、申請專利範圍 9 . 一種尖端結構,包含一足部具有一上及下表面; 及 在該足部之上表面上至少一葉片,該葉片具有固定長 度及在該足部上定向俾該長度與該足部水平擦拭運動成平 行走向。 1〇·如申請專利範圍第9項之尖端結構’其中該足 部之水平運動在該尖端結構與一電端點成電接觸時發生。 1 1 ·如申請專利範圍第9項之尖端結構’尙包含一 幸禹合至該足部之下表面之彈性接觸元件。 1 2 .如申請專利範圍第9項之尖端結構,其中該葉 片沿該葉片之長度具有一削尖之邊緣。 1 3 .如申請專利範圍第1 2項之尖端結構,其中該 葉片在該葉片之前端有一主要邊緣,及在該葉片之背端有 一後邊緣。 1 4 .如申請專利範圍第1 2項之尖端結構,在該足 部之上表面具有第一及第二葉片。 1 5 .如申請專利範圍第1 4項之尖端結構,其中該 第一及第二葉片由一橋路連接。 1 6 .如申請專利範圍第1 4項之尖端結構,其中該 第一及第二葉片爲並列位置。 . 1 7 .如申請專利範圍第1 2項之尖端結構,其中該 葉片有一三角形剖面結構,其前緣在該葉片之長度之第一 端,一後緣在該葉片長度之第二端。 1 8 .如申請專利範圍第1 7項之尖端結構,其中該 本紙張尺度適用中國國家梂準(CNS ) A4規格(210 X 297公釐) 訂 (請先閲讀背面之注意事項再填寫本頁) -2· 經濟部智慧財產局員工消費合作社印製 588483 A8 B8 C8 ___ _D8 六、申請專利範圍 前緣及後緣爲直線。 1 9 ·如申請專利範圍第1 7項之尖端結構,其中該 前緣及後緣爲金字塔形。 2〇.如申請專利範圍第1 7項之尖端結構’其中該 前緣及後緣有二側面俾該葉片有一六角形狀。 2 1 · —種尖端結構,包含: 一足部具有上下表面; 在該足部之上表面至少一葉片,該葉片具有固定長度 ’並在該足部上定向,俾該長度與該足部水平擦拭運動平 行之軸成約正負4 5度角。 2 2 ·如申請專利範圍第2 1項之尖端結構,其中該 某片沿葉片之長度有一削尖之邊緣。 2 3 ·如申請專利範圍第2 2項之尖端結構,具有在 該足部之上表面之第一及第二葉片。 2 4 ·如申請專利範圍第2 3項之尖端結構,其中該 第一及第二葉片由一橋路連接。 2 5 ·如申請專利範圍第2 3項之尖端結構,其中該 第一及弟一某片爲並列位置。 2 6 ·如申請專利範圍第2 2項之尖端結構,其中該 葉片有一三角形剖面結構,其在葉片之長度之.第一端有一 前緣,在該葉片長度之第二端有一後緣。 2 7 ·如申請專利範圍第2 6項之尖端結構,其中該 前緣及後緣爲直線。 2 8 .如申請專利範圍第2 6項之尖端結構,其中該 本紙張尺度適用中國國家梂準(CNS ) A4規格(21〇χ297公釐) ------IT (請先閲讀背面之注意事項再填寫本頁) -3- 588483 A8 B8 C8 D8 申請專利範圍 前緣及後緣爲金字塔形。 2 9 ·如申請專利範圍第2 6項之尖端結構 則緣及後緣有二側面,俾該葉片有一六角形狀。 3 0 · —種電接觸結構包含: 其中該 多個內聯元件配置在彼此相關之位置; 多個尖端結構附著在各內聯元件上,每一尖端結構尙 包含: 在該內聯兀件之一接觸點上至少有一葉片,該葉片具 有固定長度並在各內聯元件上定向,俾當各該內聯元件偏 移過一電子元件之一端點而造成電接觸時該長度與各該內 聯元件之水平擦拭運動爲平行走向。 3 1 ·如申請專利範圍第3 0項之電接觸結構,其中 該葉片之水平運動在尖端結構與電表面成電接觸時發生。 3 2 .如申請專利範圍第3 1項之電接觸結構,其中 該某片沿茱片長度有一削尖邊緣。 3 3 ·如申請專利範圍第3 2項之電接觸結構,其中 該葉片有一三角形剖面結構,其在葉片長度之第一端有一 (請先閲讀背面之注意事項再填寫本頁) ► 、-口 r ii 經濟部智慧財產局員工消費合作社印製 緣 後 - 有 端二 第 之專線 度請直 長申爲 片如緣 葉 ·後 在 4 及 ,3 緣 緣前 前 該 第 圍 範 利 中 其 構 結 觸 接 電 之 項 第 圍 範 f 塔 專字 請金 申爲 如緣 •後 及 緣 前 該 5 形 第 圍 範 利面 專側 請二 申有 如緣 •後 6 及 3 緣 前 該 中 其 構 結 觸 接 8 之 項 中 其 構 結 觸 接 電 之 項 狀 形 角 六1 有 片 葉 該 本紙张尺度適用中國國家梂準(CNS ) A4规格(210X297公釐) -4- 588483 A8 B8 C8 D8 夂、申請專利範園 3 7 · —種方法用以製造一電接觸結構,包含下列步 驟: (請先閱讀背面之注意事項再填寫本頁) 在犠牲基體上形成一槽溝; 在該槽溝中澱積至少一導電材料之至少一層,以形成 一具有一固定長度,一上表面及下表面之葉片;及 耦合一內聯元件至該葉片之下表面,其中該葉片之方 向可使葉片之長度與葉片之水平擦拭運動成平行走向。 3 8 ·如申請專利範圍第3 7項之方法,尙包含自該 犠牲基體釋放該葉片之步驟。 3 9 ·如申請專利範圍第3 8項之方法,其中該自犠 牲基體釋放葉片之步驟尙包含,自犠牲基體釋放該葉片, 其程序係選自含熱及化學蝕刻之一組。 4 0 .如申請專利範圍第3 7項之方法,其中形成槽 溝之步驟尙含以氫氧化鉀選擇性蝕刻在基體中蝕刻一槽溝 0 4 1 .如申請專利範圍第4 0項之方法,其中該蝕刻 經濟部智慧財產局員工消资合作社印製 槽溝之步驟尙含以氫氧化鉀蝕刻在晶向1 1 1及0 0 1之 間在基體中蝕刻一槽溝。 4 2 ·如申請專利範圍第3 7項之方法,其中形成槽 溝之步驟尙含在基體中形成一槽溝,該槽溝有一三角形剖 面。 4 3 .如申請專利範圍第3 7項之方法,其中形成槽 溝之步驟尙含在基體中形成一槽溝’該槽溝有一截角金字 塔形剖面。 本紙張尺度適用中國國家梂準(CNS >A4規格(210x297公釐) 588483 A8 B8 C8 _____ D8 六、申請專利範圍 4 4 ·如申請專利範圍第3 7項之方法,其中該耦合 內聯元件至葉片下表面之步驟尙含焊接內聯元件至葉片之 下表面。 4 5 ·如申請專利範圍第3 7項之方法,其中f禹合內 聯元件至葉片下表面之步驟,尙含銅鋅焊該內聯元件至葉 片之下表面。 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消费合作社印製 本紙張尺度適用中國國家梂準(CNS ) A4規格(210X297公釐) -6-
