CN114746578A - 用于衬底加工工具的承载环至基座的运动学安装 - Google Patents
用于衬底加工工具的承载环至基座的运动学安装 Download PDFInfo
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Abstract
用于将承载衬底的承载环安装到处理室内的基座的各种运动学安装件。各种运动学安装件中的每一个都在安装过程中提供平稳的滑动动作,减少不需要的颗粒的产生,并防止承载环自由落体到基座上。
Description
相关申请的交叉引用
本申请要求2019年11月26日提交的美国临时专利申请No.62/940,654的优先权,并且通过引用将其并入本文以用于所有目的。
技术领域
本申请涉及用于将承载衬底的承载环安装到处理室内的基座的各种运动学安装件,更具体地,涉及各自在安装期间提供平滑滑动动作的各种运动学安装件,减少不需要的颗粒的产生,并防止承载环自由落体到基座上。
背景技术
诸如化学气相沉积(CVD)工具或等离子蚀刻工具之类的衬底处理工具是已知的并且通常用于处理衬底,例如半导体晶片、平板显示器和光伏面板。此类工具,无论其类型如何,通常都包括处理室、处理室内的基座,以及用于在处理期间将衬底安装和对准在基座上的合适位置的某种类型的安装机构。
一种用于半导体晶片处理工具的已知安装机构包括具有三个间隔120°的销的环和形成在基座的顶表面中的也间隔120°的三个凹部的组合。在安装操作期间,环用于在处理室中承载衬底,环的销与基座中的凹部对准,然后施加机械力,迫使销进入凹部内的合适位置(即最终安装位置)。上述设计存在许多问题。
首先,销通常由铝加工而成,铝通常是软材料,特别是在处理室中常用的高温(例如,250℃-400℃)下。因此,随着时间的推移,销容易磨损和变形。
其次,基座通常由远远更硬的材料制成,远远更硬的材料例如陶瓷,其加工困难且成本高。由于销和凹槽由不同的材料制成,将两者加工到相同的精度和公差是困难且昂贵的。
第三,销和凹部的不同几何形状和/或表面也在安装期间引起许多问题。凹部通常被加工成具有弯曲的内表面,该内表面逐渐变细为平坦的竖直表面。通过这种布置,开口逐渐从宽变窄进入凹部的深度。另一方面,每个销都加工成平底。当插入销时,除非完全对准,否则平底会撞击凹部的弯曲内表面。随着不同的表面彼此接触,过度的摩擦防止了销通过重力简单地滑入它们在凹部深度内的最终安装位置。相反,需要上述机械力来迫使销进入其最终安装位置。当施加这样的机械力时,销基本上被拖过或刮过凹部的弯曲内表面,从而产生不需要的颗粒和其他污染物。此外,如果外力突然克服摩擦力,可能会出现称为“自由落体”的情况,从而导致承载环碰撞或撞击基座。这种机械干扰可能会导致未对准问题,至少在半导体行业中,这可能是灾难性的,从而导致无法使用的集成电路和较低的产量。
因此,需要在安装期间提供平滑滑动动作、减少不需要的颗粒的产生并防止自由落体的改进的运动学安装件设计。
发明内容
本申请涉及用于将承载衬底的承载环安装到处理室内的基座的各种运动学安装件。各种运动学安装件中的每一个都在安装过程中提供平稳的滑动动作,减少不需要的颗粒的产生,并防止承载环自由落体到基座上。
