TW503246B - An epoxy resin composition and a process of producing a coated article use thereof - Google Patents

An epoxy resin composition and a process of producing a coated article use thereof Download PDF

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Publication number
TW503246B
TW503246B TW087100801A TW87100801A TW503246B TW 503246 B TW503246 B TW 503246B TW 087100801 A TW087100801 A TW 087100801A TW 87100801 A TW87100801 A TW 87100801A TW 503246 B TW503246 B TW 503246B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
acid
item
compound
Prior art date
Application number
TW087100801A
Other languages
English (en)
Chinese (zh)
Inventor
Joseph Gan
John P Everett
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26310844&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW503246(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from GBGB9701294.2A external-priority patent/GB9701294D0/en
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Application granted granted Critical
Publication of TW503246B publication Critical patent/TW503246B/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/72Complexes of boron halides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW087100801A 1997-01-21 1998-01-21 An epoxy resin composition and a process of producing a coated article use thereof TW503246B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3594897P 1997-01-21 1997-01-21
GBGB9701294.2A GB9701294D0 (en) 1997-01-22 1997-01-22 Latent catalysts for epoxy curing systems

Publications (1)

Publication Number Publication Date
TW503246B true TW503246B (en) 2002-09-21

Family

ID=26310844

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087100801A TW503246B (en) 1997-01-21 1998-01-21 An epoxy resin composition and a process of producing a coated article use thereof

Country Status (9)

Country Link
EP (1) EP0954553B2 (https=)
JP (1) JP4080546B2 (https=)
KR (1) KR100569617B1 (https=)
CN (1) CN1129648C (https=)
AT (1) ATE273348T1 (https=)
DE (1) DE69825561T3 (https=)
MY (1) MY128727A (https=)
TW (1) TW503246B (https=)
WO (1) WO1998031750A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI496834B (zh) * 2009-11-06 2015-08-21 Dow Global Technologies Llc 用於電用層板之儲存穩定的環氧樹脂組成物
TWI613250B (zh) * 2011-05-02 2018-02-01 蘭科智慧保護有限責任公司 環氧樹脂中之硼酸三甲酯

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001042359A1 (en) * 1999-12-13 2001-06-14 Dow Global Technologies Inc. Flame retardant phosphorus element-containing epoxy resin compositions
US6641923B2 (en) 2001-07-31 2003-11-04 Ppg Industries Ohio, Inc. Weldable coating compositions having improved intercoat adhesion
US6617401B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
US6617400B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst
DE50201326D1 (de) * 2002-10-19 2004-11-18 Leuna Harze Gmbh Härtbare Epoxidharzzusammensetzung
US20040101689A1 (en) 2002-11-26 2004-05-27 Ludovic Valette Hardener composition for epoxy resins
JP4895487B2 (ja) * 2003-08-05 2012-03-14 一般財団法人川村理化学研究所 熱硬化性樹脂組成物及びその製造方法、成型物の製造方法
BRPI0510861A (pt) 2004-05-28 2007-12-26 Dow Global Technologies Inc processo para preparar um composto contendo fósforo, processo para preparar uma composição contendo fósforo, processo para preparar um composto de resina epóxi contendo fósforo, processo para preparar uma composição de resina epóxi contendo fósforo , processo para preparar um composto contendo um anel de benzoxazina e fósforo, processo para preparar uma composição de resina contendo anel de benzoxazina e fósforo, processo para preparar um composto contendo grupo termolábil e fósforo, processo para preparar uma composição de resina termolábil contendo fósforo, composto contendo fósforo, composição contendo fósforo, composição de resina epóxi contendo fósforo, composição contendo fósforo, composto de resina epóxi contendo fósforo, composto contendo anel de benzoxazina e fósforo, composição de resina contendo anel de benzoxazina e fósforo, composto contendo grupo termolábil e fósforo, composição de resina termolábil contendo fósforo, produto obtenìvel, composição de resina epóxi resistente à chama, composto de epóxi, composição de resina epóxi resistente a chama, composição de cura resistente à ignição, pré-impregnado, laminado, placa de circuito, poliol, resina de poliuretano resistente à chama, composição termoplástica resistente à ignição, composição hìbrida termoplástica / termofixa resistente à ignição e composição de revestimento
CN101273076B (zh) * 2005-09-27 2011-01-19 住友电木株式会社 潜伏性催化剂的制造方法和环氧树脂组合物
BRPI0621083A2 (pt) * 2005-12-22 2011-11-29 Dow Global Technologies Inc composição de resina epóxi curável contendo halogênio, artigo compósito reforçado com fibra, componente de circuito elétrico, processo para produzir um artigo revestido, pré- impregnado, laminado, placa de circuito impresso (pcb), processo para preparar um artigo revestido com resina, e artigo revestido com resina
WO2008152003A1 (de) * 2007-06-11 2008-12-18 Basf Se Katalysator für die härtung von epoxiden
EP2698393B1 (en) * 2007-07-26 2015-08-19 Ajinomoto Co., Inc. Resin composition
JP5144572B2 (ja) * 2009-03-26 2013-02-13 太陽ホールディングス株式会社 熱硬化性樹脂組成物
US20120083564A1 (en) * 2009-06-22 2012-04-05 Dow Global Technologies Llc Hardener composition for epoxy resins
CN102031082B (zh) * 2010-12-10 2013-04-03 东华大学 苯并咪唑二胺固化型环氧胶粘剂及其制备方法
AU2013219821B2 (en) * 2012-02-17 2017-05-04 Huntsman Advanced Materials Americas Llc Mixture of benzoxazine, epoxy and anhydride
EP2695727B1 (en) * 2012-08-08 2017-12-06 Siemens Aktiengesellschaft Method of accelerating the curing process in resin overflow systems for the use in casting processes and resin overflow container
DK2695903T3 (en) * 2012-08-08 2019-01-14 Siemens Ag Process for modifying the rate of temperature change of an epoxy resin composition in a resin container in a casting process
WO2015103427A1 (en) 2013-12-31 2015-07-09 Saint-Gobain Performance Plastics Corporation Composites for protecting signal transmitters/receivers
US11550220B2 (en) 2019-10-31 2023-01-10 Taiwan Semiconductor Manufacturing Co., Ltd. Negative tone photoresist for EUV lithography
CN113278251A (zh) * 2021-04-26 2021-08-20 厦门理工学院 柔性线路板使用的环氧树脂及其制备方法、装置、计算机设备
DE102024103231A1 (de) 2024-02-06 2025-08-07 Alzchem Trostberg Gmbh Lagerstabile Epoxidharz-Zusammensetzung und dafür geeignete Härtersysteme
CN119285906B (zh) * 2024-10-25 2025-10-14 厦门艾贝森电子有限公司 一种生物质阻燃环氧电子封装材料及其制备方法
CN119661811B (zh) * 2024-12-02 2026-03-27 江南大学 基于酸酐-叔胺动态离子对潜伏型促进剂及其制法和用途

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US3732332A (en) 1970-10-16 1973-05-08 Allied Chem Production of low molecular weight polyanhydrides and epoxy compositions derived therefrom
US3997499A (en) * 1974-08-29 1976-12-14 Gulf Oil Corporation Resin-forming homogeneous solutions of styrene, maleic anhydride and copolymers thereof
US4594291A (en) * 1984-07-17 1986-06-10 The Dow Chemical Company Curable, partially advanced epoxy resins
JPS62207320A (ja) * 1986-03-07 1987-09-11 Hitachi Ltd 熱硬化性樹脂組成物で封止してなる半導体装置
US4873273A (en) * 1986-03-20 1989-10-10 James River-Norwalk, Inc. Epoxide coating composition
JPH072829B2 (ja) 1987-11-04 1995-01-18 株式会社日立製作所 積層板
AU618313B2 (en) * 1988-02-12 1991-12-19 Dow Chemical Company, The Epoxy resin composition containing latent catalysts
GB8824391D0 (en) * 1988-10-18 1988-11-23 Ciba Geigy Ag Compositions
ATE243227T1 (de) 1990-05-21 2003-07-15 Dow Global Technologies Inc Latente katalysatoren, härtungsinhibierte epoxyharzzusammensetzungen und daraus hergestellte laminate
ZA913801B (en) * 1990-05-21 1993-01-27 Dow Chemical Co Latent catalysts,cure-inhibited epoxy resin compositions and laminates prepared therefrom
DE69423234T2 (de) 1993-11-02 2000-08-10 The Dow Chemical Co., Midland Härtungsinhibierte epoxidharzzusammensetzungen und daraus hergestellte laminate
DE69505410T2 (de) 1994-09-08 1999-05-20 Akzo Nobel N.V., Arnheim/Arnhem Allylgruppen enthaltende zusammensetzungen aus epoxyharz und dem copolymer eines ethylenisch ungesättigten anhydrids und einer vinylverbindung
GB9421405D0 (en) 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI496834B (zh) * 2009-11-06 2015-08-21 Dow Global Technologies Llc 用於電用層板之儲存穩定的環氧樹脂組成物
TWI613250B (zh) * 2011-05-02 2018-02-01 蘭科智慧保護有限責任公司 環氧樹脂中之硼酸三甲酯

Also Published As

Publication number Publication date
CN1249772A (zh) 2000-04-05
EP0954553B1 (en) 2004-08-11
DE69825561D1 (de) 2004-09-16
DE69825561T3 (de) 2009-07-09
JP4080546B2 (ja) 2008-04-23
EP0954553B2 (en) 2008-12-10
KR100569617B1 (ko) 2006-04-11
HK1023586A1 (en) 2000-09-15
CN1129648C (zh) 2003-12-03
WO1998031750A1 (en) 1998-07-23
JP2001508828A (ja) 2001-07-03
EP0954553A1 (en) 1999-11-10
DE69825561T2 (de) 2005-08-11
KR20000070360A (ko) 2000-11-25
MY128727A (en) 2007-02-28
ATE273348T1 (de) 2004-08-15

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