CN107081673B - 基板保持模块、基板处理装置及基板处理方法 - Google Patents

基板保持模块、基板处理装置及基板处理方法 Download PDF

Info

Publication number
CN107081673B
CN107081673B CN201710064401.7A CN201710064401A CN107081673B CN 107081673 B CN107081673 B CN 107081673B CN 201710064401 A CN201710064401 A CN 201710064401A CN 107081673 B CN107081673 B CN 107081673B
Authority
CN
China
Prior art keywords
substrate
cover
substrate holding
holding module
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710064401.7A
Other languages
English (en)
Other versions
CN107081673A (zh
Inventor
谷泽昭寻
小林贤一
赤泽贤一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN107081673A publication Critical patent/CN107081673A/zh
Application granted granted Critical
Publication of CN107081673B publication Critical patent/CN107081673B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

本发明提供一种存取自由度较高的基板保持模块、基板处理装置及基板处理方法。提供一种能够接收由搬送机器人搬送的基板的基板保持模块。该基板保持模块具有：底座，所述底座具有用于保持基板的保持机构；罩，所述罩用于覆盖所述底座；及移动机构，所述移动机构使所述罩以离开所述底座的方式移动。

Description

基板保持模块、基板处理装置及基板处理方法
技术领域
本发明涉及基板保持模块、基板处理装置及基板处理方法。
背景技术
作为基板处理装置，已知使半导体晶片的表面平坦化的半导体研磨装置。另外，已知对半导体晶片的背面进行研磨的背面研磨装置(例如专利文献1)。在这些基板处理装置中，在基板的研磨处理及研磨后的清洗处理的中途，有时使用暂时地保持基板的临时放置台(基板保持模块)。另外，当在搬送基板的多个机器人之间交接基板时，有时将基板暂时地配置于临时放置台，而在不同的机器人之间交接基板。
现有技术文献
专利文献1：日本特开2014-150178号公报
专利文献2：日本特开2004-327519号公报
专利文献3：日本特开2000-294616号公报
作为以往的基板临时放置台，具有通过外壳包围周围而单元化了的基板临时放置台(例如专利文献2、专利文献3)。在这样的基板临时放置台中，在外壳的特定的场所形成有用于基板的存入取出的开口部。因此，用于存入取出基板的搬送机器人的手臂的进入路径限定于固定的方向。另外，有时也设有用于对基板临时放置台的外壳的开口部进行开闭的闸门。当在基板临时放置台上存在多个用于存入取出基板的开口部的情况下，对各开口部分别设置闸门。因此，基板临时放置台的构造变得复杂，另外尺寸变大。
发明内容
发明所要解决的课题
本发明至少部分地解决上述课题的至少一部分。
根据第一实施方式，提供一种基板保持模块，具有：底座，所述底座具有用于保持基板的保持机构；罩，所述罩用于覆盖所述底座；及移动机构，所述移动机构使所述罩以离开所述底座的方式移动。
根据第二实施方式，在第一实施方式的基板保持模块中，所述基板保持模块具有用于使所述底座旋转的回转机构。
根据第三实施方式，在第一或第二实施方式的基板保持模块中，所述保持机构具有至少一个基板保持销。
根据第四实施方式，在第一至第三中的任一个实施方式的基板保持模块中，所述基板保持模块具有至少一个喷嘴，所述喷嘴用于在所述基板被保持于所述保持机构的状态下，向所述基板的一面或两面供给液体。
根据第五实施方式，在第四实施方式的基板保持模块中，所述基板保持模块具有用于排出液体的排液机构。
根据第六实施方式，在第一实施方式的基板保持模块中，所述基板保持模块具有底部件，所述底部件具有底面和侧壁，该侧壁从所述底面的外周向上延伸且包围所述底面的所述外周，在所述底面的上侧配置有所述底座，所述移动机构使所述罩相对于所述底面进行移动，当所述罩覆盖所述底座时，所述罩能够被移动机构移动，而在所述底部件的所述侧壁的内侧与所述底部件的所述底面接触。
根据第七实施方式，在第六实施方式的基板保持模块中，所述基板保持模块具有用于使所述底座旋转的回转机构。
根据第八实施方式，在第七实施方式的基板保持模块中，当所述底座被所述回转机构旋转时，所述底部件是静止的。
根据第九实施方式，在第六实施方式的基板保持模块中，所述基板保持模块具有用于检测有无所述基板的检测机构。
根据第十实施方式，在第六或第七实施方式的基板保持模块中，所述基板保持模块具有至少一个喷嘴，所述喷嘴用于在所述基板被保持于所述保持机构的状态下，向所述基板的一面或两面供给液体。
根据第十一实施方式，在第十实施方式的基板保持模块中，所述罩通过所述移动机构而移动至所述底面的上方的位置，并且所述液体被从所述至少一个喷嘴供给后存积于所述底部件，由此作为存水弯发挥作用。
根据第十二实施方式，在第六实施方式的基板保持模块中，所述罩能够通过所述移动机构而移动至第一位置和第二位置，该第一位置是比所述底座靠下的位置，该第二位置是所述底面的附近的位置。
根据第十三实施方式，在第十二实施方式的基板保持模块中，所述罩以第一速度移动至所述第一位置后，以第二速度移动至所述第二位置。
根据第十四实施方式，在第十三实施方式的基板保持模块中，所述第二速度小于所述第一速度。
根据第十五实施方式，提供一种基板处理装置。该基板处理装置具有：第一至第十五中的任一个实施方式的基板保持模块；及多个机器人，所述多个机器人用于向所述基板保持模块搬送基板。
根据第十六实施方式，提供一种基板处理方法。该基板处理方法具有如下的工序：打开基板保持模块的罩的工序；将基板放置于在所述罩内配置的基板保持销上，并关闭所述罩的工序；及打开所述罩，并将配置在所述基板保持销上的所述基板向下一个工序搬送的工序。
根据第十七实施方式，在第十六实施方式的基板处理方法中，该基板处理方法具有如下的工序：检测在所述基板保持模块内是否存在基板的工序；及在所述基板保持模块的所述罩关闭后，向所述基板的正面及/或背面供给液体的工序。
附图说明
图1是一实施方式的基板处理装置的概略俯视图。
图2是表示一实施方式的基板保持模块的结构的图。
符号说明
104 搬送机器人
106 搬送机器人
500 临时放置台(基板保持模块)
502 底部件
504 底面
506 侧壁
508 底座
510 回转机构
512 销
514 上侧罩
516 移动机构
518 检测机构
520 喷嘴
1000 背面研磨装置
具体实施方式
以下，与附图一起对具备本发明的基板保持模块的基板处理装置的实施方式进行说明。在附图中，对于相同或类似的要素附以相同或类似的参照符号，在各实施方式的说明中有时省略关于相同或类似的要素的重复的说明。另外，在各实施方式所示的特征只要不相互矛盾，也能够适用于其他实施方式。
<基板处理装置>
图1是作为基板处理装置的一例的背面研磨装置1000的俯视图。背面研磨装置1000是对半导体基板WF的背面进行研磨的装置。此外，在本说明书中，基板的背面是形成器件及配线(电路)的正面的相反侧的面。背面研磨装置1000具备：装载/卸载单元200、边缘研磨单元300、背面研磨单元350、背面清洗单元400及正面清洗单元450。另外，背面研磨装置1000具备供给成为这些单元的各种动作的动力源的电源的电源板600、及用于控制这些单元的各种动作的控制单元(未图示)。以下，沿着背面研磨装置1000内的基板的次序，对装载/卸载单元200、边缘研磨单元300、背面研磨单元350、背面清洗单元400及正面清洗单元450进行说明。
<装载/卸载单元>
装载/卸载单元200是在FOUP与处理单元之间搬送基板WF的单元。装载/卸载单元200具备多个(在本实施方式中为4台)前装载部220。在前装载部220上分别搭载有用于存储基板WF的盒。
装载/卸载单元200具备搬送机器人102。搬送机器人102将进行研磨及清洗等处理之前的基板WF从前装载部220的盒取出并放置于临时放置台702。
<边缘研磨单元>
放置于临时放置台702的基板WF通过搬送机器人104经由移载机302而向边缘研磨单元300交付。边缘研磨单元300是对基板WF的周缘部(包括外周边缘区域)进行研磨的装置。边缘研磨单元300使用研磨带来对基板WF的周缘部进行研磨。此外，图1的背面研磨装置1000具备2台边缘研磨单元300，但作为其他实施方式能够具备任意数量的边缘研磨单元300。
通过边缘研磨单元300而对基板周缘部进行了研磨后的基板WF再次被搬送机器人104接收，并通过搬送机器人104配置于临时放置台(基板保持模块)500。后述临时放置台500的详细构造。
