NO911933L - Epoksyharpiksmateriale, samt katalysator for herding derav - Google Patents

Epoksyharpiksmateriale, samt katalysator for herding derav

Info

Publication number
NO911933L
NO911933L NO91911933A NO911933A NO911933L NO 911933 L NO911933 L NO 911933L NO 91911933 A NO91911933 A NO 91911933A NO 911933 A NO911933 A NO 911933A NO 911933 L NO911933 L NO 911933L
Authority
NO
Norway
Prior art keywords
acid
curing
polyepoxide
mixture
boric acid
Prior art date
Application number
NO91911933A
Other languages
English (en)
Norwegian (no)
Other versions
NO911933D0 (no
Inventor
James L Bertram
Charlie Z Hotz
Louis L Walker
Joseph Gan
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/526,488 external-priority patent/US5169473A/en
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of NO911933D0 publication Critical patent/NO911933D0/no
Publication of NO911933L publication Critical patent/NO911933L/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/206—Wires

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Professional, Industrial, Or Sporting Protective Garments (AREA)
  • Retarders (AREA)
  • Wrappers (AREA)
NO91911933A 1990-05-21 1991-05-16 Epoksyharpiksmateriale, samt katalysator for herding derav NO911933L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52648790A 1990-05-21 1990-05-21
US07/526,488 US5169473A (en) 1990-05-21 1990-05-21 Latent catalysts, epoxy compositions incorporating same, and coating, impregnating and bonding methods employing the compositions

Publications (2)

Publication Number Publication Date
NO911933D0 NO911933D0 (no) 1991-05-16
NO911933L true NO911933L (no) 1991-11-22

Family

ID=27062123

Family Applications (1)

Application Number Title Priority Date Filing Date
NO91911933A NO911933L (no) 1990-05-21 1991-05-16 Epoksyharpiksmateriale, samt katalysator for herding derav

Country Status (15)

Country Link
EP (1) EP0458502B1 (de)
JP (5) JP3080245B2 (de)
KR (1) KR100229301B1 (de)
CN (3) CN1035823C (de)
AT (1) ATE243227T1 (de)
AU (1) AU657264B2 (de)
BR (1) BR9102108A (de)
CA (1) CA2042858A1 (de)
DE (1) DE69133280T2 (de)
FI (1) FI912435A7 (de)
IL (1) IL98185A (de)
MY (1) MY141502A (de)
NO (1) NO911933L (de)
PT (1) PT97724A (de)
SG (1) SG43193A1 (de)

Families Citing this family (71)