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- 1999-11-10 AU AU19130/00A patent/AU1913000A/en not_active Abandoned
- 1999-11-10 EP EP05022474A patent/EP1641082A3/en not_active Withdrawn
- 1999-11-10 DE DE69927996T patent/DE69927996T2/de not_active Expired - Lifetime
- 1999-11-10 KR KR10-2001-7005825A patent/KR100370720B1/ko not_active IP Right Cessation
- 1999-11-10 WO PCT/US1999/026787 patent/WO2000028625A1/en active IP Right Grant
- 1999-11-10 JP JP2000581719A patent/JP3902729B2/ja not_active Expired - Fee Related
- 1999-11-10 CN CNB031249582A patent/CN100470946C/zh not_active Expired - Fee Related
- 1999-11-10 CN CN99813155A patent/CN1127781C/zh not_active Expired - Fee Related
-
2002
- 2002-06-17 US US10/174,455 patent/US6825422B2/en not_active Expired - Lifetime
-
2003
- 2003-10-22 JP JP2003361559A patent/JP4493317B2/ja not_active Expired - Fee Related
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2004
- 2004-03-31 US US10/815,400 patent/US20040177499A1/en not_active Abandoned
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2009
- 2009-12-14 JP JP2009283375A patent/JP2010073698A/ja active Pending
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2010
- 2010-08-06 US US12/852,337 patent/US9030222B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69927996D1 (de) | 2005-12-01 |
EP1641082A2 (en) | 2006-03-29 |
JP4493317B2 (ja) | 2010-06-30 |
KR20010090835A (ko) | 2001-10-19 |
JP2010073698A (ja) | 2010-04-02 |
EP1641082A3 (en) | 2008-12-31 |
US6825422B2 (en) | 2004-11-30 |
JP2004139992A (ja) | 2004-05-13 |
EP1129510B1 (en) | 2005-10-26 |
KR100370720B1 (ko) | 2003-02-05 |
AU1913000A (en) | 2000-05-29 |
CN100470946C (zh) | 2009-03-18 |
WO2000028625A1 (en) | 2000-05-18 |
US20100323551A1 (en) | 2010-12-23 |
US6441315B1 (en) | 2002-08-27 |
US20040177499A1 (en) | 2004-09-16 |
CN1497794A (zh) | 2004-05-19 |
CN1325553A (zh) | 2001-12-05 |
JP2002529903A (ja) | 2002-09-10 |
EP1129510A1 (en) | 2001-09-05 |
US9030222B2 (en) | 2015-05-12 |
DE69927996T2 (de) | 2006-07-27 |
US20030015347A1 (en) | 2003-01-23 |
CN1127781C (zh) | 2003-11-12 |
JP3902729B2 (ja) | 2007-04-11 |
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