<背面研磨单元>
放置于临时放置台500的基板WF在通过搬送机器人106使基板WF翻转后，向背面研磨单元350交付。背面研磨单元350是对基板WF的背面进行研磨的单元。对于保持于载物台的基板WF，背面研磨单元350使用保持研磨带的背面研磨头352来对基板WF的背面进行研磨。此外，图1的背面研磨装置1000具备2台背面研磨单元350，但作为其他实施方式能够具备任意数量的背面研磨单元350。
<背面清洗单元>
当背面研磨结束时，搬送机器人106再次从背面研磨单元350接收基板WF。搬送机器人106将接收到的基板WF配置于未图示的临时放置台，搬送机器人108接收基板WF，并将基板WF交付给2台背面清洗单元400中的任一个。背面清洗单元400是对基板的背面进行清洗的单元。作为一实施方式，背面清洗单元400能够设为如下笔形清洗单元：将旋转的笔形海绵402按压于基板的背面并沿着基板WF的半径方向摆动，由此对基板WF进行清洗。此外，在背面清洗单元400中设有双流体喷嘴，该双流体喷嘴向基板的背面喷射由液体(例如纯水)和气体的混合流体构成的双流体喷流来清洗基板WF。此外，图1的背面研磨装置1000具备2台背面清洗单元400，但作为其他实施方式能够具备任意数量的背面清洗单元400。
<正面清洗单元>
当基板WF的背面清洗结束时，搬送机器人108再次从背面清洗单元400接收基板WF，并将基板WF配置于未图示的临时放置台。然后，搬送机器人106从临时放置台接收基板WF，使基板WF的面翻转后，将该基板WF配置于临时放置台704。临时放置台704配置于临时放置台500的下侧。此外，临时放置台500与临时放置台704彼此独立地设置。通过搬送机器人110接收配置于临时放置台704的基板WF，进一步将基板WF向搬送机器人112交付，然后基板WF被交付到第一正面清洗单元450a。第一正面清洗单元450a能够设为如下辊清洗单元：向基板WF的正面供给清洗液，并且将旋转的海绵辊452按压于基板WF的正面，由此对基板WF的正面进行清洗。由第一正面清洗单元450a清洗后的基板WF通过搬送机器人112向第二正面清洗单元450b交付。第二正面清洗单元450b能够与第一正面清洗单元450a相同地设为辊清洗单元。由第二正面清洗单元450b清洗后的基板WF通过搬送机器人110向第三正面清洗单元450c交付。第三正面清洗单元450c能够设为与背面清洗单元400类似的笔形清洗单元。
由第三正面清洗单元450c清洗后的基板WF通过搬送机器人114向干燥单元800交付。干燥单元800对清洗后的基板WF进行干燥。由干燥单元800干燥后基板WF被搬送机器人102接收，并使其返回前装载部220。
<临时放置台的详细构造>
以下，对临时放置台500(基板保持模块)的详细构造进行说明。以下所说明的临时放置台500是在图1所示的背面研磨装置1000中，在通过搬送机器人104接收了结束了由边缘研磨单元300进行的周缘部的研磨的基板WF后，配置基板WF的临时放置台500。
图2是概略地表示一实施方式的临时放置台500的构造的立体图。如图2所示，临时放置台500具有底部件502。底部件502具有底面504及对底面504的外周进行包围的侧壁506。在底面504的上侧配置有底座508。底座508被回转机构510支承为能够旋转。回转机构510能够由电动机及旋转轴等构成。在底座508上安装有4根销512作为用于保持基板的保持机构。如图2所示，基板WF由4根销支承基板WF的外周部。在图2所示的临时放置台500中，销为4根，但只要是3根以上的销，则能够使用任意数量的销。或者，作为其他实施方式，也能够使用销以外的构造作为基板的保持机构。销512能够设为树脂制的，例如能够由PEEK、PTFE、PVC等形成。
图2所示的临时放置台500能够从图1所示的搬送机器人104、106进行存取，这些搬送机器人104、106能够将基板WF配置于临时放置台500，另外，这些搬送机器人104、106能够从临时放置台500接收基板。