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GB9103402D0 (en) * 1991-02-19 1991-04-03 Pilkington Plc Fire resistance
GB9208955D0 (en) * 1992-04-24 1992-06-10 Dow Europ Sa Dicyandiamide solution
US5407977A (en) * 1993-04-20 1995-04-18 The Dow Chemical Company Solvent system
US5464910A (en) * 1993-12-22 1995-11-07 Shikoku Chemicals Corporation Epoxy resin adduct combined with a borate ester and phenolic compound
GB9421407D0 (en) * 1994-10-21 1994-12-07 Dow Chemical Co Curable epoxy resin accelerated by boric acid and its analogs
GB9421405D0 (en) * 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
US5508328A (en) * 1994-11-17 1996-04-16 Alliedsignal Inc. Curing epoxy resins using dicy, imidazole and acid
CN1129648C (zh) † 1997-01-21 2003-12-03 陶氏环球技术公司 用于环氧固化体系的潜伏催化剂
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
GB9817799D0 (en) * 1998-08-14 1998-10-14 Dow Deutschland Inc Viscosity modifier for thermosetting resin compositioning
AU2089701A (en) 1999-12-13 2001-06-18 Dow Chemical Company, The Phosphorus element-containing crosslinking agents and flame retardant phosphoruselement-containing epoxy resin compositions prepared therewith
WO2001042359A1 (en) 1999-12-13 2001-06-14 Dow Global Technologies Inc. Flame retardant phosphorus element-containing epoxy resin compositions
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WO2003022904A1 (en) * 2001-09-12 2003-03-20 Dow Global Technologies Inc. Network polymers comprising epoxy-terminated esters
EP1391490A1 (de) * 2002-08-23 2004-02-25 Vantico Gmbh Modifizierte Epoxidharze für triboelectrische Beschichtungsverfahren
EP1613680B1 (de) * 2003-04-16 2006-11-29 Huntsman Advanced Materials (Switzerland) GmbH Härtungsbeschleuniger für epoxyharzzusammensetzungen härtend bei niedriger temperatur
JP4895487B2 (ja) * 2003-08-05 2012-03-14 一般財団法人川村理化学研究所 熱硬化性樹脂組成物及びその製造方法、成型物の製造方法
TW200512252A (en) * 2003-08-05 2005-04-01 Kawamura Inst Chem Res Epoxy resin composition and manufacturing method of heat resisting laminated sheet
JP4558359B2 (ja) * 2004-03-22 2010-10-06 財団法人川村理化学研究所 エポキシ樹脂組成物及びそれを用いた銅張積層板
CN102653598B (zh) 2004-05-28 2015-05-13 陶氏环球技术有限责任公司 可用于制造无卤素抗引燃聚合物的含磷化合物
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EP1754733A1 (de) * 2005-07-26 2007-02-21 Huntsman Advanced Materials (Switzerland) GmbH Zusammensetzung
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WO2007037024A1 (ja) * 2005-09-27 2007-04-05 Sumitomo Bakelite Co., Ltd. 潜伏性触媒の製造方法及びエポキシ樹脂組成物
WO2007075769A1 (en) * 2005-12-22 2007-07-05 Dow Global Technologies Inc. A curable epoxy resin composition and laminates made therefrom
JP5114112B2 (ja) * 2006-09-07 2013-01-09 日東シンコー株式会社 樹脂組成物、熱伝導シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シート
JP5114111B2 (ja) * 2006-09-07 2013-01-09 日東シンコー株式会社 樹脂組成物、熱伝導シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シート
US8053546B2 (en) 2007-06-11 2011-11-08 Basf Se Catalyst for curing epoxides
US8193297B2 (en) 2007-06-12 2012-06-05 Basf Se Catalyst for curing epoxides
WO2008152011A1 (de) 2007-06-13 2008-12-18 Basf Se Katalysator für die härtung von epoxiden
KR101438867B1 (ko) 2007-06-14 2014-09-11 바스프 에스이 에폭사이드 경화용 촉매
KR20100037148A (ko) 2007-07-18 2010-04-08 바스프 에스이 레이저 감응성 코팅 제제
EP2698393B1 (de) * 2007-07-26 2015-08-19 Ajinomoto Co., Inc. Harzzusammensetzung
WO2010025165A1 (en) 2008-08-28 2010-03-04 Dow Global Technologies Inc. Phosphorus-containing compounds and polymeric compositions comprising same
WO2010046285A2 (en) 2008-10-23 2010-04-29 Basf Se Heat absorbing additives
EP2342295A1 (de) 2008-10-27 2011-07-13 DataLase Ltd Beschichtungszusammensetzung zur kennzeichnung von substraten
CN102356110B (zh) * 2009-03-17 2013-12-18 陶氏环球技术有限责任公司 含有环状二胺的可固化组合物及其固化产品
DE102009027826A1 (de) 2009-04-29 2010-11-04 Evonik Degussa Gmbh Katalyse von Epoxidharzformulierungen
KR100925986B1 (ko) 2009-06-20 2009-11-10 정송옥 상·하수도 노후관 갱생용의 잠재성 중온 속경화형 에폭시 수지 조성물의 제조방법.
JP5706437B2 (ja) * 2009-11-12 2015-04-22 ダウ グローバル テクノロジーズ エルエルシー ポリオキサゾリドン樹脂
CN101728038A (zh) * 2009-12-04 2010-06-09 上海长园维安电子线路保护股份有限公司 热固性正温度系数热敏电阻器的制造方法及所用导电胶
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BR112013021411B1 (pt) * 2011-02-23 2020-04-14 Alzchem Ag endurecedores de alta latência para resinas epóxi, seus usos, composição de resina epóxi e de poliuretano compreendendo os mesmos e material compósito
WO2012136273A1 (de) 2011-04-08 2012-10-11 Basf Se Hyperverzweigte polymere zur modifikation der zähigkeit von anionisch gehärteten epoxidharz-systemen
CN102443168B (zh) * 2011-10-10 2016-03-09 苏州科技学院 一种多孔固体胺及其制备方法
RU2015101122A (ru) * 2012-06-15 2016-08-10 БЛЮ КЬЮБ АйПи ЭлЭлСи Скрытый катализатор для отверждаемых композиций
DK2695903T3 (en) 2012-08-08 2019-01-14 Siemens Ag Process for modifying the rate of temperature change of an epoxy resin composition in a resin container in a casting process
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JP5758463B2 (ja) * 2013-03-26 2015-08-05 太陽インキ製造株式会社 エポキシ樹脂組成物、穴埋め充填用組成物およびこれらを用いたプリント配線板
CN105209536B (zh) * 2013-05-14 2018-01-09 3M创新有限公司 包含含吡嗪化合物的环氧树脂
DE102013008723A1 (de) 2013-05-23 2014-11-27 Deutsche Institute Für Textil- Und Faserforschung Denkendorf Polymerisierbare Reaktionsmischung zur Herstellung von Epoxidharzen und deren Verwendung
JP6240940B2 (ja) * 2014-02-06 2017-12-06 株式会社Adeka エポキシ樹脂組成物
KR102311142B1 (ko) 2014-02-06 2021-10-12 가부시키가이샤 아데카 신규 화합물 및 그것을 함유하여 이루어지는 에폭시 수지 조성물
AU2015252252A1 (en) 2014-04-29 2016-10-20 Akzo Nobel Coatings International B.V. Coating method for surfaces in chemical installations
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US10465039B2 (en) 2015-11-17 2019-11-05 Evonik Degussa Gmbh Epoxy curing agents, compositions and uses thereof
CN107446535A (zh) * 2017-08-16 2017-12-08 浙江林境新材料科技有限公司 一种复合板
CN108565041B (zh) * 2018-04-20 2020-04-28 四川省银河化学股份有限公司 一种高电导耐焊接型低温银浆及其制备方法
EP3569629B1 (de) * 2018-05-17 2022-07-06 Evonik Operations GmbH Schnell härtende epoxysysteme
EP3848405B1 (de) * 2018-09-05 2024-01-17 Mitsubishi Chemical Corporation Bahnformverbindung und faserverstärktes verbundstoffmaterial
JP7261563B2 (ja) * 2018-11-02 2023-04-20 谷川油化興業株式会社 熱交換媒体
KR102161362B1 (ko) * 2018-12-24 2020-10-05 주식회사 하이플럭스 내화 조성물
DE102019121195A1 (de) * 2019-08-06 2021-02-11 Alzchem Trostberg Gmbh Lagerstabile Epoxidharz-Zusammensetzung
CN111892695B (zh) * 2020-07-13 2022-12-30 四川省玻纤集团有限公司 耐γ辐照的改性树脂及其制备方法、层压板及其制备工艺与应用
KR102906330B1 (ko) * 2023-01-12 2025-12-30 도레이첨단소재 주식회사 인장신율이 향상된 에폭시 수지 조성물과 이로부터 제조되는 강화섬유 복합재료
CN117124521B (zh) * 2023-07-25 2026-02-03 中国工程物理研究院化工材料研究所 一种通过取向填料含量V字形调控热压成型环氧vitrimer复合材料动态性能的方法
CN118421192B (zh) * 2024-07-04 2024-08-30 湖南飘峰电气股份有限公司 防火耐高温聚酰亚胺电磁线及其制备方法

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Also Published As

Publication number Publication date
CN1118793A (zh) 1996-03-20
CN1035823C (zh) 1997-09-10
CN1050617C (zh) 2000-03-22
JP2000309626A (ja) 2000-11-07
EP0458502A3 (en) 1992-12-02
JP3333762B2 (ja) 2002-10-15
SG43193A1 (en) 1997-10-17
EP0458502B1 (de) 2003-06-18
BR9102108A (pt) 1991-12-24
DE69133280D1 (de) 2003-07-24
CN1056699A (zh) 1991-12-04
FI912435A0 (fi) 1991-05-20
MY141502A (en) 2010-05-14
CN1050618C (zh) 2000-03-22
JP2002178342A (ja) 2002-06-26
JPH04227924A (ja) 1992-08-18
JP2000136288A (ja) 2000-05-16
IL98185A (en) 1994-06-24
EP0458502A2 (de) 1991-11-27
JPH11310627A (ja) 1999-11-09
KR100229301B1 (ko) 1999-11-01
IL98185A0 (en) 1992-06-21
JP3321429B2 (ja) 2002-09-03
AU7721191A (en) 1991-11-21
JP3269621B2 (ja) 2002-03-25
FI912435A7 (fi) 1991-11-22
DE69133280T2 (de) 2004-05-06
CN1118794A (zh) 1996-03-20
AU657264B2 (en) 1995-03-09
KR910020060A (ko) 1991-12-19
NO911933D0 (no) 1991-05-16
CA2042858A1 (en) 1991-11-22
JP3383658B2 (ja) 2003-03-04
PT97724A (pt) 1992-03-31
ATE243227T1 (de) 2003-07-15
JP3080245B2 (ja) 2000-08-21

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