TW573240B - Method and apparatus for providing a determined ratio of process fluids - Google Patents

Method and apparatus for providing a determined ratio of process fluids Download PDF

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Publication number
TW573240B
TW573240B TW91111088A TW91111088A TW573240B TW 573240 B TW573240 B TW 573240B TW 91111088 A TW91111088 A TW 91111088A TW 91111088 A TW91111088 A TW 91111088A TW 573240 B TW573240 B TW 573240B
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TW
Taiwan
Prior art keywords
fluid
flow
pressure
set point
patent application
Prior art date
Application number
TW91111088A
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English (en)
Chinese (zh)
Inventor
John M Lull
William S Valentine
Original Assignee
Unit Instr Inc
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Filing date
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Publication of TW573240B publication Critical patent/TW573240B/zh

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Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00Control of flow
    • G05D7/06Control of flow characterised by the use of electric means
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00Control of flow
    • G05D7/06Control of flow characterised by the use of electric means
    • G05D7/0617Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • G05D7/0641Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means
    • G05D7/0664Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means the plurality of throttling means being arranged for the control of a plurality of diverging flows from a single flow
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D11/00Control of flow ratio
    • G05D11/02Controlling ratio of two or more flows of fluid or fluent material
    • G05D11/13Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
    • G05D11/131Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components
    • G05D11/132Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components by controlling the flow of the individual components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/0318Processes
    • Y10T137/0324With control of flow by a condition or characteristic of a fluid
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/0318Processes
    • Y10T137/0324With control of flow by a condition or characteristic of a fluid
    • Y10T137/0363For producing proportionate flow
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/0318Processes
    • Y10T137/0324With control of flow by a condition or characteristic of a fluid
    • Y10T137/0379By fluid pressure
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/0318Processes
    • Y10T137/0396Involving pressure control
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/7722Line condition change responsive valves
    • Y10T137/7758Pilot or servo controlled
    • Y10T137/7759Responsive to change in rate of fluid flow
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/7722Line condition change responsive valves
    • Y10T137/7758Pilot or servo controlled
    • Y10T137/7761Electrically actuated valve
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/8593Systems
    • Y10T137/87249Multiple inlet with multiple outlet
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/8593Systems
    • Y10T137/877With flow control means for branched passages
    • Y10T137/87877Single inlet with multiple distinctly valved outlets

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Flow Control (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
