TWI702113B - 基板保持模組、基板處理裝置、及基板處理方法 - Google Patents

基板保持模組、基板處理裝置、及基板處理方法 Download PDF

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TWI702113B
TWI702113B TW106103944A TW106103944A TWI702113B TW I702113 B TWI702113 B TW I702113B TW 106103944 A TW106103944 A TW 106103944A TW 106103944 A TW106103944 A TW 106103944A TW I702113 B TWI702113 B TW I702113B
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substrate
cover
substrate holding
holding module
base
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TW201733739A (zh
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谷澤昭尋
小林賢一
赤澤賢一
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日商荏原製作所股份有限公司
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
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    • B24B37/34—Accessories
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
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Abstract

本發明提供一種存取自由度較高的基板保持模組。提供一種能夠接收由搬送機器人搬送的基板的基板保持模組。該基板保持模組具有：底座，所述底座具有用於保持基板的保持機構；罩，所述罩用於覆蓋所述底座；及移動機構，所述移動機構使所述罩以離開所述底座的方式移動。

Description

基板保持模組、基板處理裝置、及基板處理方法
本發明涉及基板保持模組、基板處理裝置及基板處理方法。
作為基板處理裝置，已知使半導體晶片的表面平坦化的半導體研磨裝置。另外，已知對半導體晶片的背面進行研磨的背面研磨裝置(例如專利文獻1)。在這些基板處理裝置中，在基板的研磨處理及研磨後的清洗處理的中途，有時使用暫時地保持基板的臨時放置台(基板保持模組)。另外，當在搬送基板的多個機器人之間交接基板時，有時將基板暫時地配置于臨時放置台，而在不同的機器人之間交接基板。
【先前技術文獻】 【專利文獻】
[專利文獻1]日本特開2014-150178號公報
[專利文獻2]日本特開2004-327519號公報
[專利文獻3]日本特開2000-294616號公報
作為以往的基板臨時放置台，具有通過外殼包圍周圍而單元化了的基板臨時放置台(例如專利文獻2、專利文獻3)。在這樣的基板臨時放置台中，在外殼的特定的場所形成有用於基板的存入取出的開口部。因此，用於存入取出基板的搬送機器人的手臂的進入路徑限定於固定的方向。另外，有時也設有用於對基板臨時放置台的外殼的開口部進行開閉的閘門。當在基板臨時放置臺上存在多個用於存入取出基板的開口部的情況下，對各開口部分別設置閘門。因此，基板臨時放置台的構造變得複雜，另外尺寸變大。
本發明至少部分地解決上述課題的至少一部分。
根據第一實施方式，提供一種能夠接收由搬送機器人搬送的基板的基板保持模組。該基板保持模組具有：底座，所述底座具有用於保持基板的保持機構；罩，所述罩用於覆蓋所述底座；及移動機構，所述移動機構使所述罩以離開所述底座的方式移動。
