DE69927996D1 - Scharfe, orientierte presskontaktspitze - Google Patents
Scharfe, orientierte presskontaktspitzeInfo
- Publication number
- DE69927996D1 DE69927996D1 DE69927996T DE69927996T DE69927996D1 DE 69927996 D1 DE69927996 D1 DE 69927996D1 DE 69927996 T DE69927996 T DE 69927996T DE 69927996 T DE69927996 T DE 69927996T DE 69927996 D1 DE69927996 D1 DE 69927996D1
- Authority
- DE
- Germany
- Prior art keywords
- sharp
- contact point
- press contact
- oriented press
- oriented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/26—Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US189761 | 1998-11-10 | ||
US09/189,761 US6441315B1 (en) | 1998-11-10 | 1998-11-10 | Contact structures with blades having a wiping motion |
PCT/US1999/026787 WO2000028625A1 (en) | 1998-11-10 | 1999-11-10 | Sharpened, oriented contact tip structures |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69927996D1 true DE69927996D1 (de) | 2005-12-01 |
DE69927996T2 DE69927996T2 (de) | 2006-07-27 |
Family
ID=22698665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69927996T Expired - Lifetime DE69927996T2 (de) | 1998-11-10 | 1999-11-10 | Scharfe, orientierte druckkontaktspitze |
Country Status (9)
Country | Link |
---|---|
US (4) | US6441315B1 (de) |
EP (2) | EP1129510B1 (de) |
JP (3) | JP3902729B2 (de) |
KR (1) | KR100370720B1 (de) |
CN (2) | CN100470946C (de) |
AU (1) | AU1913000A (de) |
DE (1) | DE69927996T2 (de) |
TW (1) | TW588483B (de) |
WO (1) | WO2000028625A1 (de) |
Families Citing this family (123)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020053734A1 (en) | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US7063541B2 (en) * | 1997-03-17 | 2006-06-20 | Formfactor, Inc. | Composite microelectronic spring structure and method for making same |
US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
US6441315B1 (en) * | 1998-11-10 | 2002-08-27 | Formfactor, Inc. | Contact structures with blades having a wiping motion |
US6426638B1 (en) * | 2000-05-02 | 2002-07-30 | Decision Track Llc | Compliant probe apparatus |
DE10143173A1 (de) | 2000-12-04 | 2002-06-06 | Cascade Microtech Inc | Wafersonde |
US6933738B2 (en) * | 2001-07-16 | 2005-08-23 | Formfactor, Inc. | Fiducial alignment marks on microelectronic spring contacts |
US7182672B2 (en) * | 2001-08-02 | 2007-02-27 | Sv Probe Pte. Ltd. | Method of probe tip shaping and cleaning |
WO2003052435A1 (en) | 2001-08-21 | 2003-06-26 | Cascade Microtech, Inc. | Membrane probing system |
US7010854B2 (en) * | 2002-04-10 | 2006-03-14 | Formfactor, Inc. | Re-assembly process for MEMS structures |
US20060006888A1 (en) * | 2003-02-04 | 2006-01-12 | Microfabrica Inc. | Electrochemically fabricated microprobes |
US7363705B2 (en) * | 2003-02-04 | 2008-04-29 | Microfabrica, Inc. | Method of making a contact |
US7412767B2 (en) * | 2003-02-04 | 2008-08-19 | Microfabrica, Inc. | Microprobe tips and methods for making |
US20060053625A1 (en) * | 2002-05-07 | 2006-03-16 | Microfabrica Inc. | Microprobe tips and methods for making |
US20050104609A1 (en) * | 2003-02-04 | 2005-05-19 | Microfabrica Inc. | Microprobe tips and methods for making |
US7531077B2 (en) | 2003-02-04 | 2009-05-12 | Microfabrica Inc. | Electrochemical fabrication process for forming multilayer multimaterial microprobe structures |
US7265565B2 (en) | 2003-02-04 | 2007-09-04 | Microfabrica Inc. | Cantilever microprobes for contacting electronic components and methods for making such probes |
US20060051948A1 (en) * | 2003-02-04 | 2006-03-09 | Microfabrica Inc. | Microprobe tips and methods for making |
US20060238209A1 (en) * | 2002-05-07 | 2006-10-26 | Microfabrica Inc. | Vertical microprobes for contacting electronic components and method for making such probes |
US7273812B2 (en) * | 2002-05-07 | 2007-09-25 | Microfabrica Inc. | Microprobe tips and methods for making |
US7640651B2 (en) * | 2003-12-31 | 2010-01-05 | Microfabrica Inc. | Fabrication process for co-fabricating multilayer probe array and a space transformer |
US20050184748A1 (en) * | 2003-02-04 | 2005-08-25 | Microfabrica Inc. | Pin-type probes for contacting electronic circuits and methods for making such probes |
US6965244B2 (en) * | 2002-05-08 | 2005-11-15 | Formfactor, Inc. | High performance probe system |
US6911835B2 (en) * | 2002-05-08 | 2005-06-28 | Formfactor, Inc. | High performance probe system |
US6992399B2 (en) * | 2002-05-24 | 2006-01-31 | Northrop Grumman Corporation | Die connected with integrated circuit component for electrical signal passing therebetween |