更具体地,本申请涉及一种装置,其包括:处理室、具有用于在处理室内支撑衬底的表面的基座、用于在处理室内承载衬底的承载环以及用于将承载环安装在基座上并用于将衬底对准基座的表面的运动学安装件。运动学安装件包括具有弯曲表面入口轮廓的抛物线形销和具有基本上竖直的侧壁以及也可能弯曲的内表面壁的凹部。当销与运动学安装件的凹部对准并插入该凹部时,销和凹部之间的初始接触点或者在竖直侧壁,或者在弯曲的内表面壁。在任一情况下,仅重力通常足以克服摩擦力,从而使得销能滑入凹部内的安装位置,优选地无需施加外部机械力。
在一个替代实施方案中,销设置在承载环上并且凹部设置在基座上。在该实施方案的变型中,承载环包括间隔120°的三个销,并且基座包括同样各自间隔120°的三个凹部。
在另一个替代实施方案中,销设置在衬底上并且凹部设置在承载环上。在该实施方案的变体中,衬底包括间隔120°的三个销,并且承载环包括也各自间隔120°的三个凹部。
在又一实施方案中,凹部可以包括许多不同的形状,包括但不限于马蹄形或跑道。在又一些实施方案中,凹部可以是压配合、卡扣配合或以其他方式运动紧固而无需其他紧固部件。
各种运动学安装件,无论实施方案如何,每个都具有至少一个销,该销具有至少导致以下优点的优化几何形状:
(a)一种平滑的滑动动作,其使得销能在凹部内滑入最终安装位置,而无需外力;
(b)减少销和凹部表面之间的过度摩擦,从而减少颗粒和其他污染物的产生,以及
(c)防止承载环在安装过程中“自由落体”到基座上,从而减轻也可能导致错位问题的机械干扰。
附图说明
通过参考下面描述以及附图,将最好地理解本申请及其优点,其中:
图1是根据本发明的非排他性实施方案的示例性衬底处理工具的示意图。
图2是根据本发明的非排他性实施方案的用于控制衬底处理工具的系统控制器的框图。
图3A至图3C是根据本发明的非排他性实施方案的承载环和基座的各种视图。
图4是说明根据本发明的非排他性实施方案的一系列承载环销几何形状的图。
图5示出了根据本发明第一实施方案的用于运动学安装件的销凹部设计。
图6A至6C示出了根据本发明第二实施方案的用于运动学安装件的第二凹部设计。
图7示出了根据本发明第三实施方案的用于运动学安装件的第三凹部设计。
图8A和8B是根据本发明的接触运动学安装件的凹部的基本上竖直的侧壁或倾斜/弯曲的侧壁的示例性销的放大图。
在附图中,有时使用相似的附图标记来指称相似的结构元件。但应理解附图中的描绘为示意性的,且不一定按比例绘制。
具体实施方式
现在将参考如附图所示的一些非排他性的实施方案来详细描述本申请。在以下描述中,阐述了许多具体细节以便提供对本公开内容的透彻理解。然而对于本领域技术人员而言,显而易见的是可以在没有这些具体细节中的一些或全部的情况下实施本公开内容。在其他情况下,并未详细描述公知的处理步骤和/或结构,以免不必要地模糊本公开内容。
示例性PECVD工具
参考图1,图示了根据本发明的非排他性实施方案的示例性衬底处理工具10的示意图。在如下所述的该特定实施方案中,工具是等离子增强(PECVD)工具。
应该理解的是,PECVD工具10的以下描述仅仅是示例性的,并且如本文所述的各种运动学底座设计可以用于任何类型的衬底处理工具,包括但不限于任何化学气相沉积(CVD)工具、低压CVD(LPCVD)工具、高真空CVD(HVCVD)工具、远程等离子增强CVD(RPECVD)工具、原子层CVD(ALCVD)或有时称为原子层沉积(ALD)工具等。此外,如本文所述的各种运动学底座设计也可用于其他类型的工具,例如湿法或干法蚀刻工具。还应注意,本文所用的术语衬底应广义地解释为包括可在衬底处理工具内处理的任何类型的工件,例如但不限于半导体晶片、平板显示器、光电面板等.
PECVD工具10包括处理室12、喷头14、用于支撑和定位待处理的衬底18的基座16、射频(RF)发生器20和系统控制器22。
在操作期间,反应气体通过喷头14被供应到处理室12中。在喷头14内,气体通过一个或多个充气室(未示出)分配进入室12,在要处理的衬底18表面上方的一般区域中。由RF发生器20产生的RF电势被施加到喷头14上的电极(未示出)和/或基座16上的电极(也未示出)。RF电势在处理室内产生等离子体2412。在等离子体24内,激发的电子从反应气体电离或离解(即,“裂解”),从而产生化学反应性自由基。随着这些自由基反应,它们在半导体衬底18上沉积并形成薄膜。
在多种替代实施方案中,室12内的等离子体24可以是电容式或电感式产生的。在更进一步的实施方案中,RF发生器20可以是单个RF发生器或能够产生高、中和/或低RF频率的多个RF发生器。例如,在高频的情况下,RF发生器20可以产生范围从2-100MHz并且优选地13.56MHz或27MHz的频率。当产生低频时,范围是50KHz到2MHz,优选是350到600KHz。在又一些实施方案中,工具10可以是用于从衬底18蚀刻或去除材料的蚀刻工具。
系统控制器
参考图2,示出了根据本发明的非排他性实施方案的系统控制器22的框图。通常控制PEALD工具10的整体操作的系统控制器22包括一个或多个处理器25、存储器26、一个或多个存储设备28、一个或多个可移动存储设备30、一个或多个更多用户接口设备32、一个或多个显示设备34、通信接口36和通信基础设施38。
处理器25可以以多种不同形式实现,范围从一个或多个集成电路、印刷电路板、手持计算设备、个人计算机、工作站、服务器、超级计算机、计算机网络,其中任何一者都可以包括一个或多个处理器。
存储器26被提供为系统存储器并且用于多种原因,包括存储固件、代码、可执行指令和/或由一个或多个处理器25执行的其他软件。存储器26还可以操作作为在执行此类代码、固件、软件等期间存储计算数据等的可操作存储器。
在多种实施方案中,存储器26可以多种方式实现,所述方式包括寄存器、高速缓冲存储器、主存储器、随机存取存储器(RAM)、只读存储器(ROM)、瞬态、非瞬态或持久存储器、固态存储器、旋转磁盘存储器、直接附加存储装置、网络附加存储装置、一个或多个存储磁盘阵列、光学存储设备或其组合。这种存储设备不仅存储固件、代码、可执行指令和/或其他软件,而且通常在工具10的操作和控制期间由处理器25访问和使用。
类似地,存储设备28可以用于存储系统数据并且可以使用各种不同的实施方案来实现,该实施方案例如瞬态的、非瞬态的或持久的、固态存储器、旋转磁盘存储器、直接附加存储装置、网络附加存储装置、一个或多个存储磁盘阵列、光存储设备或其组合。
可移动存储设备30可以包括诸如可移动存储盘、光盘、拇指驱动器、存储器棒、USB棒等实施方案。
用户接口设备32包括能够与系统控制器22和/或工具10交互的任何类型的设备。这样的设备32可以包括键盘、触摸屏、指针、鼠标等。
显示设备34可以是能够显示信息的任何设备,例如平板显示器、CRT、打印机等。
通信接口36使得软件和数据能通过链路在系统控制器22和外部设备之间传输。该链路被布置为在处理器22和诸如另一台计算机、网络、其他工具等其他外部设备之间传送信号。可以使用电线或电缆、光纤、电话线、蜂窝电话、射频链路和/或其他通信信道来实现该链路。
通信基础设施38使得处理器22的所有上述子部件能相互通信。在多种实施方案中,通信基础设施38可以是通信总线、交叉条或网络,并且可以使用电缆布线、光纤、无线或它们的组合来实现。
如本文所使用的,术语“非瞬态计算机可读介质”通常用于指代诸如主存储器、辅助存储器、可移动存储装置和存储设备,诸如硬盘、闪存、磁盘驱动器存储器、CD-ROM和其他形式的永久存储器之类的介质,并且不得解释为涵盖临时主题,例如载波或信号。
在某些实施方案中,运行或执行系统软件或代码的系统控制器22控制工具10的所有或至少大部分活动,以实现如本文所述的一些或所有工艺,包括但不限于诸如控制机械手操作之类的活动,例如从处理室12中取出已处理的衬底18、将用于处理的新衬底18插入到处理室12中,以及将新衬底18安装到基座上,如本文详细描述的。
系统控制器22通常还负责在衬底18已被夹持到基座16之后控制处理室12内的处理操作。此类操作通常涉及处理室12内的反应物的流速、浓度和温度,RF发生器20的频率和功率、通过嵌入基座16中的加热器或冷却器对衬底的温度控制、处理室12内的压力、清扫处理室的时序等等。
运动学安装件
参考图3A至图3C,示出了承载环40和/或基座16的各种视图。
如图3A所示,示出了具有三个销42的承载环40,三个销42各自间隔120°。承载环40的中心区域44是开放的,这意味着当承载环40用于将衬底18对准和安装到基座16上时,衬底18的有源表面基本上保持暴露在处理室12内。
在图3B中,承载衬底18的承载环40位于基座16的顶表面16A上方。承载环40根据需要旋转,使得三个销42与在基座16的顶表面16A中形成的三个凹部46对准。当承载环40被降低到适当的位置,并且三个销42被插入凹部46中时,衬底18和承载环40被对准并安装到基座16的表面16A上。
如图3C所示,示出了安装环40上的销42中的一个的特写视图。如下文更详细描述的,销42具有优化的几何形状或优化的几何形状范围,其在插入相应凹部46的内弯曲壁并与其接触时,产生平滑的滑动动作。这种滑动动作提供许多优点,包括(a)使得销42仅通过重力平稳地滑入凹部46内的最终安装位置,从而消除了将销推入到合适位置所需要的外部机械力,(b)减少摩擦,这消除或减轻了颗粒的产生,并且(c)防止或减轻了“自由落体”,这可能导致衬底未对准问题。
销几何形状
参考图4,图示了说明根据本发明的非排他性实施方案的销42的几何形状范围。特别地,五(5)个特定的销几何形状被显示并标记为“Geo 1”到“Geo 5”。在每种情况下,Geo 1到Geo 5的销几何形状都是抛物线形状。
每个销几何形状共享许多共同特征,包括:
(i)在所示的特定实施方案中具有X英寸半径的底座50。底座50限定了销42连接到另一个物体的位置。如上所述,另一个物体可以是承载环40,或者替代地如下面另一个实施方案中所述,也可以是基座16。在多种实施方案中,X的值可以从0.01到0.2变化,具体取决于销42的构造
和/或与销连接的其他物体;
(ii)具有Y英寸高度的延伸部分52。销42的总长度由延伸部分加上图4中为Geo1(A)至Geo5(E)中的每一个提供的插入长度尺寸限定。在多种实施方案中,插入长度尺寸可以在0.1英寸或更小到0.25英寸或更大的范围内;以及
第二半径54定义了销的插入凹部46中的部分的半径Z。在图4所示的实施方案中,对于每个Geo1(A)至Geo5(E),Z的值可以相同或者不同。替代地,针对Geo1(A)到Geo5(E)中的每个,Z的值可以不同。在多种实施方案中,Z的值可以在0.1到0.3英寸的范围内,同样取决于销42的构造。
以上定义的几何形状范围提供了优于当前已知的平底销设计的优点。对于现有的销,初始接触通常是平坦的表面撞击凹部内的弯曲表面。不同表面之间的摩擦力通常太高,仅靠重力就无法让销简单地落入它们的最终安装位置。结果,通常需要施加的外部机械力来迫使销进入凹部的深度内的最终安装位置。如上所述,由于过度摩擦以及机械干扰,使用这种外力会导致颗粒产生。
另一方面,如图所示的销42的每个几何形状(Geo1到Geo5)限定了具有弯曲表面的抛物线形入口轮廓。结果,销42和凹部46的内壁之间的初始接触或者是(i)销42的弯曲表面接触凹部46的基本上竖直的侧壁表面,或者是两个弯曲表面中的一个与另一个相互作用,或(ii)销42的弯曲表面接触凹部46的另一个弯曲表面。通过至少一个弯曲表面,在接触点处的摩擦较小。结果,仅重力通常足以允许销42平滑地滑入它们在凹部46内的最终安装位置。注意,虽然通常优选不使用外力,但是使用这样的外力不排除在本发明的范围之外。相反,如果需要或以其他方式期望,本文所述的任何运动学安装件都可以与外力一起使用。
因此,销42的弯曲进入轮廓提供了几个优点,包括(a)减少摩擦,从而消除或减少颗粒产生,(b)消除在大多数情况下为了将销42完全插入到凹部46内的最终安装位置而对施加外力的需要,(c)提供平滑的滑动相互作用,其使得销能仅通过重力滑入最终安装位置,并且(d)减轻或消除机械干扰。
各个几何形状Geo1至Geo5展示了基于有限分析测量的不同操作特性。由于重力克服了摩擦,所有五个几何形状都表现出运动。结果,所有五个几何形状在插入凹部46时提供平滑运动。此外,具有较陡曲线的几何形状(例如,几何形状3、几何形状4和几何形状5,其中几何形状5最陡)与具有较平缓的曲线的那些几何形状(例如Geo1和Geo2)相比表现出较小的摩擦力。因此,相对于更平缓的弯曲几何形状,更陡峭的弯曲几何形状导致接触时间减少。因此,作为一般规则,具有更陡曲线的销几何形状提供摩擦更小、接触时间更短和滑动操作更平稳的优点,所有这些都等同于更少的颗粒产生和更少的机械干扰,包括自由落体。然而,应注意,具有非常陡峭的曲线的销可能并不总是理想的。对于非常陡峭的表面,销可能会表现出非常高的接触应力,因此通常应该避免使用。
应注意,本文提供的销42的尺寸仅仅是示例性的。尺寸50、52和54中的任何一者都可以在半径和/或高度上有很大的变化。此外,销42的插入长度和/或曲线的斜率也可以从一种应用到下一种应用广泛地变化。例如,销42可具有半径X、半径Z、高度Y和插入长度(A)至(E),其小于或大于本文提供的长度。因此,本文提供的具体示例和/或尺寸应被认为是说明性的,而不是在任何方面进行限制。相反,销42的尺寸和半径可以比这里提到的更小或更大和/或更短或更长,并且从一种工具到另一种工具可以变化很大。
销凹部的实施方案
图5示出了根据第一实施方案的用于运动学安装件的第一销凹槽设计。对于该实施方案,销42压配合、卡扣配合或以其他方式嵌入到基座16中并从表面16A向上突出。在所示的特定实施方案中,承载环40包括具有基本上竖直的侧壁50的方形凹部46。还应注意的是,在该实施方案中,承载环40的与销42插入位置相对的表面被覆盖,这防止处理室中的等离子体和/或颗粒进入凹部46。在该实施方案中,承载环40被对准,使得凹部46与基座16中的销42对准。然后将承载环40降低到合适位置。如果两者没有完全对准,抛物线形销42的弯曲表面通常将首先接触凹部的竖直侧壁50中的一个。由于销42的弯曲表面,与具有平坦接触表面的销相比摩擦较小,因此,环40通常会滑入到合适位置。
图6A和6B示出了根据第二实施方案的另一个运动学安装件的凹部46的另一种设计。在该实施方案中,凹部46为马蹄形,设置在基座16的边缘或周边,并且可以通过基座侧面压配合、卡扣配合或滑入到合适位置并与顶表面16A齐平。
如图6B最佳地示出的,凹部46包括逐渐过渡到竖直侧壁表面54的弯曲或倾斜侧壁52。通过这种布置,抛物线形销42的弯曲表面(i)在两者几乎完全对准的情况下,将首先接触竖直侧壁表面54或(ii)在两者稍微未对准的情况下,将首先接触弯曲表面52。在任一种情况下,销42的弯曲表面减少了表面摩擦,从而使得销42在凹部46内能滑进或滑入到合适位置。
在该实施方案的变体中,如图6C所示,陶瓷或金属球62等可用于将凹部46锁定在基座16的主体内的适当位置。还有凹口64(图6A)和/或凹槽66(图6C)可用于将凹部46卡扣配合或压配合到基座16主体内的适当位置。当凹口64和/或凹槽用于将凹部46锁定在适当位置时,基座16被修改为包括配合特征以使得凹部46能被压配合和/或卡扣配合到合适位置。
图7示出了根据第三实施方案的另一种凹槽设计。在这种情况下,凹部46是跑道形的并且被压配合和/或卡扣配合到基座16的顶表面16A中。类似于图6A-图6C中所示的实施方案,跑道形凹部46包括内表面52和54,并且在插入销42时以与上述方式类似的方式操作。
在图5、6A-6C和7所示的每个实施方案中,为了简单起见,仅示出了单个销-凹部对。应当理解,对于每个实施方案,通常使用总共三个销-凹部对,每对间隔120°。然而,应当理解,可以使用任意数量的销-凹部对,包括少于或多于三对。因此,本发明不应限于使用任何特定数量的销-对。
还应注意,至少图5、6A-6C和7的实施方案是运动学设计,这意味着它们无需其他紧固部件,例如螺钉、螺栓等,即可自紧固到基座上.
如上所述,在安装操作期间,承载环40旋转,使得销42与凹部46对准。然后承载环40下降到合适位置。销42与凹部46的内侧壁的第一次接触的位置可以变化,具体取决于对准的精度水平。如果完全对准,则销42将被接收到凹部46中,与凹部46的内侧壁的接触最小或不接触。另一方面,即使存在轻微程度的未对准,销的第一接触点42很可能是凹部42的内侧壁接触。图8A和图8B描绘了这种情况的不同程度。
参考图8A和8B,示出了抛物线形销42接触图6A-6C或图7中描绘的任何运动学安装件的凹部46的基本竖直的侧壁54和倾斜/弯曲的侧壁52的放大图。
在图8A中,销42与凹部46稍微不对准。因此,销42在凹部46内的初始接触56是沿着凹部46的竖直侧壁54中的一者。
另一方面,在图8B中,销42和凹部之间的对准偏移较大程度。结果,销42在凹部46内的初始接触点58位于倾斜表面52上。
对于图8A或图8B中的任一情况,抛物线形销42的弯曲表面减少了接触点处的摩擦。在任一情况下,通常仅重力就足以克服摩擦力,优选地无需施加外部机械力。结果,(a)平滑的滑动动作将使得销42能在凹部46内滑动到合适位置,(b)由于两个表面之间的摩擦较小,因而减少了颗粒的产生,以及(c)平滑的滑动动作防止了承载环40“自由落体”到基座16,从而减少了机械干扰。
应注意,尽管上述讨论特定于具有位于承载环40上的销42和位于基座16上的凹部46,但是相同的构思适用于相反的布置。换言之,对于销42位于基座16上且凹部46位于环40上的实施方案(例如,图5),适用上述类似原理。也就是说,抛物线形销42的弯曲表面将首先接触凹部的内侧壁,该内侧壁可以是基本上竖直的或倾斜的,以促进将销定位到其最终插入位置的平滑、滑动动作。
虽然此处仅详细描述几个实施方案,但是应当理解的是,本申请可以在不脱离本文所提供的公开内容的精神或范围的情况下以许多其他形式来实现。因此,本实施方案应被认为是说明性的而不是限制性的,且不限于此处所给出的细节,而是可以在所附权利要求的范围和等同方案中进行修改。
Claims (29)
1.一种装置,其包括:
处理室;
基座,其具有用于在所述处理室内支撑衬底的表面;
承载环,其用于在所述处理室内承载所述衬底;以及
运动学安装件,其用于将所述承载环安装到所述基座上并且将所述衬底对准到所述基座的所述表面上,所述运动学安装件包括:
具有内表面的凹部,所述凹部设置在所述基座或所述承载环的所述表面内;以及
销,其被布置成当将所述承载环安装到所述基座上时插入所述凹部,所述销被布置成具有弯曲表面,当所述销被插入所述凹部时,所述弯曲表面与所述凹部的所述内表面接触。
2.根据权利要求1所述的装置,其中,所述销的所述弯曲表面和所述凹部的所述内表面相对于彼此相互作用,使得所述重力足以克服摩擦力,从而使得所述销能滑入所述凹部内的安装位置。
3.根据权利要求1所述的装置,其中,所述销的所述弯曲表面和所述凹部的所述内表面相对于彼此相互作用以将所述销引导到所述凹部内的安装位置。
4.根据权利要求1所述的装置,其中,所述销的所述弯曲表面和所述凹部的所述内表面相对于彼此相互作用,使得不需要外部机械力来将所述销定位到所述凹部内的安装位置。
5.根据权利要求1所述的装置,其中,所述销的所述弯曲表面相对于所述凹部的所述内表面限定斜率,使得重力足以克服摩擦力,从而使得所述销能滑入所述凹部内的安装位置。
6.根据权利要求1所述的装置,其中,所述销设置在所述承载环上并且所述凹部设置在所述基座上。
7.根据权利要求5所述的装置,其还包括在所述承载环上的三个销和在所述基座上的三个凹部,其中所述三个销和所述三个凹部各自分别隔开120°。
8.根据权利要求1所述的装置,其中,所述销设置在所述基座上并且所述凹部设置在所述承载环上。
9.根据权利要求7所述的装置,其还包括在所述基座上的三个销和在所述承载环上的三个凹部,其中所述三个销和所述三个凹部各自分别隔开120°。
10.根据权利要求7所述的装置,其中,所述凹部的与所述销插入的位置相对的表面被覆盖以防止等离子体和/或颗粒进入所述凹部。
11.根据权利要求1所述的装置,其中,所述凹部是马蹄形的。
12.根据权利要求1所述的装置,其中,所述凹部是跑道形的。
13.根据权利要求1所述的装置,其中,所述凹槽被压配合到所述基座中。
14.根据权利要求1所述的装置,其中,所述凹部卡扣配合到所述基座中。
15.根据权利要求1所述的装置,其中,所述凹部被运动地紧固到所述基座而不需要其他紧固部件。
16.根据权利要求1所述的装置,其中,所述销由氧化铝(Al2O3)制成。
17.根据权利要求1所述的装置,其中,所述基座由陶瓷制成。
18.根据权利要求1所述的装置,其中,所述销具有范围从0.05到0.3英寸的插入长度。
19.根据权利要求1所述的装置,其中,所述销具有范围从0.1到0.3英寸的半径。
20.根据权利要求1所述的装置,其中,所述销的形状为抛物线形。
21.根据权利要求1所述的装置,其中,所述凹部的所述内表面其特征在于以下一者:
(a)基本上竖直的侧壁;或者
(b)向所述基本上竖直的侧壁逐渐变细的内部弯曲的壁。
22.一种用于将衬底承载环安装到衬底处理工具的处理室内的基座的运动学安装件,所述运动学安装件包括设计成压配合或卡扣配合到所述基座的表面中的凹部。
23.根据权利要求22所述的运动学安装件,其中,所述凹部是马蹄形的。
24.根据权利要求22所述的运动学安装件,其中,所述凹部是跑道形的。
25.根据权利要求22所述的运动学安装件,其中,所述凹部限定了基本上竖直的内表面壁。
26.根据权利要求22所述的运动学安装件,其中,所述凹部还限定内部倾斜的侧壁,所述侧壁逐渐变细到基本上竖直的所述内表面壁。
27.根据权利要求22所述的运动学安装件,其还包括以下一者以促进所述凹部卡扣配合或压配合到所述基座的所述表面中:
(a)凹口
(b)凹槽;或者
(c)(a)和(b)两者。
28.根据权利要求22所述的运动学安装件,其中,所述凹部还被布置成滑入所述基座的侧壁中,使得所述凹部设置在所述基座的所述表面内。
29.根据权利要求22所述的运动学安装件,其中,所述凹部还布置成接收抛物线形销。
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