根據第二實施方式，在第一實施方式的基板保持模組中，所述基板保持模組具有用於使所述底座旋轉的回轉機構。
根據第三實施方式，在第一或第二實施方式的基板保持模組中，所述保持機構具有基板保持銷。
根據第四實施方式，在第一至第三中的任一個實施方式的基板保持模組中，所述基板保持模組具有噴嘴，所述噴嘴用於在基板被保持於所述保持機構的狀態下，向基板一面或兩面供給液體。
根據第五實施方式，在第四實施方式的基板保持模組中，所 述基板保持模組具有用於排出液體的排液機構。
根據第六實施方式，提供一種基板處理裝置。該基板處理裝置具有：第一至第五中的任一個實施方式的基板保持模組；及多個機器人，所述多個機器人用於向所述基板保持模組搬送基板。
根據第七實施方式，提供一種基板處理方法。該基板處理方法具有如下的工序：打開基板保持模組的罩的工序；將基板放置於在所述罩內配置的基板保持銷上，並關閉所述罩的工序；及打開所述罩，並將配置在所述基板保持銷上的基板向下一個工序搬送的工序。
根據第八實施方式，在第七實施方式的基板處理方法中，該基板處理方法具有如下的工序：檢測在所述基板保持模組內是否存在基板的工序；及在所述基板保持模組的罩關閉後，向所述基板的正面及/或背面供給液體的工序。
104:搬送機器人
106:搬送機器人
500:臨時放置台(基板保持模組)
502:底部件
504:底面
506:側壁
508:底座
510:回轉機構
512:銷
514:上側罩
516:移動機構
518:檢測機構
520:噴嘴
1000:背面研磨裝置
圖1是一實施方式的基板處理裝置的概略俯視圖。
圖2是表示一實施方式的基板保持模組的結構的圖。
以下，與附圖一起對具備本發明的基板保持模組的基板處理裝置的實施方式進行說明。在附圖中，對於相同或類似的要素附以相同或類似的參照符號，在各實施方式的說明中有時省略關於相同或類似的要素的重複的說明。另外，在各實施方式所示的特徵只要不相互矛盾，也能夠適用於其他實施方式。
<基板處理裝置>
圖1是作為基板處理裝置的一例的背面研磨裝置1000的俯視圖。背面研磨裝置1000是對半導體基板WF的背面進行研磨的裝置。此外，在本說明書中，基板的背面是形成器件及配線(電路)的正面的相反側的面。背面研磨裝置1000具備：裝載/卸載單元200、邊緣研磨單元300、背面研磨單元350、背面清洗單元400及正面清洗單元450。另外，背面研磨裝置1000具備供給成為這些單元的各種動作的動力源的電源的電源板600、及用於控制這些單元的各種動作的控制單元(未圖示)。以下，沿著背面研磨裝置1000內的基板的次序，對裝載/卸載單元200、邊緣研磨單元300、背面研磨單元350、背面清洗單元400及正面清洗單元450進行說明。
<裝載/卸載單元>
裝載/卸載單元200是在FOUP與處理單元之間搬送基板WF的單元。裝載/卸載單元200具備多個(在本實施方式中為4台)前裝載部220。在前裝載部220上分別搭載有用於存儲基板WF的盒。
裝載/卸載單元200具備搬送機器人102。搬送機器人102將進行研磨及清洗等處理之前的基板WF從前裝載部220的盒取出並放置于臨時放置台702。
<邊緣研磨單元>
放置于臨時放置台702的基板WF通過搬送機器人104經由移載機302而向邊緣研磨單元300交付。邊緣研磨單元300是對基板WF的周緣部(包括外周邊緣區域)進行研磨的裝置。邊緣研磨單元300使用研磨帶來對基板WF的周緣部進行研磨。此外，圖1的背面研磨裝置1000具備2台邊緣研磨單元300，但作為其他實施方式能夠具備任意數量的邊緣研磨單元300。 通過邊緣研磨單元300而對基板周緣部進行了研磨後的基板WF再次被搬送機器人104接收，並通過搬送機器人104配置于臨時放置台(基板保持模組)500。後述臨時放置台500的詳細構造。
<背面研磨單元>
放置于臨時放置台500的基板WF在通過搬送機器人106使基板WF翻轉後，向背面研磨單元350交付。背面研磨單元350是對基板WF的背面進行研磨的單元。對於保持於載物台的基板WF，背面研磨單元350使用保持研磨帶的背面研磨頭352來對基板WF的背面進行研磨。此外，圖1的背面研磨裝置1000具備2台背面研磨單元350，但作為其他實施方式能夠具備任意數量的背面研磨單元350。
<背面清洗單元>
當背面研磨結束時，搬送機器人106再次從背面研磨單元350接收基板WF。搬送機器人106將接收到的基板WF配置於未圖示的臨時放置台，搬送機器人108接收基板WF，並將基板WF交付給2台背面清洗單元400中的任一個。背面清洗單元400是對基板的背面進行清洗的單元。作為一實施方式，背面清洗單元400能夠設為如下筆形清洗單元：將旋轉的筆形海綿402按壓於基板的背面並沿著基板WF的半徑方向擺動，由此對基板WF進行清洗。此外，在背面清洗單元400中設有雙流體噴嘴，該雙流體噴嘴向基板的背面噴射由液體(例如純水)和氣體的混合流體構成的雙流體噴流來清洗基板WF。此外，圖1的背面研磨裝置1000具備2台背面清洗單元400，但作為其他實施方式能夠具備任意數量的背面清洗單元400。
<正面清洗單元>
當基板WF的背面清洗結束時，搬送機器人108再次從背面清洗單元400接收基板WF，並將基板WF配置於未圖示的臨時放置台。然後，搬送機器人106從臨時放置台接收基板WF，使基板WF的面翻轉後，將該基板WF配置于臨時放置台704。臨時放置台704配置于臨時放置台500的下側。此外，臨時放置台500與臨時放置台704彼此獨立地設置。通過搬送機器人110接收配置于臨時放置台704的基板WF，進一步將基板WF向搬送機器人112交付，然後基板WF被交付到第一正面清洗單元450a。第一正面清洗單元450a能夠設為如下輥清洗單元：向基板WF的正面供給清洗液，並且將旋轉的海綿輥452按壓於基板WF的正面，由此對基板WF的正面進行清洗。由第一正面清洗單元450a清洗後的基板WF通過搬送機器人112向第二正面清洗單元450b交付。第二正面清洗單元450b能夠與第一正面清洗單元450a相同地設為輥清洗單元。由第二正面清洗單元450b清洗後的基板WF通過搬送機器人110向第三正面清洗單元450c交付。第三正面清洗單元450c能夠設為與背面清洗單元400類似的筆形清洗單元。
由第三正面清洗單元450c清洗後的基板WF通過搬送機器人114向乾燥單元800交付。乾燥單元800對清洗後的基板WF進行乾燥。由乾燥單元800乾燥後基板WF被搬送機器人102接收，並使其返回前裝載部220。
<臨時放置台的詳細構造>
以下，對臨時放置台500(基板保持模組)的詳細構造進行說明。以下所說明的臨時放置台500是在圖1所示的背面研磨裝置1000中，在通過搬送機器人104接收了結束了由邊緣研磨單元300進行的周緣部的研磨的基板WF後，配置基板WF的臨時放置台500。
圖2是概略地表示一實施方式的臨時放置台500的構造的立體圖。如圖2所示，臨時放置台500具有底部件502。底部件502具有底面504及對底面504的外周進行包圍的側壁506。在底面504的上側配置有底座508。底座508被回轉機構510支承為能夠旋轉。回轉機構510能夠由電動機及旋轉軸等構成。在底座508上安裝有4根銷512作為用於保持基板的保持機構。如圖2所示，基板WF由4根銷支承基板WF的外周部。在圖2所示的臨時放置台500中，銷為4根，但只要是3根以上的銷，則能夠使用任意數量的銷。或者，作為其他實施方式，也能夠使用銷以外的構造作為基板的保持機構。銷512能夠設為樹脂制的，例如能夠由PEEK、PTFE、PVC等形成。
圖2所示的臨時放置台500能夠從圖1所示的搬送機器人104、106進行存取，這些搬送機器人104、106能夠將基板WF配置于臨時放置台500，另外，這些搬送機器人104、106能夠從臨時放置台500接收基板。
圖2所示的臨時放置台500具有上側罩514。上側罩514構成為能夠完全覆蓋底座508。另外，上側罩514能夠由具有耐化學性的材料，例如PVC樹脂等構成。上側罩514連結於移動機構516，能夠相對於底部件502及底座508進行移動。移動機構516能夠設為使用氣缸的空氣壓力式的移動機構。上側罩514在完全覆蓋底座508的狀態下，在底部件502的側壁506的內側與底面504接觸。其中，上側罩514的下緣部浸入由側壁506與底面504包圍的部分所收納的液體，由此能夠在不使上側罩514完全與底部件502的底面504接觸的情況下，將臨時放置台500構成為液體密封。通過這樣構成上側罩514，從而在對基板WF供給藥液時等，由底部件502的側壁506與上側罩514包圍的空間作為存水彎發揮作用，能夠在臨時放置台500內的底面 存積液體。存積於底面的液體能夠通過後述的排出機構而從臨時放置台500排出。因此，能夠防止在臨時放置台500的內部使用的液體向臨時放置台500的外部飛散。另外，在不想將向基板WF供給的藥液向系統外排出等需要提高臨時放置台500的氣密性的情況下，在上側罩514與底部件502接觸的部分設置橡膠墊等密封部件，也能夠構成為通過上側罩514對臨時放置台500的內部進行密封。另一方面，上側罩514在通過移動機構516而移動至上方的狀態下，使銷512完全露出，從而搬送機器人104、106能夠對基板WF進行存取。上側罩514不限定於圖2所示的圓筒形，也可以是例如長方筒體等其他形狀。
另外，在使上側罩514向臨時放置台500內的底面附近移動時，例如在將基板WF載置在臨時放置台500的上方並通過銷512進行保持後，在如後述那樣檢測出存在基板WF的基礎上，能夠相對於底部件502及底座508開始移動，使上側罩514移動至第一位置(例如比底座508靠下、且從底面504向上大致1cm~3cm左右的位置)並暫時停止(包括實質上停止)然後移動到作為底面附近的位置的第二位置。通過這樣，從而在上側罩514移動至底面504附近時，能夠避免積存於底面504的液體飛散。或者，在第一位置不使上側罩514停止，而使上側罩514以比較大的速度即第一速度移動至第一位置後，以比第一速度小的速度即第二速度移動至第二位置，由此能夠避免處於底面504的液體飛散。
圖2所示的臨時放置台500能夠具備用於檢測有無基板WF的檢測機構518。檢測機構518能夠採用光學式的檢測機構等任意的結構。另外，臨時放置台500具備用於向被保持的基板WF的正面及/或背面供給液體 的噴嘴520。圖示的噴嘴520在夾緊基板WF的位置的上方與夾緊基板WF的位置的下方分別各設置1個。但是，作為其他實施方式，可以在夾緊基板的位置的上方和下方分別設置多個噴嘴，也可以僅在上方及下方中的任一方設置噴嘴。另外，也可以使上方及下方的噴嘴的數量不同。噴嘴520與用於供給純水及藥液那樣的各種液體的配管連接。能夠從配置于臨時放置台500的噴嘴520向基板WF供給液體，因此能夠防止處理中的基板WF乾燥。此外，臨時放置台500設有未圖示的排液機構及排氣機構。作為排液機構，通過在底面504設置排水口(未圖示)，從而能夠將從噴嘴520向基板WF的面上供給的液體向外部排出。此外，作為一實施方式，使噴嘴520能夠進行移動，另外，能夠控制從噴嘴520噴射的液體的流量。在這樣的情況下，在臨時放置台500內沒有基板WF時，能夠包括上側罩514及銷512在內地對臨時放置台500的內部整體進行清洗，並從底面504的排水口排出清洗後的排液。另外，通過在臨時放置台500上設置排氣機構，從而能夠更有效地防止處於臨時放置台500上的基板的污染。
上述實施方式的臨時放置台500能夠通過上側罩514而使配置的基板WF完全露出。因此，與在外殼的特定的場所形成有基板的存入取出用的開口部的臨時放置台不同，搬送機器人的手臂能夠從所有的方向存取基板。搬送機器人的手臂的存取方向具有自由度，因此多個機器人手臂能夠對臨時放置台進行存取，不需要考慮機器人手臂的存取方向而設置與各搬送機器人對應的臨時放置台，能夠有效地利用基板處理裝置整體的空間。另外，配置對基板WF進行保持的銷512的底座508能夠旋轉，所以能夠使銷512旋轉至不與搬送機器人104、106的手臂產生干擾的位置。因此，搬 送機器人對於基板WF的存取方向的自由度進一步增加。另外，能夠通過上側罩514完全覆蓋基板WF，因此能夠防止從位於夾緊基板WF的位置的上方的噴嘴520供給的液體飛散。另外，通過將用於向基板WF供給液體的噴嘴520設置于臨時放置台，而能夠更有效地防止放置于臨時放置台的基板的乾燥。
作為其他實施方式，能夠設為從上述實施方式的臨時放置台500中省略了回轉機構的臨時放置台。若搬送機器人的存取方向不與臨時放置台的銷產生干擾，則並非一定需要回轉機構。另外，作為其他實施方式，若不需要將基板WF保持為潮濕狀態，則能夠設為從上述實施方式的臨時放置台500中省略了供給液體的噴嘴520的臨時放置台。
上述臨時放置台500是圖1所示的背面研磨裝置1000中的1個臨時放置台500，但其他臨時放置台702、704的臨時放置台也可以設為相同的結構。其他臨時放置台702、704也可以是與上述臨時放置台500不同的結構，可以設為與以往使用的任意的臨時放置台。
另外，上述臨時放置台500未必在背面研磨裝置中使用，也能夠在如斜角式研磨裝置、CMP裝置、基板電鍍裝置那樣的其他基板處理裝置中使用。
500:臨時放置台(基板保持模組)
502:底部件
504:底面
506:側壁
508:底座
510:回轉機構
512:銷
514:上側罩
516:移動機構
518:檢測機構
520:噴嘴
WF:基板

Claims (11)

  1. 一種基板保持模組，該基板保持模組能夠接收由搬送機器人搬送的基板，所述基板保持模組具有：底座，所述底座具有用於保持所述基板的保持機構；罩，所述罩用於覆蓋所述底座；移動機構，所述移動機構使所述罩以離開所述底座的方式及接近所述底座的方式移動；噴嘴，所述噴嘴用於在所述基板被保持於所述保持機構的狀態下，向所述基板一面或兩面供給液體；及底部件，所述底部件具有底面及對所述底面的外周進行包圍的側壁；其中，所述罩在覆蓋所述底座的狀態下，可在所述底部件的所述側壁的內側與所述底部件的所述底面接觸；其中，所述移動機構在所述罩覆蓋所述底座之時：(1)使所述罩移動至第一位置並暫時停止，然後移動到所述底面附近的第二位置；或(2)使所述罩以第一速度移動至第一位置後，然後以比所述第一速度小的速度作為第二速度移動到所述底面附近的第二位置。
  2. 如請求項1所述之基板保持模組，其中所述基板保持模組具有用於使所述底座旋轉的回轉機構。
  3. 如請求項1或2所述之基板保持模組，其中所述保持機構具有基板保持銷。
  4. 如請求項1所述之基板保持模組，其中所述基板保持模組具有用於排出液體的排液機構。
  5. 如請求項1所述之基板保持模組，其中：所述基板保持模組更具有檢測機構，用以檢測所述基板的有無；所述移動機構在所述檢測機構檢測到了所述基板被所述保持機構所保持後，使所述罩移動至所述第一位置。
  6. 如請求項1所述之基板保持模組，其中所述第一位置係比所述底座靠下、且從所述底面向上遠離1cm~3cm的位置。
  7. 一種基板處理裝置，其具有：請求項1~6中任一項所述的基板保持模組；及多個機器人，所述多個機器人用於向所述基板保持模組搬送所述基板。
  8. 一種基板處理方法，其具有以下工序：打開基板保持模組的罩的工序，所述基板保持模組具有底部件，所述底部件具有底面及對所述底面的外周進行包圍的側壁；將基板放置於在所述罩內配置的基板保持銷上，並藉由使所述罩移動至所述底部件的所述底面附近、或是與所述底面接觸的位置，以關閉所述罩的工序；及打開所述罩，並將配置在所述基板保持銷上的所述基板向下一個工序搬送的工序；其中，所述關閉所述罩的工序係具有以下工序：(1)使所述罩移動至第一位置並暫時停止，然後移動到所述底面附 近的第二位置；或(2)使所述罩以第一速度移動至第一位置後，然後以比所述第一速度小的速度作為第二速度移動到所述底面附近的第二位置。
  9. 如請求項8所述之基板處理方法，其具有以下工序：檢測在所述基板保持模組內是否存在所述基板的工序；及在所述基板保持模組的罩關閉後，向所述基板的正面及/或背面供給液體的工序。
  10. 如請求項8所述之基板處理方法，其中係於檢測到所述基板被保持於所述基板保持銷上之後，始進行關閉所述罩的工序。
  11. 如請求項8所述之基板處理方法，其中：所述基板保持模組具有裝設了基板保持銷的底座；所述第一位置係比所述底座靠下、且從所述底面向上遠離1cm~3cm的位置。
TW106103944A 2016-02-12 2017-02-07 基板保持模組、基板處理裝置、及基板處理方法 TWI702113B (zh)

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