TW91111088A 2001-05-24 2002-05-24 Method and apparatus for providing a determined ratio of process fluids TW573240B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29335601P 2001-05-24 2001-05-24

Publications (1)

Publication Number Publication Date
TW573240B true TW573240B (en) 2004-01-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW91111088A TW573240B (en) 2001-05-24 2002-05-24 Method and apparatus for providing a determined ratio of process fluids

Country Status (7)

Country Link
US (5) US6752166B2 (cg-RX-API-DMAC7.html)
EP (1) EP1399789A1 (cg-RX-API-DMAC7.html)
JP (3) JP4209688B2 (cg-RX-API-DMAC7.html)
KR (1) KR20040019293A (cg-RX-API-DMAC7.html)
CN (1) CN100403198C (cg-RX-API-DMAC7.html)
TW (1) TW573240B (cg-RX-API-DMAC7.html)
WO (1) WO2002095519A1 (cg-RX-API-DMAC7.html)

Families Citing this family (121)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE492973T1 (de) * 1998-10-30 2011-01-15 Virnetx Inc Netzwerkprotokoll zur geschützten kommunikation
US7418504B2 (en) 1998-10-30 2008-08-26 Virnetx, Inc. Agile network protocol for secure communications using secure domain names
US6826616B2 (en) 1998-10-30 2004-11-30 Science Applications International Corp. Method for establishing secure communication link between computers of virtual private network
US6502135B1 (en) * 1998-10-30 2002-12-31 Science Applications International Corporation Agile network protocol for secure communications with assured system availability
US10511573B2 (en) 1998-10-30 2019-12-17 Virnetx, Inc. Agile network protocol for secure communications using secure domain names
US7563328B2 (en) * 2001-01-19 2009-07-21 Tokyo Electron Limited Method and apparatus for gas injection system with minimum particulate contamination
KR20040019293A (ko) 2001-05-24 2004-03-05 셀레리티 그룹 아이엔씨 소정 비율의 프로세스 유체를 제공하는 방법 및 장치
US6766260B2 (en) * 2002-01-04 2004-07-20 Mks Instruments, Inc. Mass flow ratio system and method
US7039999B2 (en) * 2002-04-25 2006-05-09 Tarr Adam L Method for installation of semiconductor fabrication tools
US7169231B2 (en) 2002-12-13 2007-01-30 Lam Research Corporation Gas distribution system with tuning gas
US7534363B2 (en) 2002-12-13 2009-05-19 Lam Research Corporation Method for providing uniform removal of organic material
US20040168719A1 (en) * 2003-02-28 2004-09-02 Masahiro Nambu System for dividing gas flow
US6796332B1 (en) * 2003-04-04 2004-09-28 Texaco Inc Fluid balance control system for use in a fuel processor
WO2004109420A1 (ja) * 2003-06-09 2004-12-16 Ckd Corporation 相対的圧力制御システム及び相対的流量制御システム
JP4454964B2 (ja) * 2003-06-09 2010-04-21 東京エレクトロン株式会社 分圧制御システム及び流量制御システム
JP4331539B2 (ja) * 2003-07-31 2009-09-16 株式会社フジキン チャンバへのガス供給装置及びこれを用いたチャンバの内圧制御方法
US7201179B2 (en) * 2003-09-23 2007-04-10 Air Liquide Industrial U.S. Lp Modular fluid supply system
US20050075685A1 (en) * 2003-10-02 2005-04-07 Forsberg John W. Medical device programmer with infrared communication
JP4399227B2 (ja) * 2003-10-06 2010-01-13 株式会社フジキン チャンバの内圧制御装置及び内圧被制御式チャンバ
JP4550507B2 (ja) * 2004-07-26 2010-09-22 株式会社日立ハイテクノロジーズ プラズマ処理装置
US7461549B1 (en) * 2007-06-27 2008-12-09 Mks Instruments, Inc. Mass flow verifiers capable of providing different volumes, and related methods
US7621290B2 (en) 2005-04-21 2009-11-24 Mks Instruments, Inc. Gas delivery method and system including a flow ratio controller using antisymmetric optimal control
US7673645B2 (en) * 2005-04-21 2010-03-09 Mks Instruments, Inc. Gas delivery method and system including a flow ratio controller using a multiple antisymmetric optimal control arrangement
US7394639B2 (en) * 2005-07-08 2008-07-01 Advanced Energy Industries, Inc. System and method for driving an industrial control device