US20080106280A1 (en) * | 2003-02-04 | 2008-05-08 | Microfabrica Inc. | Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes |
US10416192B2 (en) | 2003-02-04 | 2019-09-17 | Microfabrica Inc. | Cantilever microprobes for contacting electronic components |
US9244101B2 (en) * | 2003-02-04 | 2016-01-26 | University Of Southern California | Electrochemical fabrication process for forming multilayer multimaterial microprobe structures |
US20080211524A1 (en) * | 2003-02-04 | 2008-09-04 | Microfabrica Inc. | Electrochemically Fabricated Microprobes |
US8613846B2 (en) * | 2003-02-04 | 2013-12-24 | Microfabrica Inc. | Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties |
US7567089B2 (en) * | 2003-02-04 | 2009-07-28 | Microfabrica Inc. | Two-part microprobes for contacting electronic components and methods for making such probes |
EP2395598B1 (de) | 2003-03-04 | 2018-08-22 | Nuvotronics, LLC | Koaxiale Wellenleitermikrostruktur und Formungsverfahren |
US7342402B2 (en) * | 2003-04-10 | 2008-03-11 | Formfactor, Inc. | Method of probing a device using captured image of probe structure in which probe tips comprise alignment features |
DE10318223A1 (de) * | 2003-04-22 | 2004-12-02 | Louis Renner Gmbh | Kontaktstück aus Wolfram mit einer korrosionshemmenden Schicht aus Unedelmetall |
US6965245B2 (en) | 2003-05-01 | 2005-11-15 | K&S Interconnect, Inc. | Prefabricated and attached interconnect structure |
US9671429B2 (en) | 2003-05-07 | 2017-06-06 | University Of Southern California | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties |
US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
DE202004021093U1 (de) | 2003-12-24 | 2006-09-28 | Cascade Microtech, Inc., Beaverton | Aktiver Halbleiterscheibenmessfühler |
US10641792B2 (en) | 2003-12-31 | 2020-05-05 | University Of Southern California | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties |
US20080108221A1 (en) * | 2003-12-31 | 2008-05-08 | Microfabrica Inc. | Microprobe Tips and Methods for Making |
US9097740B2 (en) | 2004-05-21 | 2015-08-04 | Formfactor, Inc. | Layered probes with core |
US8988091B2 (en) | 2004-05-21 | 2015-03-24 | Microprobe, Inc. | Multiple contact probes |
US7659739B2 (en) * | 2006-09-14 | 2010-02-09 | Micro Porbe, Inc. | Knee probe having reduced thickness section for control of scrub motion |
US9476911B2 (en) | 2004-05-21 | 2016-10-25 | Microprobe, Inc. | Probes with high current carrying capability and laser machining methods |
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-
1999
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- 1999-11-10 CN CNB031249582A patent/CN100470946C/zh not_active Expired - Fee Related
- 1999-11-10 WO PCT/US1999/026787 patent/WO2000028625A1/en active IP Right Grant
- 1999-11-10 KR KR10-2001-7005825A patent/KR100370720B1/ko not_active IP Right Cessation
- 1999-11-10 JP JP2000581719A patent/JP3902729B2/ja not_active Expired - Fee Related
- 1999-11-10 DE DE69927996T patent/DE69927996T2/de not_active Expired - Lifetime
- 1999-11-10 EP EP99962755A patent/EP1129510B1/de not_active Expired - Lifetime
- 1999-11-10 EP EP05022474A patent/EP1641082A3/de not_active Withdrawn
- 1999-11-10 AU AU19130/00A patent/AU1913000A/en not_active Abandoned
- 1999-11-10 CN CN99813155A patent/CN1127781C/zh not_active Expired - Fee Related
-
2002
- 2002-06-17 US US10/174,455 patent/US6825422B2/en not_active Expired - Lifetime
-
2003
- 2003-10-22 JP JP2003361559A patent/JP4493317B2/ja not_active Expired - Fee Related
-
2004
- 2004-03-31 US US10/815,400 patent/US20040177499A1/en not_active Abandoned
-
2009
- 2009-12-14 JP JP2009283375A patent/JP2010073698A/ja active Pending
-
2010
- 2010-08-06 US US12/852,337 patent/US9030222B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2000028625A1 (en) | 2000-05-18 |
CN1127781C (zh) | 2003-11-12 |
CN1325553A (zh) | 2001-12-05 |
EP1129510A1 (de) | 2001-09-05 |
US20030015347A1 (en) | 2003-01-23 |
JP4493317B2 (ja) | 2010-06-30 |
JP2002529903A (ja) | 2002-09-10 |
US20100323551A1 (en) | 2010-12-23 |
KR100370720B1 (ko) | 2003-02-05 |
US20040177499A1 (en) | 2004-09-16 |
DE69927996T2 (de) | 2006-07-27 |
JP2010073698A (ja) | 2010-04-02 |
EP1129510B1 (de) | 2005-10-26 |
US6825422B2 (en) | 2004-11-30 |
JP2004139992A (ja) | 2004-05-13 |
TW588483B (en) | 2004-05-21 |
EP1641082A2 (de) | 2006-03-29 |
AU1913000A (en) | 2000-05-29 |
CN100470946C (zh) | 2009-03-18 |
JP3902729B2 (ja) | 2007-04-11 |
US6441315B1 (en) | 2002-08-27 |
EP1641082A3 (de) | 2008-12-31 |
US9030222B2 (en) | 2015-05-12 |
CN1497794A (zh) | 2004-05-19 |
KR20010090835A (ko) | 2001-10-19 |
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