图2所示的临时放置台500具有上侧罩514。上侧罩514构成为能够完全覆盖底座508。另外，上侧罩514能够由具有耐化学性的材料，例如PVC树脂等构成。上侧罩514连结于移动机构516，能够相对于底部件502及底座508进行移动。移动机构516能够设为使用气缸的空气压力式的移动机构。上侧罩514在完全覆盖底座508的状态下，在底部件502的侧壁506的内侧与底面504接触。其中，上侧罩514的下缘部浸入由侧壁506与底面504包围的部分所收纳的液体，由此能够在不使上侧罩514完全与底部件502的底面504接触的情况下，将临时放置台500构成为液体密封。通过这样构成上侧罩514，从而在对基板WF供给药液时等，由底部件502的侧壁506与上侧罩514包围的空间作为存水弯发挥作用，能够在临时放置台500内的底面存积液体。存积于底面的液体能够通过后述的排出机构而从临时放置台500排出。因此，能够防止在临时放置台500的内部使用的液体向临时放置台500的外部飞散。另外，在不想将向基板WF供给的药液向系统外排出等需要提高临时放置台500的气密性的情况下，在上侧罩514与底部件502接触的部分设置橡胶垫等密封部件，也能够构成为通过上侧罩514对临时放置台500的内部进行密封。另一方面，上侧罩514在通过移动机构516而移动至上方的状态下，使销512完全露出，从而搬送机器人104、106能够对基板WF进行存取。上侧罩514不限定于图2所示的圆筒形，也可以是例如长方筒体等其他形状。
另外，在使上侧罩514向临时放置台500内的底面附近移动时，例如在将基板WF载置在临时放置台500的上方并通过销512进行保持后，在如后述那样检测出存在基板WF的基础上，能够相对于底部件502及底座508开始移动，使上侧罩514移动至第一位置(例如比底座508靠下、且从底面504向上大致1cm～3cm左右的位置)并暂时停止(包括实质上停止)然后移动到作为底面附近的位置的第二位置。通过这样，从而在上侧罩514移动至底面504附近时，能够避免积存于底面504的液体飞散。或者，在第一位置不使上侧罩514停止，而使上侧罩514以比较大的速度即第一速度移动至第一位置后，以比第一速度小的速度即第二速度移动至第二位置，由此能够避免处于底面504的液体飞散。
图2所示的临时放置台500能够具备用于检测有无基板WF的检测机构518。检测机构518能够采用光学式的检测机构等任意的结构。另外，临时放置台500具备用于向被保持的基板WF的正面及/或背面供给液体的喷嘴520。图示的喷嘴520在夹紧基板WF的位置的上方与夹紧基板WF的位置的下方分别各设置1个。但是，作为其他实施方式，可以在夹紧基板的位置的上方和下方分别设置多个喷嘴，也可以仅在上方及下方中的任一方设置喷嘴。另外，也可以使上方及下方的喷嘴的数量不同。喷嘴520与用于供给纯水及药液那样的各种液体的配管连接。能够从配置于临时放置台500的喷嘴520向基板WF供给液体，因此能够防止处理中的基板WF干燥。此外，临时放置台500设有未图示的排液机构及排气机构。作为排液机构，通过在底面504设置排水口(未图示)，从而能够将从喷嘴520向基板WF的面上供给的液体向外部排出。此外，作为一实施方式，使喷嘴520能够进行移动，另外，能够控制从喷嘴520喷射的液体的流量。在这样的情况下，在临时放置台500内没有基板WF时，能够包括上侧罩514及销512在内地对临时放置台500的内部整体进行清洗，并从底面504的排水口排出清洗后的排液。另外，通过在临时放置台500上设置排气机构，从而能够更有效地防止处于临时放置台500上的基板的污染。
上述实施方式的临时放置台500能够通过上侧罩514而使配置的基板WF完全露出。因此，与在外壳的特定的场所形成有基板的存入取出用的开口部的临时放置台不同，搬送机器人的手臂能够从所有的方向存取基板。搬送机器人的手臂的存取方向具有自由度，因此多个机器人手臂能够对临时放置台进行存取，不需要考虑机器人手臂的存取方向而设置与各搬送机器人对应的临时放置台，能够有效地利用基板处理装置整体的空间。另外，配置对基板WF进行保持的销512的底座508能够旋转，所以能够使销512旋转至不与搬送机器人104、106的手臂产生干扰的位置。因此，搬送机器人对于基板WF的存取方向的自由度进一步增加。另外，能够通过上侧罩514完全覆盖基板WF，因此能够防止从位于夹紧基板WF的位置的上方的喷嘴520供给的液体飞散。另外，通过将用于向基板WF供给液体的喷嘴520设置于临时放置台，而能够更有效地防止放置于临时放置台的基板的干燥。
作为其他实施方式，能够设为从上述实施方式的临时放置台500中省略了回转机构的临时放置台。若搬送机器人的存取方向不与临时放置台的销产生干扰，则并非一定需要回转机构。另外，作为其他实施方式，若不需要将基板WF保持为潮湿状态，则能够设为从上述实施方式的临时放置台500中省略了供给液体的喷嘴520的临时放置台。
上述临时放置台500是图1所示的背面研磨装置1000中的1个临时放置台500，但其他临时放置台702、704的临时放置台也可以设为相同的结构。其他临时放置台702、704也可以是与上述临时放置台500不同的结构，可以设为与以往使用的任意的临时放置台。
另外，上述临时放置台500未必在背面研磨装置中使用，也能够在如斜角式研磨装置、CMP装置、基板电镀装置那样的其他基板处理装置中使用。

