TW561522B - Wafer handling system and method for use in lithography patterning - Google Patents

Wafer handling system and method for use in lithography patterning Download PDF

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Publication number
TW561522B
TW561522B TW091122530A TW91122530A TW561522B TW 561522 B TW561522 B TW 561522B TW 091122530 A TW091122530 A TW 091122530A TW 91122530 A TW91122530 A TW 91122530A TW 561522 B TW561522 B TW 561522B
Authority
TW
Taiwan
Prior art keywords
wafer
chuck
alignment
scope
item
Prior art date
Application number
TW091122530A
Other languages
English (en)
Chinese (zh)
Inventor
Puerto Santiago E Del
Stephen Roux
Justin L Kreuzer
Original Assignee
Asml Us Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Us Inc filed Critical Asml Us Inc
Application granted granted Critical
Publication of TW561522B publication Critical patent/TW561522B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7096—Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW091122530A 2001-10-19 2002-09-30 Wafer handling system and method for use in lithography patterning TW561522B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/981,992 US6778258B2 (en) 2001-10-19 2001-10-19 Wafer handling system for use in lithography patterning

Publications (1)

Publication Number Publication Date
TW561522B true TW561522B (en) 2003-11-11

Family

ID=25528779

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091122530A TW561522B (en) 2001-10-19 2002-09-30 Wafer handling system and method for use in lithography patterning

Country Status (5)

Country Link
US (3) US6778258B2 (enExample)
EP (1) EP1304727A3 (enExample)
JP (2) JP4493070B2 (enExample)
KR (1) KR100736300B1 (enExample)
TW (1) TW561522B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
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CN103456670A (zh) * 2007-07-13 2013-12-18 迈普尔平版印刷Ip有限公司 在光刻装置中交换晶片的方法
US9645511B2 (en) 2007-07-13 2017-05-09 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
TWI834074B (zh) * 2021-02-24 2024-03-01 南韓商Ｐｓｋ有限公司 加載互鎖真空腔室及基板處理裝置

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US6778258B2 (en) * 2001-10-19 2004-08-17 Asml Holding N.V. Wafer handling system for use in lithography patterning
JP3686866B2 (ja) * 2001-12-18 2005-08-24 株式会社日立製作所 半導体製造装置及び製造方法
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JP4315420B2 (ja) * 2003-04-18 2009-08-19 キヤノン株式会社 露光装置及び露光方法
EP1491967A1 (en) * 2003-06-27 2004-12-29 ASML Netherlands B.V. Method and apparatus for positioning a substrate on a substrate table
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US6972843B2 (en) * 2003-08-25 2005-12-06 Intel Corporation Lithography alignment
US8634633B2 (en) 2003-11-10 2014-01-21 Brooks Automation, Inc. Wafer center finding with kalman filter
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JP5316521B2 (ja) * 2010-03-31 2013-10-16 株式会社安川電機 基板搬送システム、基板処理システムおよび基板搬送ロボット
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TWI486723B (zh) 2011-04-28 2015-06-01 瑪波微影Ｉｐ公司 在微影系統中處理基板的方法
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Publication number Priority date Publication date Assignee Title
CN103456670A (zh) * 2007-07-13 2013-12-18 迈普尔平版印刷Ip有限公司 在光刻装置中交换晶片的方法
US9645511B2 (en) 2007-07-13 2017-05-09 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
US9665013B2 (en) 2007-07-13 2017-05-30 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
USRE49488E1 (en) 2007-07-13 2023-04-11 Asml Netherlands B.V. Lithography system, method of clamping and wafer table
TWI834074B (zh) * 2021-02-24 2024-03-01 南韓商Ｐｓｋ有限公司 加載互鎖真空腔室及基板處理裝置

Also Published As

Publication number Publication date
US7298459B2 (en) 2007-11-20
EP1304727A3 (en) 2004-12-15
US6927842B2 (en) 2005-08-09
KR100736300B1 (ko) 2007-07-06
JP2003188094A (ja) 2003-07-04
JP4493070B2 (ja) 2010-06-30
US6778258B2 (en) 2004-08-17
JP2009088555A (ja) 2009-04-23
US20040257554A1 (en) 2004-12-23
EP1304727A2 (en) 2003-04-23
KR20030032879A (ko) 2003-04-26
US20050264791A1 (en) 2005-12-01
JP4827913B2 (ja) 2011-11-30
US20030082466A1 (en) 2003-05-01

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