US8776717B2 (en) * 2005-10-11 2014-07-15 Intermolecular, Inc. Systems for discretized processing of regions of a substrate
JP4788920B2 (ja) * 2006-03-20 2011-10-05 日立金属株式会社 質量流量制御装置、その検定方法及び半導体製造装置
US8997791B2 (en) * 2006-04-14 2015-04-07 Mks Instruments, Inc. Multiple-channel flow ratio controller
JP2008039513A (ja) * 2006-08-03 2008-02-21 Hitachi Metals Ltd 質量流量制御装置の流量制御補正方法
US7637143B2 (en) * 2006-11-10 2009-12-29 Tokyo Electron Limited Substrate processing apparatus and analysis method therefor
US9405298B2 (en) * 2006-11-20 2016-08-02 Applied Materials, Inc. System and method to divide fluid flow in a predetermined ratio
US8011317B2 (en) * 2006-12-29 2011-09-06 Intermolecular, Inc. Advanced mixing system for integrated tool having site-isolated reactors
US7706925B2 (en) * 2007-01-10 2010-04-27 Mks Instruments, Inc. Integrated pressure and flow ratio control system
CA2678331A1 (en) * 2007-01-30 2008-08-07 Bradley University A heat transfer apparatus and method
US7846497B2 (en) * 2007-02-26 2010-12-07 Applied Materials, Inc. Method and apparatus for controlling gas flow to a processing chamber
US8074677B2 (en) * 2007-02-26 2011-12-13 Applied Materials, Inc. Method and apparatus for controlling gas flow to a processing chamber
US20080254217A1 (en) * 2007-04-16 2008-10-16 Boroson Michael L Fine control of vaporized organic material
US8387657B2 (en) * 2007-06-15 2013-03-05 Fisher Controls International, Llc Methods and apparatus to determine a position of a valve
JP5001757B2 (ja) * 2007-08-31 2012-08-15 シーケーディ株式会社 流体混合システム及び流体混合装置
US7621302B2 (en) * 2007-09-28 2009-11-24 Airgas, Inc. Coriolis dosing system for filling gas cylinders
JP5459895B2 (ja) * 2007-10-15 2014-04-02 Ckd株式会社 ガス分流供給ユニット
KR100951683B1 (ko) * 2007-12-10 2010-04-07 주식회사 테라세미콘 소스가스 공급방법
US20100269924A1 (en) * 2007-12-27 2010-10-28 Horiba Stec, Co., Ltd. Flow rate ratio controlling apparatus
WO2009085866A2 (en) * 2007-12-27 2009-07-09 Lam Research Corporation Gas transport delay resolution for short etch recipes
US20090178714A1 (en) * 2008-01-14 2009-07-16 Tokyo Electron Limited Flow control system and method for multizone gas distribution
US20090236447A1 (en) * 2008-03-21 2009-09-24 Applied Materials, Inc. Method and apparatus for controlling gas injection in process chamber
US8205629B2 (en) * 2008-04-25 2012-06-26 Applied Materials, Inc. Real time lead-line characterization for MFC flow verification
WO2009141947A1 (ja) * 2008-05-21 2009-11-26 株式会社フジキン 圧力式流量制御装置を用いた流体の非連続式流量切替制御方法
EP2307938B2 (en) * 2008-06-26 2020-09-23 Belparts Flow control system
BRPI0917012A2 (pt) * 2008-08-13 2016-02-16 Shell Int Research método e aparelho para controlar o fluxo de gás entre uma ou mais correntes de entrada e uma ou mais correntes de saída através de uma conjunção
US20100084023A1 (en) * 2008-10-07 2010-04-08 Chris Melcer Flow control module for a fluid delivery system
SG176676A1 (en) 2009-06-10 2012-01-30 Advanced Tech Materials Fluid processing systems and methods
KR101386552B1 (ko) * 2009-08-20 2014-04-17 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치 및 방법과 플라즈마 에칭 처리 장치 및 방법
US9127361B2 (en) * 2009-12-07 2015-09-08 Mks Instruments, Inc. Methods of and apparatus for controlling pressure in multiple zones of a process tool
WO2011085064A2 (en) * 2010-01-08 2011-07-14 Applied Materials, Inc. N-channel flow ratio controller calibration
US8807112B2 (en) * 2010-02-03 2014-08-19 Achates Power, Inc. Rolling thrust bearing constructions
US20110186017A1 (en) * 2010-02-03 2011-08-04 Achates Power, Inc. Single-crankshaft, opposed-piston engine constructions
