TW559582B - Device and method for polishing, and method and device for manufacturing semiconductor device - Google Patents

Device and method for polishing, and method and device for manufacturing semiconductor device Download PDF

Info

Publication number
TW559582B
TW559582B TW090131793A TW90131793A TW559582B TW 559582 B TW559582 B TW 559582B TW 090131793 A TW090131793 A TW 090131793A TW 90131793 A TW90131793 A TW 90131793A TW 559582 B TW559582 B TW 559582B
Authority
TW
Taiwan
Prior art keywords
honing
semiconductor wafer
edge portion
drum
edge
Prior art date
Application number
TW090131793A
Other languages
English (en)
Chinese (zh)
Inventor
Shigeto Izumi
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000388216A external-priority patent/JP4826013B2/ja
Priority claimed from JP2000392930A external-priority patent/JP4655369B2/ja
Application filed by Nikon Corp filed Critical Nikon Corp
Application granted granted Critical
Publication of TW559582B publication Critical patent/TW559582B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
TW090131793A 2000-12-21 2001-12-21 Device and method for polishing, and method and device for manufacturing semiconductor device TW559582B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000388216A JP4826013B2 (ja) 2000-12-21 2000-12-21 研磨装置、半導体ウェハの研磨方法、半導体デバイスの製造方法及び製造装置
JP2000392930A JP4655369B2 (ja) 2000-12-25 2000-12-25 研磨装置、研磨方法及び半導体デバイスの製造方法

Publications (1)

Publication Number Publication Date
TW559582B true TW559582B (en) 2003-11-01

Family

ID=26606231

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090131793A TW559582B (en) 2000-12-21 2001-12-21 Device and method for polishing, and method and device for manufacturing semiconductor device

Country Status (2)

Country Link
TW (1) TW559582B (ja)
WO (1) WO2002049802A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102837237A (zh) * 2011-06-24 2012-12-26 柯马杜股份有限公司 用于加工斜面的系统
TWI584914B (zh) * 2013-07-22 2017-06-01 佳能股份有限公司 元件製造方法及拋光裝置
TWI702113B (zh) * 2016-02-12 2020-08-21 日商荏原製作所股份有限公司 基板保持模組、基板處理裝置、及基板處理方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108214175A (zh) * 2016-12-12 2018-06-29 广东科达洁能股份有限公司 一种高精度自动推砖装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3109419B2 (ja) * 1995-08-24 2000-11-13 信越半導体株式会社 ウェーハの加工方法
JPH09300196A (ja) * 1996-05-17 1997-11-25 Sanshin Kogyo Kk ベルト研磨機
JP3389014B2 (ja) * 1996-07-15 2003-03-24 ニトマック・イーアール株式会社 円盤状半導体ウェーハ面取部のミラー面取加工方法
JPH11221744A (ja) * 1998-02-09 1999-08-17 Mitsubishi Materials Corp 半導体ウェーハの面取り面研磨装置
JP3664593B2 (ja) * 1998-11-06 2005-06-29 信越半導体株式会社 半導体ウエーハおよびその製造方法
JP2000141190A (ja) * 1998-11-11 2000-05-23 Speedfam-Ipec Co Ltd エッジポリッシング装置及びエッジポリッシング方法
JP3320674B2 (ja) * 1999-04-30 2002-09-03 システム精工株式会社 ワーク外周の研磨方法および研磨装置
JP2002036079A (ja) * 2000-07-26 2002-02-05 Speedfam Co Ltd 被研磨物の研磨方法及び研磨装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102837237A (zh) * 2011-06-24 2012-12-26 柯马杜股份有限公司 用于加工斜面的系统
CN102837237B (zh) * 2011-06-24 2016-11-16 柯马杜股份有限公司 用于加工斜面的系统
TWI584914B (zh) * 2013-07-22 2017-06-01 佳能股份有限公司 元件製造方法及拋光裝置
US10052737B2 (en) 2013-07-22 2018-08-21 Canon Kabushiki Kaisha Component manufacturing method and polishing apparatus
TWI702113B (zh) * 2016-02-12 2020-08-21 日商荏原製作所股份有限公司 基板保持模組、基板處理裝置、及基板處理方法

Also Published As

Publication number Publication date
WO2002049802A1 (fr) 2002-06-27

Similar Documents

Publication Publication Date Title
JP5004059B2 (ja) 枚葉式基板研磨装置
JP5279463B2 (ja) 枚葉式基板処理装置及び方法
US20150151398A1 (en) Polishing apparatus and polishing method
TWI604922B (zh) 研磨裝置及研磨方法
EP0953409A2 (en) Wafer surface machining apparatus
US20120252320A1 (en) Polishing apparatus and polishing method
JP2004517479A (ja) 表面積を減じた研磨パッドと可変式部分的パッド−ウェーハ・オーバラップ技法を用いて半導体ウェーハを研磨し平坦化するためのシステム及び方法
JP4871617B2 (ja) ウエーハの加工方法
US10376929B2 (en) Apparatus and method for polishing a surface of a substrate
JP7009128B2 (ja) 基板処理装置、基板処理方法及び記憶媒体
JP5037974B2 (ja) 研磨加工ステージにおける半導体基板の監視機器および監視方法
JP2006319249A (ja) 研磨装置、この研磨装置を用いた半導体デバイス製造方法及びこの製造方法により製造された半導体デバイス
TWI788454B (zh) 基板處理裝置及基板處理方法
TW559582B (en) Device and method for polishing, and method and device for manufacturing semiconductor device
JP6345988B2 (ja) 基板処理装置
TWI393182B (zh) 化學機械拋光（ｃｍｐ）設備以及用於在基底上進行化學機械拋光（ｃｍｐ）的方法
JP2003188125A (ja) ポリッシング装置
KR102628175B1 (ko) 기판 처리 장치 및 기판 처리 방법
JP4826013B2 (ja) 研磨装置、半導体ウェハの研磨方法、半導体デバイスの製造方法及び製造装置
JP2002270554A (ja) Ｃｍｐ装置及び研磨パッドの掃除方法
JPH11135463A (ja) 処理装置及びその方法
JP4754870B2 (ja) 研磨装置
JP2006245410A (ja) 化学機械研磨方法および化学機械研磨装置
JP4655369B2 (ja) 研磨装置、研磨方法及び半導体デバイスの製造方法
WO2022149346A1 (ja) 基板処理装置および基板処理方法

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent