ATE243227T1 - Latente katalysatoren, härtungsinhibierte epoxyharzzusammensetzungen und daraus hergestellte laminate - Google Patents
Latente katalysatoren, härtungsinhibierte epoxyharzzusammensetzungen und daraus hergestellte laminateInfo
- Publication number
- ATE243227T1 ATE243227T1 AT91304277T AT91304277T ATE243227T1 AT E243227 T1 ATE243227 T1 AT E243227T1 AT 91304277 T AT91304277 T AT 91304277T AT 91304277 T AT91304277 T AT 91304277T AT E243227 T1 ATE243227 T1 AT E243227T1
- Authority
- AT
- Austria
- Prior art keywords
- acid
- polyepoxide
- boric acid
- curing
- mixture
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 8
- 229920000647 polyepoxide Polymers 0.000 title abstract 7
- 239000003054 catalyst Substances 0.000 title abstract 5
- 239000003822 epoxy resin Substances 0.000 title abstract 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 abstract 6
- 239000004327 boric acid Substances 0.000 abstract 6
- 239000002253 acid Substances 0.000 abstract 3
- 150000001450 anions Chemical class 0.000 abstract 3
- 150000001875 compounds Chemical class 0.000 abstract 3
- 230000000269 nucleophilic effect Effects 0.000 abstract 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 abstract 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 abstract 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 abstract 2
- 230000003197 catalytic effect Effects 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000003112 inhibitor Substances 0.000 abstract 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 abstract 2
- 239000011976 maleic acid Substances 0.000 abstract 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 abstract 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 abstract 1
- KUXDQQMEFBFTGX-UHFFFAOYSA-N [N].P Chemical compound [N].P KUXDQQMEFBFTGX-UHFFFAOYSA-N 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- VUEDNLCYHKSELL-UHFFFAOYSA-N arsonium Chemical compound [AsH4+] VUEDNLCYHKSELL-UHFFFAOYSA-N 0.000 abstract 1
- 125000000623 heterocyclic group Chemical group 0.000 abstract 1
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 abstract 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 abstract 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6611—Wire connections
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Professional, Industrial, Or Sporting Protective Garments (AREA)
- Retarders (AREA)
- Wrappers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US52648790A | 1990-05-21 | 1990-05-21 | |
| US07/526,488 US5169473A (en) | 1990-05-21 | 1990-05-21 | Latent catalysts, epoxy compositions incorporating same, and coating, impregnating and bonding methods employing the compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE243227T1 true ATE243227T1 (de) | 2003-07-15 |
Family
ID=27062123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT91304277T ATE243227T1 (de) | 1990-05-21 | 1991-05-13 | Latente katalysatoren, härtungsinhibierte epoxyharzzusammensetzungen und daraus hergestellte laminate |
Country Status (15)
| Country | Link |
|---|---|
| EP (1) | EP0458502B1 (de) |
| JP (5) | JP3080245B2 (de) |
| KR (1) | KR100229301B1 (de) |
| CN (3) | CN1035823C (de) |
| AT (1) | ATE243227T1 (de) |
| AU (1) | AU657264B2 (de) |
| BR (1) | BR9102108A (de) |
| CA (1) | CA2042858A1 (de) |
| DE (1) | DE69133280T2 (de) |
| FI (1) | FI912435A7 (de) |
| IL (1) | IL98185A (de) |
| MY (1) | MY141502A (de) |
| NO (1) | NO911933L (de) |
| PT (1) | PT97724A (de) |
| SG (1) | SG43193A1 (de) |
Families Citing this family (70)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4981926A (en) * | 1990-02-06 | 1991-01-01 | The Dow Chemical Company | Composition of epoxy resin, amino group-containing phosphonium catalyst and curing agent |
| GB9103402D0 (en) * | 1991-02-19 | 1991-04-03 | Pilkington Plc | Fire resistance |
| GB9208955D0 (en) * | 1992-04-24 | 1992-06-10 | Dow Europ Sa | Dicyandiamide solution |
| US5407977A (en) * | 1993-04-20 | 1995-04-18 | The Dow Chemical Company | Solvent system |
| US5464910A (en) * | 1993-12-22 | 1995-11-07 | Shikoku Chemicals Corporation | Epoxy resin adduct combined with a borate ester and phenolic compound |
| GB9421407D0 (en) * | 1994-10-21 | 1994-12-07 | Dow Chemical Co | Curable epoxy resin accelerated by boric acid and its analogs |
| GB9421405D0 (en) | 1994-10-21 | 1994-12-07 | Dow Chemical Co | Low voc laminating formulations |
| US5508328A (en) * | 1994-11-17 | 1996-04-16 | Alliedsignal Inc. | Curing epoxy resins using dicy, imidazole and acid |
| KR100569617B1 (ko) † | 1997-01-21 | 2006-04-11 | 다우 글로벌 테크놀로지스 인크. | 에폭시 수지 조성물 |
| US6613839B1 (en) | 1997-01-21 | 2003-09-02 | The Dow Chemical Company | Polyepoxide, catalyst/cure inhibitor complex and anhydride |
| US6353080B1 (en) | 1997-06-26 | 2002-03-05 | The Dow Chemical Company | Flame retardant epoxy resin composition |
| GB9817799D0 (en) * | 1998-08-14 | 1998-10-14 | Dow Deutschland Inc | Viscosity modifier for thermosetting resin compositioning |
| US6403220B1 (en) | 1999-12-13 | 2002-06-11 | The Dow Chemical Company | Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith |
| ATE308585T1 (de) | 1999-12-13 | 2005-11-15 | Dow Global Technologies Inc | Feuerhemmende phosporenthaltende epoxidharzzusammensetzung |
| KR100419063B1 (ko) * | 2000-06-10 | 2004-02-14 | 주식회사 엘지화학 | 에폭시 수지 조성물 및 이를 이용한 적층판 |
| JP4534344B2 (ja) * | 2000-11-27 | 2010-09-01 | 住友ベークライト株式会社 | 難燃性樹脂組成物、これを用いたプリプレグ及び積層板 |
| EP1425330B1 (de) * | 2001-09-12 | 2005-03-09 | Dow Global Technologies Inc. | Netzwerkpolymere mit epoxidgruppenterminierten estern |
| EP1391490A1 (de) * | 2002-08-23 | 2004-02-25 | Vantico Gmbh | Modifizierte Epoxidharze für triboelectrische Beschichtungsverfahren |
| JP4612625B2 (ja) * | 2003-04-16 | 2011-01-12 | ハンツマン・アドヴァンスト・マテリアルズ・（スイッツランド）・ゲーエムベーハー | 低温硬化用の促進剤系 |
| US20060247334A1 (en) * | 2003-08-05 | 2006-11-02 | Akira Ohbayashi | Epoxy resin composition and method for producing heat-resistant laminate sheet |
| JP4895487B2 (ja) * | 2003-08-05 | 2012-03-14 | 一般財団法人川村理化学研究所 | 熱硬化性樹脂組成物及びその製造方法、成型物の製造方法 |
| JP4558359B2 (ja) * | 2004-03-22 | 2010-10-06 | 財団法人川村理化学研究所 | エポキシ樹脂組成物及びそれを用いた銅張積層板 |
| CN103554184A (zh) | 2004-05-28 | 2014-02-05 | 陶氏环球技术有限责任公司 | 可用于制造无卤素抗引燃聚合物的含磷化合物 |
| KR100856186B1 (ko) * | 2005-04-07 | 2008-09-03 | 아사히 가세이 케미칼즈 가부시키가이샤 | 에폭시 수지 조성물 |
| DE102005029146A1 (de) * | 2005-06-23 | 2006-12-28 | Cognis Ip Management Gmbh | Härter für Überzugmassen (IV) |
| EP1754733A1 (de) * | 2005-07-26 | 2007-02-21 | Huntsman Advanced Materials (Switzerland) GmbH | Zusammensetzung |
| CA2621341A1 (en) | 2005-09-15 | 2007-03-22 | Ciba Specialty Chemicals Holding Inc. | Coating compositions comprising a latent activator for marking substrates |
| CN101273076B (zh) * | 2005-09-27 | 2011-01-19 | 住友电木株式会社 | 潜伏性催化剂的制造方法和环氧树脂组合物 |
| WO2007075769A1 (en) * | 2005-12-22 | 2007-07-05 | Dow Global Technologies Inc. | A curable epoxy resin composition and laminates made therefrom |
| JP5114111B2 (ja) * | 2006-09-07 | 2013-01-09 | 日東シンコー株式会社 | 樹脂組成物、熱伝導シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シート |
| JP5114112B2 (ja) * | 2006-09-07 | 2013-01-09 | 日東シンコー株式会社 | 樹脂組成物、熱伝導シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シート |
| RU2470954C2 (ru) | 2007-06-11 | 2012-12-27 | Басф Се | Катализатор для отверждения эпоксидов |
| KR101438865B1 (ko) | 2007-06-12 | 2014-09-11 | 바스프 에스이 | 에폭사이드 경화용 촉매 |
| KR101438866B1 (ko) | 2007-06-13 | 2014-09-11 | 바스프 에스이 | 에폭사이드 경화용 촉매 |
| WO2008152002A1 (de) | 2007-06-14 | 2008-12-18 | Basf Se | Katalysator für die härtung von epoxiden |
| EP2167323B1 (de) | 2007-07-18 | 2018-04-04 | DataLase Ltd | Laserempfindliche beschichtungsformulierung |
| KR101547874B1 (ko) * | 2007-07-26 | 2015-08-27 | 아지노모토 가부시키가이샤 | 수지 조성물 |
| CN102197041A (zh) | 2008-08-28 | 2011-09-21 | 陶氏环球技术有限责任公司 | 含磷化合物和包含其的聚合物组合物 |
| JP5460720B2 (ja) | 2008-10-23 | 2014-04-02 | データレース リミテッド | 熱吸収添加剤 |
| US9267042B2 (en) | 2008-10-27 | 2016-02-23 | Datalase Ltd. | Coating composition for marking substrates |
| CA2755854A1 (en) | 2009-03-17 | 2010-09-23 | Dow Global Technologies Llc | Curable compositions containing cyclic diamine and cured products therefrom |
| DE102009027826A1 (de) | 2009-04-29 | 2010-11-04 | Evonik Degussa Gmbh | Katalyse von Epoxidharzformulierungen |
| KR100925986B1 (ko) | 2009-06-20 | 2009-11-10 | 정송옥 | 상·하수도 노후관 갱생용의 잠재성 중온 속경화형 에폭시 수지 조성물의 제조방법. |
| CN102666633B (zh) * | 2009-11-12 | 2016-02-17 | 陶氏环球技术有限责任公司 | 聚噁唑烷酮树脂 |
| CN101728038A (zh) * | 2009-12-04 | 2010-06-09 | 上海长园维安电子线路保护股份有限公司 | 热固性正温度系数热敏电阻器的制造方法及所用导电胶 |
| EP2452978A1 (de) | 2010-11-16 | 2012-05-16 | Basf Se | Verfahren zur Herstellung von mit Kohlenstoff-Füllstoffen gefüllten Epoxidharzformmassen |
| EP2678368B1 (de) * | 2011-02-23 | 2015-05-06 | AlzChem AG | Neue härter für epoxidharze |
| WO2012136273A1 (de) | 2011-04-08 | 2012-10-11 | Basf Se | Hyperverzweigte polymere zur modifikation der zähigkeit von anionisch gehärteten epoxidharz-systemen |
| CN102443168B (zh) * | 2011-10-10 | 2016-03-09 | 苏州科技学院 | 一种多孔固体胺及其制备方法 |
| US9376528B2 (en) * | 2012-06-15 | 2016-06-28 | Blue Cube Ip Llc | Latent catalyst for curable compositions |
| DK2695903T3 (en) * | 2012-08-08 | 2019-01-14 | Siemens Ag | Process for modifying the rate of temperature change of an epoxy resin composition in a resin container in a casting process |
| NZ708935A (en) * | 2012-12-11 | 2019-05-31 | Ge Healthcare Bio Sciences Corp | Photoactivated chemical bleaching of dyes |
| JP5758463B2 (ja) * | 2013-03-26 | 2015-08-05 | 太陽インキ製造株式会社 | エポキシ樹脂組成物、穴埋め充填用組成物およびこれらを用いたプリント配線板 |
| JP6266096B2 (ja) * | 2013-05-14 | 2018-01-24 | スリーエム イノベイティブ プロパティズ カンパニー | ピラジン含有化合物を含むエポキシ樹脂 |
| DE102013008723A1 (de) | 2013-05-23 | 2014-11-27 | Deutsche Institute Für Textil- Und Faserforschung Denkendorf | Polymerisierbare Reaktionsmischung zur Herstellung von Epoxidharzen und deren Verwendung |
| WO2015118952A1 (ja) | 2014-02-06 | 2015-08-13 | 株式会社Adeka | 新規化合物及びそれを含有してなるエポキシ樹脂組成物 |
| JP6240940B2 (ja) * | 2014-02-06 | 2017-12-06 | 株式会社Adeka | エポキシ樹脂組成物 |
| AU2015252252A1 (en) | 2014-04-29 | 2016-10-20 | Akzo Nobel Coatings International B.V. | Coating method for surfaces in chemical installations |
| US10556985B2 (en) * | 2015-11-17 | 2020-02-11 | Evonik Operations Gmbh | Nitrogen-containing heterocyclic epoxy curing agents, compositions and methods |
| US10465039B2 (en) | 2015-11-17 | 2019-11-05 | Evonik Degussa Gmbh | Epoxy curing agents, compositions and uses thereof |
| CN107446535A (zh) * | 2017-08-16 | 2017-12-08 | 浙江林境新材料科技有限公司 | 一种复合板 |
| CN108565041B (zh) * | 2018-04-20 | 2020-04-28 | 四川省银河化学股份有限公司 | 一种高电导耐焊接型低温银浆及其制备方法 |
| EP3569629B1 (de) * | 2018-05-17 | 2022-07-06 | Evonik Operations GmbH | Schnell härtende epoxysysteme |
| EP3848405B1 (de) * | 2018-09-05 | 2024-01-17 | Mitsubishi Chemical Corporation | Bahnformverbindung und faserverstärktes verbundstoffmaterial |
| JP7261563B2 (ja) * | 2018-11-02 | 2023-04-20 | 谷川油化興業株式会社 | 熱交換媒体 |
| KR102161362B1 (ko) * | 2018-12-24 | 2020-10-05 | 주식회사 하이플럭스 | 내화 조성물 |
| DE102019121195A1 (de) * | 2019-08-06 | 2021-02-11 | Alzchem Trostberg Gmbh | Lagerstabile Epoxidharz-Zusammensetzung |
| CN111892695B (zh) * | 2020-07-13 | 2022-12-30 | 四川省玻纤集团有限公司 | 耐γ辐照的改性树脂及其制备方法、层压板及其制备工艺与应用 |
| CN117124521A (zh) * | 2023-07-25 | 2023-11-28 | 中国工程物理研究院化工材料研究所 | 一种通过取向填料含量V字形调控热压成型环氧vitrimer复合材料动态性能的方法 |
| CN118421192B (zh) * | 2024-07-04 | 2024-08-30 | 湖南飘峰电气股份有限公司 | 防火耐高温聚酰亚胺电磁线及其制备方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4001156A (en) * | 1972-08-03 | 1977-01-04 | Ppg Industries, Inc. | Method of producing epoxy group-containing, quaternary ammonium salt-containing resins |
| NZ212747A (en) * | 1984-07-17 | 1989-01-27 | Dow Chemical Co | Partially advanced epoxy resin compositions |
| US4594291A (en) * | 1984-07-17 | 1986-06-10 | The Dow Chemical Company | Curable, partially advanced epoxy resins |
| US4668758A (en) * | 1985-09-30 | 1987-05-26 | Shell Oil Company | Cure rate control in epoxy resin compositions |
-
1991
- 1991-05-13 EP EP91304277A patent/EP0458502B1/de not_active Expired - Lifetime
- 1991-05-13 AT AT91304277T patent/ATE243227T1/de not_active IP Right Cessation
- 1991-05-13 SG SG1996005258A patent/SG43193A1/en unknown
- 1991-05-13 DE DE69133280T patent/DE69133280T2/de not_active Expired - Lifetime
- 1991-05-16 NO NO91911933A patent/NO911933L/no unknown
- 1991-05-17 BR BR919102108A patent/BR9102108A/pt not_active Application Discontinuation
- 1991-05-17 CA CA002042858A patent/CA2042858A1/en not_active Abandoned
- 1991-05-17 IL IL9818591A patent/IL98185A/en not_active IP Right Cessation
- 1991-05-17 MY MYPI91000833A patent/MY141502A/en unknown
- 1991-05-20 AU AU77211/91A patent/AU657264B2/en not_active Ceased
- 1991-05-20 PT PT97724A patent/PT97724A/pt not_active Application Discontinuation
- 1991-05-20 KR KR1019910008147A patent/KR100229301B1/ko not_active Expired - Lifetime
- 1991-05-20 CN CN91103442A patent/CN1035823C/zh not_active Expired - Fee Related
- 1991-05-20 FI FI912435A patent/FI912435A7/fi not_active Application Discontinuation
- 1991-05-20 JP JP03114740A patent/JP3080245B2/ja not_active Expired - Lifetime
-
1995
- 1995-06-27 CN CN95107625A patent/CN1050618C/zh not_active Expired - Lifetime
- 1995-06-27 CN CN95107624A patent/CN1050617C/zh not_active Expired - Lifetime
-
1999
- 1999-03-01 JP JP05329299A patent/JP3321429B2/ja not_active Expired - Lifetime
- 1999-09-16 JP JP26274899A patent/JP3333762B2/ja not_active Expired - Lifetime
-
2000
- 2000-04-04 JP JP2000106716A patent/JP3269621B2/ja not_active Expired - Lifetime
-
2001
- 2001-11-08 JP JP2001343762A patent/JP3383658B2/ja not_active Expired - Lifetime
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