JP5562712B2 (ja) * 2010-04-30 2014-07-30 東京エレクトロン株式会社 半導体製造装置用のガス供給装置
JP5514310B2 (ja) * 2010-06-28 2014-06-04 東京エレクトロン株式会社 プラズマ処理方法
US8905074B2 (en) * 2010-10-22 2014-12-09 Applied Materials, Inc. Apparatus for controlling gas distribution using orifice ratio conductance control
JP5528374B2 (ja) * 2011-03-03 2014-06-25 東京エレクトロン株式会社 ガス減圧供給装置、これを備えるシリンダキャビネット、バルブボックス、及び基板処理装置
JP6068462B2 (ja) 2011-06-30 2017-01-25 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 高速ガス交換、高速ガス切換、及びプログラミング可能なガス送出のための方法及び装置
JP5739261B2 (ja) * 2011-07-28 2015-06-24 株式会社堀場エステック ガス供給システム
US9188989B1 (en) 2011-08-20 2015-11-17 Daniel T. Mudd Flow node to deliver process gas using a remote pressure measurement device
US9958302B2 (en) 2011-08-20 2018-05-01 Reno Technologies, Inc. Flow control system, method, and apparatus
US8849466B2 (en) 2011-10-04 2014-09-30 Mks Instruments, Inc. Method of and apparatus for multiple channel flow ratio controller system
US20130255784A1 (en) * 2012-03-30 2013-10-03 Applied Materials, Inc. Gas delivery systems and methods of use thereof
CN103591458B (zh) * 2012-08-17 2017-04-12 诺发系统公司 气体分配网络中的流量平衡
US8925588B2 (en) 2012-08-17 2015-01-06 Novellus Systems, Inc. Flow balancing in gas distribution networks
US9004107B2 (en) * 2012-08-21 2015-04-14 Applied Materials, Inc. Methods and apparatus for enhanced gas flow rate control
US9781994B2 (en) * 2012-12-07 2017-10-10 Taiwan Semiconductor Manufacturing Company Limited Wafer cleaning
US9090972B2 (en) 2012-12-31 2015-07-28 Lam Research Corporation Gas supply systems for substrate processing chambers and methods therefor
US20140230910A1 (en) * 2013-02-20 2014-08-21 Agilent Technologies, Inc. Split-channel gas flow control
JP6193679B2 (ja) * 2013-08-30 2017-09-06 株式会社フジキン ガス分流供給装置及びガス分流供給方法
US9335768B2 (en) * 2013-09-12 2016-05-10 Lam Research Corporation Cluster mass flow devices and multi-line mass flow devices incorporating the same
JP6158111B2 (ja) * 2014-02-12 2017-07-05 東京エレクトロン株式会社 ガス供給方法及び半導体製造装置
CN104514759A (zh) * 2014-12-30 2015-04-15 天津福云天翼科技有限公司 一种大流量分离式蓄能器组的恒定压力调节系统
US10658222B2 (en) 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
DE102015100762A1 (de) * 2015-01-20 2016-07-21 Infineon Technologies Ag Behälterschalteinrichtung und Verfahren zum Überwachen einer Fluidrate
SG10202009062PA (en) 2015-02-12 2020-10-29 Entegris Inc Smart package
US10146233B2 (en) * 2015-04-06 2018-12-04 Horiba Stec, Co., Ltd. Flow rate ratio control apparatus and program for flow rate ratio control apparatus
US10957561B2 (en) * 2015-07-30 2021-03-23 Lam Research Corporation Gas delivery system
US10261523B2 (en) * 2015-08-17 2019-04-16 Rainboxx, Inc. Apparatus and method for controlling irrigation process by sending encoded acoustical messages along irrigation conduit
US10825659B2 (en) 2016-01-07 2020-11-03 Lam Research Corporation Substrate processing chamber including multiple gas injection points and dual injector
US10651015B2 (en) 2016-02-12 2020-05-12 Lam Research Corporation Variable depth edge ring for etch uniformity control
US10699878B2 (en) 2016-02-12 2020-06-30 Lam Research Corporation Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring
US10438833B2 (en) 2016-02-16 2019-10-08 Lam Research Corporation Wafer lift ring system for wafer transfer
WO2017146558A1 (es) * 2016-02-23 2017-08-31 Electro Controles Del Noroeste S.A. De C.V. Sistema modular dosificador de fluidos y su proceso
US10269600B2 (en) * 2016-03-15 2019-04-23 Applied Materials, Inc. Methods and assemblies for gas flow ratio control
US10453721B2 (en) * 2016-03-15 2019-10-22 Applied Materials, Inc. Methods and assemblies for gas flow ratio control
US10838437B2 (en) 2018-02-22 2020-11-17 Ichor Systems, Inc. Apparatus for splitting flow of process gas and method of operating same
US10303189B2 (en) 2016-06-30 2019-05-28 Reno Technologies, Inc. Flow control system, method, and apparatus
US11144075B2 (en) 2016-06-30 2021-10-12 Ichor Systems, Inc. Flow control system, method, and apparatus
US10679880B2 (en) 2016-09-27 2020-06-09 Ichor Systems, Inc. Method of achieving improved transient response in apparatus for controlling flow and system for accomplishing same
US10410832B2 (en) 2016-08-19 2019-09-10 Lam Research Corporation Control of on-wafer CD uniformity with movable edge ring and gas injection adjustment
CN106730545B (zh) * 2016-12-26 2020-05-19 威特龙消防安全集团股份公司 细水雾灭火系统添加剂计量注入系统
US10663337B2 (en) 2016-12-30 2020-05-26 Ichor Systems, Inc. Apparatus for controlling flow and method of calibrating same
JP6914063B2 (ja) * 2017-03-10 2021-08-04 株式会社堀場エステック ガス制御システム、該ガス制御システムを備えた成膜装置、該ガス制御システムに用いるプログラム及びガス制御方法。
US10656662B2 (en) * 2017-09-15 2020-05-19 Kabushiki Kaisha Toshiba Variable pressure device and actuator
WO2019103722A1 (en) 2017-11-21 2019-05-31 Lam Research Corporation Bottom and middle edge rings
JP7027151B2 (ja) 2017-12-13 2022-03-01 株式会社堀場エステック 濃度制御装置、ガス制御システム、成膜装置、濃度制御方法、及び濃度制御装置用プログラム
US10591934B2 (en) * 2018-03-09 2020-03-17 Lam Research Corporation Mass flow controller for substrate processing
JP7031093B2 (ja) * 2018-03-30 2022-03-08 三機工業株式会社 供給システムおよび供給システムの制御方法
TWI862222B (zh) * 2018-04-28 2024-11-11 美商應用材料股份有限公司 基於氣體脈衝的共享前驅物分佈系統及其使用方法
CN118398464A (zh) 2018-08-13 2024-07-26 朗姆研究公司 可更换和/或可折叠的用于等离子鞘调整的并入边缘环定位和定心功能的边缘环组件
JP7024740B2 (ja) 2019-01-16 2022-02-24 株式会社デンソー 半導体製造装置
JP7281285B2 (ja) * 2019-01-28 2023-05-25 株式会社堀場エステック 濃度制御装置、及び、ゼロ点調整方法、濃度制御装置用プログラム
WO2020218138A1 (ja) 2019-04-25 2020-10-29 株式会社フジキン 流量制御装置
EP4062250A1 (en) * 2019-11-19 2022-09-28 Linde GmbH Smart gas mixer
CN115315775A (zh) 2020-03-23 2022-11-08 朗姆研究公司 衬底处理系统中的中环腐蚀补偿
JP2021179739A (ja) * 2020-05-12 2021-11-18 株式会社堀場エステック 流量比率制御システム、成膜システム、異常診断方法、及び異常診断プログラム
CN111913504B (zh) * 2020-08-17 2023-10-20 中国地质大学(北京) 一种恒定流量分流装置
CN116349002A (zh) 2020-10-05 2023-06-27 朗姆研究公司 用于等离子体处理系统的可移动边缘环
US12068135B2 (en) * 2021-02-12 2024-08-20 Applied Materials, Inc. Fast gas exchange apparatus, system, and method
WO2022186971A1 (en) 2021-03-03 2022-09-09 Ichor Systems, Inc. Fluid flow control system comprising a manifold assembly
TW202300693A (zh) * 2021-05-26 2023-01-01 荷蘭商Asm Ip私人控股有限公司 氣體系統、半導體處理系統、及氣體流動控制方法
US11940307B2 (en) 2021-06-08 2024-03-26 Mks Instruments, Inc. Methods and apparatus for pressure based mass flow ratio control
US12000723B2 (en) 2022-02-18 2024-06-04 Mks Instruments, Inc. Method and apparatus for pressure based mass flow control
US11940819B1 (en) * 2023-01-20 2024-03-26 Applied Materials, Inc. Mass flow controller based fast gas exchange
US20250264892A1 (en) * 2024-02-15 2025-08-21 Illinois Tool Works Inc. Flow ratio controllers with mass accumulation compensation and gas distribution systems utilizing mass accumulation compensation
US20250264891A1 (en) * 2024-02-15 2025-08-21 Illinois Tool Works Inc. Flow ratio controllers and gas distribution systems utilizing flow ratio controllers
CN119916848B (zh) * 2025-04-03 2025-06-24 常州高凯电子有限公司 一种用于多通道气体流量比例控制方法及系统

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2676603A (en) * 1946-04-12 1954-04-27 Kollsman Paul Fluid flow divider
DE2517957C2 (de) * 1975-04-23 1977-05-12 Norddeutsche Affinerie Verfahren zur unabhaengigen gemisch- und leistungseinstellung bei vielbrenner-schachtoefen zum schmelzen von metallen
DE2915983C2 (de) * 1979-04-20 1983-03-31 Klöckner Ionon GmbH, 5000 Köln Verfahren zum Erzeugen eines Gasgemisches
US4396031A (en) * 1981-01-07 1983-08-02 Conoco Inc. Method for restricting uncontrolled fluid flow through a pipe
US4369031A (en) * 1981-09-15 1983-01-18 Thermco Products Corporation Gas control system for chemical vapor deposition system
JPS58151614A (ja) * 1982-03-04 1983-09-08 Mitsubishi Electric Corp 流量制御装置
US4949670A (en) 1988-11-04 1990-08-21 Tegal Corporation Method and apparatus for low pressure plasma
US5031674A (en) 1989-03-03 1991-07-16 Eaton Corporation Fluid flow control method and apparatus for minimizing particle contamination
US5240046A (en) 1989-03-03 1993-08-31 Eaton Corporation Fluid flow control method and apparatus for minimizing particle contamination
US5134965A (en) 1989-06-16 1992-08-04 Hitachi, Ltd. Processing apparatus and method for plasma processing
US5013398A (en) 1990-05-29 1991-05-07 Micron Technology, Inc. Anisotropic etch method for a sandwich structure
US5062446A (en) * 1991-01-07 1991-11-05 Sematech, Inc. Intelligent mass flow controller
US5165450A (en) 1991-12-23 1992-11-24 Texaco Inc. Means for separating a fluid stream into two separate streams
JP2894658B2 (ja) 1992-01-17 1999-05-24 株式会社東芝 ドライエッチング方法およびその装置
US5307833A (en) 1992-10-26 1994-05-03 Texaco Inc. Method and apparatus for automatically transferring and measuring wet steam between priority and secondary users
US5997950A (en) 1992-12-22 1999-12-07 Applied Materials, Inc. Substrate having uniform tungsten silicide film and method of manufacture
JPH06205935A (ja) 1992-12-25 1994-07-26 Toshiba Corp 脱硝制御装置
US5453124A (en) * 1992-12-30 1995-09-26 Texas Instruments Incorporated Programmable multizone gas injector for single-wafer semiconductor processing equipment
US5916369A (en) 1995-06-07 1999-06-29 Applied Materials, Inc. Gas inlets for wafer processing chamber
US5647945A (en) 1993-08-25 1997-07-15 Tokyo Electron Limited Vacuum processing apparatus
US5614055A (en) 1993-08-27 1997-03-25 Applied Materials, Inc. High density plasma CVD and etching reactor
US5522934A (en) 1994-04-26 1996-06-04 Tokyo Electron Limited Plasma processing apparatus using vertical gas inlets one on top of another
US5736457A (en) 1994-12-09 1998-04-07 Sematech Method of making a damascene metallization
JP2837112B2 (ja) 1995-06-09 1998-12-14 株式会社平井 音速ノズルを用いた質量流量制御方法および装置
US5702530A (en) 1995-06-23 1997-12-30 Applied Materials, Inc. Distributed microwave plasma reactor for semiconductor processing
IT1275825B1 (it) 1995-10-30 1997-10-17 Nuovo Pignone Spa Sistema perfezionato per la misura e la regolazione della portata massica di gas
US5772771A (en) 1995-12-13 1998-06-30 Applied Materials, Inc. Deposition chamber for improved deposition thickness uniformity
US5761606A (en) * 1996-02-08 1998-06-02 Wolzien; Thomas R. Media online services access via address embedded in video or audio program
US6018768A (en) * 1996-03-08 2000-01-25 Actv, Inc. Enhanced video programming system and method for incorporating and displaying retrieved integrated internet information segments
US5774664A (en) * 1996-03-08 1998-06-30 Actv, Inc. Enhanced video programming system and method for incorporating and displaying retrieved integrated internet information segments
US5778181A (en) * 1996-03-08 1998-07-07 Actv, Inc. Enhanced video programming system and method for incorporating and displaying retrieved integrated internet information segments
US5662143A (en) 1996-05-16 1997-09-02 Gasonics International Modular gas box system
US6013155A (en) 1996-06-28 2000-01-11 Lam Research Corporation Gas injection system for plasma processing
US6083569A (en) 1996-10-25 2000-07-04 Applied Materials, Inc. Discharging a wafer after a plasma process for dielectric deposition
US5911834A (en) 1996-11-18 1999-06-15 Applied Materials, Inc. Gas delivery system
US6294026B1 (en) 1996-11-26 2001-09-25 Siemens Aktiengesellschaft Distribution plate for a reaction chamber with multiple gas inlets and separate mass flow control loops
US6321782B1 (en) * 1997-01-08 2001-11-27 Ronald Hollister Apparatus for controlling the flow of fluids
US6190233B1 (en) 1997-02-20 2001-02-20 Applied Materials, Inc. Method and apparatus for improving gap-fill capability using chemical and physical etchbacks
US5843239A (en) 1997-03-03 1998-12-01 Applied Materials, Inc. Two-step process for cleaning a substrate processing chamber
US6125859A (en) 1997-03-05 2000-10-03 Applied Materials, Inc. Method for improved cleaning of substrate processing systems
US5865205A (en) * 1997-04-17 1999-02-02 Applied Materials, Inc. Dynamic gas flow controller
US6042687A (en) 1997-06-30 2000-03-28 Lam Research Corporation Method and apparatus for improving etch and deposition uniformity in plasma semiconductor processing
JP3317209B2 (ja) 1997-08-12 2002-08-26 東京エレクトロンエイ・ティー株式会社 プラズマ処理装置及びプラズマ処理方法
JPH11303758A (ja) 1998-04-17 1999-11-02 Nissan Motor Co Ltd 電動ポンプの制御装置
US6217937B1 (en) 1998-07-15 2001-04-17 Cornell Research Foundation, Inc. High throughput OMVPE apparatus
JP3522544B2 (ja) * 1998-08-24 2004-04-26 忠弘 大見 流体可変型流量制御装置
US6217659B1 (en) 1998-10-16 2001-04-17 Air Products And Chemical, Inc. Dynamic blending gas delivery system and method
US6532978B1 (en) * 1998-11-20 2003-03-18 Sepiatec Gmbh Method and device for regulating individual sub-flows of a system for conveying fluid media
WO2000063756A1 (en) * 1999-04-16 2000-10-26 Fujikin Incorporated Parallel bypass type fluid feeding device, and method and device for controlling fluid variable type pressure system flow rate used for the device
US6210482B1 (en) * 1999-04-22 2001-04-03 Fujikin Incorporated Apparatus for feeding gases for use in semiconductor manufacturing
JP2000306884A (ja) 1999-04-22 2000-11-02 Mitsubishi Electric Corp プラズマ処理装置およびプラズマ処理方法
US6343617B1 (en) * 1999-07-09 2002-02-05 Millipore Corporation System and method of operation of a digital mass flow controller
US6389364B1 (en) * 1999-07-10 2002-05-14 Mykrolis Corporation System and method for a digital mass flow controller
US6581623B1 (en) * 1999-07-16 2003-06-24 Advanced Technology Materials, Inc. Auto-switching gas delivery system utilizing sub-atmospheric pressure gas supply vessels
JP2002110570A (ja) 2000-10-04 2002-04-12 Asm Japan Kk 半導体製造装置用ガスラインシステム
US6333272B1 (en) * 2000-10-06 2001-12-25 Lam Research Corporation Gas distribution apparatus for semiconductor processing
US6631334B2 (en) * 2000-12-26 2003-10-07 Mks Instruments, Inc. Pressure-based mass flow controller system
US6418954B1 (en) * 2001-04-17 2002-07-16 Mks Instruments, Inc. System and method for dividing flow
KR20040019293A (ko) * 2001-05-24 2004-03-05 셀레리티 그룹 아이엔씨 소정 비율의 프로세스 유체를 제공하는 방법 및 장치
US6766260B2 (en) 2002-01-04 2004-07-20 Mks Instruments, Inc. Mass flow ratio system and method
US6913652B2 (en) * 2002-06-17 2005-07-05 Applied Materials, Inc. Gas flow division in a wafer processing system having multiple chambers
US7169231B2 (en) * 2002-12-13 2007-01-30 Lam Research Corporation Gas distribution system with tuning gas

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US20040200529A1 (en) 2004-10-14
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