Claims (14)

1.一种基板保持模块，能够接收由搬送机器人搬送的基板，其特征在于，具有：
底座，所述底座具有用于保持基板的保持机构；
罩，所述罩用于覆盖所述底座；
移动机构，所述移动机构使所述罩以离开和接近所述底座的方式移动；
至少一个喷嘴，所述至少一个喷嘴用于在基板被保持于所述保持机构的状态下，向基板的一面或两面供给液体；及
底部件，所述底部件具有底面和侧壁，该侧壁包围所述底面的外周，
在所述罩覆盖所述底座的状态下，所述罩能够在所述底部件的所述侧壁的内侧与所述底部件的所述底面接触，
所述移动机构被构成为，当所述罩覆盖所述底座时：
使所述罩移动至第一位置并暂时停止，然后，使所述罩移动到所述底面附近的第二位置，或者
使所述罩以第一速度移动到第一位置，然后，使所述罩以比所述第一速度小的第二速度移动到所述底面附近的第二位置。
2.根据权利要求1所述的基板保持模块，其特征在于，
所述基板保持模块具有用于使所述底座旋转的回转机构。
3.根据权利要求1所述的基板保持模块，其特征在于，
所述保持机构具有至少一个基板保持销。
4.根据权利要求2所述的基板保持模块，其特征在于，
所述保持机构具有至少一个基板保持销。
5.根据权利要求1～4中任一项所述的基板保持模块，其特征在于，
所述基板保持模块具有用于排出液体的排液机构。
6.根据权利要求1所述的基板保持模块，其特征在于，
所述侧壁从所述底面的外周向上延伸，在所述底面的上侧配置有所述底座，
所述移动机构使所述罩相对于所述底面进行移动。
7.根据权利要求6所述的基板保持模块，其特征在于，
所述基板保持模块具有用于使所述底座旋转的回转机构。
8.根据权利要求7所述的基板保持模块，其特征在于，
当所述底座被所述回转机构旋转时，所述底部件是静止的。
9.根据权利要求6所述的基板保持模块，其特征在于，
所述基板保持模块具有用于检测有无所述基板的检测机构。
10.根据权利要求6或7所述的基板保持模块，其特征在于，
所述罩通过所述移动机构而移动至所述底面的上方的位置，并且所述液体被从所述至少一个喷嘴供给后存积于所述底部件，由此作为存水弯发挥作用。
11.根据权利要求6所述的基板保持模块，其特征在于，
所述第一位置是比所述底座靠下的位置。
12.一种基板处理装置，其特征在于，具有：
权利要求1～11中任一项所述的基板保持模块；及
多个机器人，所述多个机器人用于向所述基板保持模块搬送基板。
13.一种基板处理方法，其特征在于，具有如下的工序：
打开基板保持模块的罩的工序，所述基板保持模块具有底部件，所述底部件具有底面和侧壁，该侧壁包围所述底面的外周；
将基板放置于在所述罩内配置的基板保持销上，并通过使所述罩移动到所述底部件的所述底面附近或使所述罩移动到与所述底面接触的位置来关闭所述罩的工序；及
打开所述罩，并将配置在所述基板保持销上的所述基板向下一个工序搬送的工序，
关闭所述罩的工序具有：
使所述罩移动至第一位置并暂时停止，然后，使所述罩移动到所述底面附近的第二位置的工序，或者
使所述罩以第一速度移动到第一位置，然后，使所述罩以比所述第一速度小的第二速度移动到所述底面附近的第二位置的工序。
14.根据权利要求13所述的基板处理方法，其特征在于，具有如下的工序：
检测在所述基板保持模块内是否存在基板的工序；及
在所述基板保持模块的所述罩关闭后，向所述基板的正面及/或背面供给液体的工序。
CN201710064401.7A 2016-02-12 2017-02-04 基板保持模块、基板处理装置及基板处理方法 Active CN107081673B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016024620A JP6577385B2 (ja) 2016-02-12 2016-02-12 基板保持モジュール、基板処理装置、および基板処理方法
JP2016-024620 2016-02-12

Publications (2)

Publication Number Publication Date
CN107081673A CN107081673A (zh) 2017-08-22
CN107081673B true CN107081673B (zh) 2021-09-03

Family

ID=59561758

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710064401.7A Active CN107081673B (zh) 2016-02-12 2017-02-04 基板保持模块、基板处理装置及基板处理方法

Country Status (5)

Country Link
US (1) US10593570B2 (zh)
JP (1) JP6577385B2 (zh)
KR (1) KR102365323B1 (zh)
CN (1) CN107081673B (zh)
TW (1) TWI702113B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6858041B2 (ja) * 2017-03-16 2021-04-14 川崎重工業株式会社 基板搬送装置
JP6857682B2 (ja) * 2019-03-29 2021-04-14 芝浦メカトロニクス株式会社 基板処理装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294616A (ja) * 1999-04-06 2000-10-20 Ebara Corp 仮置台付位置合わせ機構及びポリッシング装置
US6168665B1 (en) * 1997-11-05 2001-01-02 Tokyo Electron Limited Substrate processing apparatus
CN1773376A (zh) * 2004-11-10 2006-05-17 大日本网目版制造株式会社 基板处理装置及基板处理方法
CN1815707A (zh) * 2004-12-16 2006-08-09 东京応化工业株式会社 基板支承销
CN101136353A (zh) * 2006-08-31 2008-03-05 东京毅力科创株式会社 基板载置机构以及基板交接方法
CN101911281A (zh) * 2008-01-21 2010-12-08 应用材料股份有限公司 用以在处理腔室内支撑、定位及旋转基板的设备与方法
JP2015053333A (ja) * 2013-09-05 2015-03-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3250090B2 (ja) * 1995-06-27 2002-01-28 東京エレクトロン株式会社 洗浄処理装置及び洗浄処理方法
DE10030431A1 (de) * 2000-06-21 2002-01-10 Karl Suess Kg Praez Sgeraete F Verfahren und Vorrichtung zum Reinigen und/oder Bonden von Substraten
WO2002049802A1 (fr) * 2000-12-21 2002-06-27 Nikon Corporation Dispositif et procede de polissage, et procede et dispositif pour produire un dispositif a semiconducteurs
JP4171642B2 (ja) * 2002-11-27 2008-10-22 島田理化工業株式会社 基板表面処理装置
JP4549636B2 (ja) 2003-04-22 2010-09-22 株式会社荏原製作所 基板処理装置
JP2006239604A (ja) 2005-03-04 2006-09-14 Sprout Co Ltd 基板洗浄装置およびその洗浄方法
US20120021671A1 (en) * 2010-07-26 2012-01-26 Applied Materials, Inc. Real-time monitoring of retaining ring thickness and lifetime
JP5810517B2 (ja) * 2010-12-02 2015-11-11 富士電機株式会社 吸着装置および吸着方法
JP5819762B2 (ja) * 2012-03-29 2015-11-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6131162B2 (ja) * 2012-11-08 2017-05-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TWI620240B (zh) * 2013-01-31 2018-04-01 應用材料股份有限公司 用於化學機械平坦化後的基板清潔之方法及設備
JP6100002B2 (ja) 2013-02-01 2017-03-22 株式会社荏原製作所 基板裏面の研磨方法および基板処理装置
KR102308587B1 (ko) * 2014-03-19 2021-10-01 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
US9947572B2 (en) * 2014-03-26 2018-04-17 SCREEN Holdings Co., Ltd. Substrate processing apparatus
JP2015205359A (ja) * 2014-04-18 2015-11-19 株式会社荏原製作所 基板処理装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6168665B1 (en) * 1997-11-05 2001-01-02 Tokyo Electron Limited Substrate processing apparatus
JP2000294616A (ja) * 1999-04-06 2000-10-20 Ebara Corp 仮置台付位置合わせ機構及びポリッシング装置
CN1773376A (zh) * 2004-11-10 2006-05-17 大日本网目版制造株式会社 基板处理装置及基板处理方法
CN1815707A (zh) * 2004-12-16 2006-08-09 东京応化工业株式会社 基板支承销
CN101136353A (zh) * 2006-08-31 2008-03-05 东京毅力科创株式会社 基板载置机构以及基板交接方法
CN101911281A (zh) * 2008-01-21 2010-12-08 应用材料股份有限公司 用以在处理腔室内支撑、定位及旋转基板的设备与方法
JP2015053333A (ja) * 2013-09-05 2015-03-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
JP2017143205A (ja) 2017-08-17
JP6577385B2 (ja) 2019-09-18
KR20170095123A (ko) 2017-08-22
US20170236727A1 (en) 2017-08-17
US10593570B2 (en) 2020-03-17
TWI702113B (zh) 2020-08-21
KR102365323B1 (ko) 2022-02-22
CN107081673A (zh) 2017-08-22
TW201733739A (zh) 2017-10-01

Similar Documents

Publication Publication Date Title
KR101798320B1 (ko) 기판 처리 장치
CN107818928B (zh) 基板清洗装置、基板处理装置、基板清洗方法及基板处理方法
TWI484578B (zh) A substrate liquid processing apparatus and a substrate liquid processing method, and a computer-readable recording medium on which a substrate liquid processing program is recorded
CN107275259B (zh) 基板处理装置
JP2002324828A (ja) 基板両面処理装置
US9466512B2 (en) Substrate cleaning apparatus and substrate processing apparatus
TWI681449B (zh) 研磨方法及研磨裝置
KR20190141587A (ko) 기판 처리 방법
US11380559B2 (en) Carrier device, work processing apparatus, control method of carrier device and storage medium storing program
CN107081673B (zh) 基板保持模块、基板处理装置及基板处理方法
KR20150120869A (ko) 기판 처리 장치
US11837482B2 (en) Substrate holding and rotation mechanism and substrate processing apparatus
CN107546155B (zh) 清洗装置及基板处理装置
TWI674153B (zh) 基板洗淨裝置及具備其之基板處理裝置
JP2003197718A (ja) 基板処理装置及び基板処理方法
KR20190140840A (ko) 기판 반송 시스템을 위한 티칭 장치 및 티칭 방법
JP6895341B2 (ja) 基板処理装置
CN213635912U (zh) 基板磨削系统
JP2002136935A (ja) 洗浄処理装置及び洗浄処理方法
KR20070090316A (ko) 웨이퍼 세정장치
US20220341053A1 (en) Plating machine with treatment units arranged on circumference
JP2022167184A (ja) ウェハを保持体で保持するめっき処理装置
KR20200013525A (ko) 기판 처리 장치 및 기판 처리 방법
TW202310942A (zh) 基板清洗裝置、基板處理裝置、及基板清洗裝置之維護方法
CN114222948A (zh) 涂敷显影装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant