IL98185A - Latent catalysts, epoxy compositions containing the same and process for coating and impregnating articles using the compositions - Google Patents

Latent catalysts, epoxy compositions containing the same and process for coating and impregnating articles using the compositions

Info

Publication number
IL98185A
IL98185A IL9818591A IL9818591A IL98185A IL 98185 A IL98185 A IL 98185A IL 9818591 A IL9818591 A IL 9818591A IL 9818591 A IL9818591 A IL 9818591A IL 98185 A IL98185 A IL 98185A
Authority
IL
Israel
Prior art keywords
acid
catalyst
polyepoxide
resin
boric acid
Prior art date
Application number
IL9818591A
Other languages
English (en)
Other versions
IL98185A0 (en
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/526,488 external-priority patent/US5169473A/en
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of IL98185A0 publication Critical patent/IL98185A0/xx
Publication of IL98185A publication Critical patent/IL98185A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/206—Wires

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Wrappers (AREA)
  • Retarders (AREA)
  • Professional, Industrial, Or Sporting Protective Garments (AREA)
IL9818591A 1990-05-21 1991-05-17 Latent catalysts, epoxy compositions containing the same and process for coating and impregnating articles using the compositions IL98185A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52648790A 1990-05-21 1990-05-21
US07/526,488 US5169473A (en) 1990-05-21 1990-05-21 Latent catalysts, epoxy compositions incorporating same, and coating, impregnating and bonding methods employing the compositions

Publications (2)

Publication Number Publication Date
IL98185A0 IL98185A0 (en) 1992-06-21
IL98185A true IL98185A (en) 1994-06-24

Family

ID=27062123

Family Applications (1)

Application Number Title Priority Date Filing Date
IL9818591A IL98185A (en) 1990-05-21 1991-05-17 Latent catalysts, epoxy compositions containing the same and process for coating and impregnating articles using the compositions

Country Status (15)

Country Link
EP (1) EP0458502B1 (de)
JP (5) JP3080245B2 (de)
KR (1) KR100229301B1 (de)
CN (3) CN1035823C (de)
AT (1) ATE243227T1 (de)
AU (1) AU657264B2 (de)
BR (1) BR9102108A (de)
CA (1) CA2042858A1 (de)
DE (1) DE69133280T2 (de)
FI (1) FI912435A7 (de)
IL (1) IL98185A (de)
MY (1) MY141502A (de)
NO (1) NO911933L (de)
PT (1) PT97724A (de)
SG (1) SG43193A1 (de)

Families Citing this family (72)

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GB9103402D0 (en) * 1991-02-19 1991-04-03 Pilkington Plc Fire resistance
GB9208955D0 (en) * 1992-04-24 1992-06-10 Dow Europ Sa Dicyandiamide solution
US5407977A (en) * 1993-04-20 1995-04-18 The Dow Chemical Company Solvent system
US5464910A (en) * 1993-12-22 1995-11-07 Shikoku Chemicals Corporation Epoxy resin adduct combined with a borate ester and phenolic compound
GB9421405D0 (en) * 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
GB9421407D0 (en) * 1994-10-21 1994-12-07 Dow Chemical Co Curable epoxy resin accelerated by boric acid and its analogs
US5508328A (en) * 1994-11-17 1996-04-16 Alliedsignal Inc. Curing epoxy resins using dicy, imidazole and acid
WO1998031750A1 (en) † 1997-01-21 1998-07-23 The Dow Chemical Company Latent catalysts for epoxy curing systems
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
GB9817799D0 (en) * 1998-08-14 1998-10-14 Dow Deutschland Inc Viscosity modifier for thermosetting resin compositioning
US6403220B1 (en) 1999-12-13 2002-06-11 The Dow Chemical Company Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
KR100721697B1 (ko) 1999-12-13 2007-05-28 다우 글로벌 테크놀로지스 인크. 난연성 인 원소 함유 에폭시 수지 조성물
KR100419063B1 (ko) * 2000-06-10 2004-02-14 주식회사 엘지화학 에폭시 수지 조성물 및 이를 이용한 적층판
JP4534344B2 (ja) * 2000-11-27 2010-09-01 住友ベークライト株式会社 難燃性樹脂組成物、これを用いたプリプレグ及び積層板
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EP1391490A1 (de) * 2002-08-23 2004-02-25 Vantico Gmbh Modifizierte Epoxidharze für triboelectrische Beschichtungsverfahren
ATE346877T1 (de) * 2003-04-16 2006-12-15 Huntsman Adv Mat Switzerland Härtungsbeschleuniger für epoxyharzzusammensetzungen härtend bei niedriger temperatur
JP4895487B2 (ja) * 2003-08-05 2012-03-14 一般財団法人川村理化学研究所 熱硬化性樹脂組成物及びその製造方法、成型物の製造方法
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JP4558359B2 (ja) * 2004-03-22 2010-10-06 財団法人川村理化学研究所 エポキシ樹脂組成物及びそれを用いた銅張積層板
KR101148353B1 (ko) 2004-05-28 2012-05-21 다우 글로벌 테크놀로지스 엘엘씨 내인화성 할로겐 무함유 중합체의 제조에 유용한 인 함유화합물
KR100856186B1 (ko) 2005-04-07 2008-09-03 아사히 가세이 케미칼즈 가부시키가이샤 에폭시 수지 조성물
DE102005029146A1 (de) * 2005-06-23 2006-12-28 Cognis Ip Management Gmbh Härter für Überzugmassen (IV)
EP1754733A1 (de) * 2005-07-26 2007-02-21 Huntsman Advanced Materials (Switzerland) GmbH Zusammensetzung
KR20080046736A (ko) 2005-09-15 2008-05-27 시바 스페셜티 케미칼스 홀딩 인크. 기질 마킹을 위한 잠복 활성제를 포함하는 피복 조성물
WO2007037024A1 (ja) * 2005-09-27 2007-04-05 Sumitomo Bakelite Co., Ltd. 潜伏性触媒の製造方法及びエポキシ樹脂組成物
BRPI0621083A2 (pt) * 2005-12-22 2011-11-29 Dow Global Technologies Inc composição de resina epóxi curável contendo halogênio, artigo compósito reforçado com fibra, componente de circuito elétrico, processo para produzir um artigo revestido, pré- impregnado, laminado, placa de circuito impresso (pcb), processo para preparar um artigo revestido com resina, e artigo revestido com resina
JP5114112B2 (ja) * 2006-09-07 2013-01-09 日東シンコー株式会社 樹脂組成物、熱伝導シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シート
JP5114111B2 (ja) * 2006-09-07 2013-01-09 日東シンコー株式会社 樹脂組成物、熱伝導シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シート
BRPI0813341A2 (pt) 2007-06-11 2014-12-23 Basf Se " uso de compostos, composições curáveis, e, uso de composições curáveis ".
JP5579059B2 (ja) 2007-06-12 2014-08-27 ビーエーエスエフ ソシエタス・ヨーロピア エポキシドの硬化触媒
KR101438866B1 (ko) 2007-06-13 2014-09-11 바스프 에스이 에폭사이드 경화용 촉매
CN101687977B (zh) * 2007-06-14 2012-08-15 巴斯夫欧洲公司 用于固化环氧化物的催化剂
JP5581208B2 (ja) 2007-07-18 2014-08-27 データレース リミテッド レーザー感受性被覆配合物
EP2174969A4 (de) * 2007-07-26 2012-07-25 Ajinomoto Kk Harzzusammensetzung
CN102197041A (zh) 2008-08-28 2011-09-21 陶氏环球技术有限责任公司 含磷化合物和包含其的聚合物组合物
CN102197076A (zh) 2008-10-23 2011-09-21 巴斯夫欧洲公司 吸热添加剂
US9267042B2 (en) 2008-10-27 2016-02-23 Datalase Ltd. Coating composition for marking substrates
WO2010107539A1 (en) * 2009-03-17 2010-09-23 Dow Global Technologies Inc. Curable compositions containing cyclic diamine and cured products therefrom
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CN105713179A (zh) * 2009-11-12 2016-06-29 陶氏环球技术有限责任公司 聚噁唑烷酮树脂
CN101728038A (zh) * 2009-12-04 2010-06-09 上海长园维安电子线路保护股份有限公司 热固性正温度系数热敏电阻器的制造方法及所用导电胶
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CN102443168B (zh) * 2011-10-10 2016-03-09 苏州科技学院 一种多孔固体胺及其制备方法
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EP2695903B1 (de) * 2012-08-08 2018-09-26 Siemens Aktiengesellschaft Verfahren zum Modifizieren der Rate der Temperaturveränderung einer Expoxyharzzusammensetzung in einem Harzbehälter während eines Gussverfahrens
EP2932270B1 (de) * 2012-12-11 2018-10-24 GE Healthcare Bio-Sciences Corp. Lichtaktivierte chemische bleichung von farbstoffen
JP5758463B2 (ja) * 2013-03-26 2015-08-05 太陽インキ製造株式会社 エポキシ樹脂組成物、穴埋め充填用組成物およびこれらを用いたプリント配線板
US9975988B2 (en) 2013-05-14 2018-05-22 3M Innovative Properties Company Epoxy resins comprising a pyrazine-containing compound
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JP6240940B2 (ja) * 2014-02-06 2017-12-06 株式会社Adeka エポキシ樹脂組成物
CN105916844B (zh) * 2014-02-06 2018-09-11 株式会社艾迪科 化合物及含有其的环氧树脂组合物
ES2804124T3 (es) 2014-04-29 2021-02-03 Akzo Nobel Coatings Int Bv Método de revestimiento para superficies en instalaciones químicas
US10556985B2 (en) * 2015-11-17 2020-02-11 Evonik Operations Gmbh Nitrogen-containing heterocyclic epoxy curing agents, compositions and methods
US10465039B2 (en) 2015-11-17 2019-11-05 Evonik Degussa Gmbh Epoxy curing agents, compositions and uses thereof
CN107446535A (zh) * 2017-08-16 2017-12-08 浙江林境新材料科技有限公司 一种复合板
CN108565041B (zh) * 2018-04-20 2020-04-28 四川省银河化学股份有限公司 一种高电导耐焊接型低温银浆及其制备方法
EP3569629B1 (de) * 2018-05-17 2022-07-06 Evonik Operations GmbH Schnell härtende epoxysysteme
WO2020050200A1 (ja) * 2018-09-05 2020-03-12 三菱ケミカル株式会社 シートモールディングコンパウンド、および繊維強化複合材料
JP7261563B2 (ja) * 2018-11-02 2023-04-20 谷川油化興業株式会社 熱交換媒体
KR102161362B1 (ko) * 2018-12-24 2020-10-05 주식회사 하이플럭스 내화 조성물
DE102019121195A1 (de) * 2019-08-06 2021-02-11 Alzchem Trostberg Gmbh Lagerstabile Epoxidharz-Zusammensetzung
CN111892695B (zh) * 2020-07-13 2022-12-30 四川省玻纤集团有限公司 耐γ辐照的改性树脂及其制备方法、层压板及其制备工艺与应用
KR102906330B1 (ko) * 2023-01-12 2025-12-30 도레이첨단소재 주식회사 인장신율이 향상된 에폭시 수지 조성물과 이로부터 제조되는 강화섬유 복합재료
CN117124521B (zh) * 2023-07-25 2026-02-03 中国工程物理研究院化工材料研究所 一种通过取向填料含量V字形调控热压成型环氧vitrimer复合材料动态性能的方法
CN117586296A (zh) * 2023-10-12 2024-02-23 上海树脂厂有限公司 一种用于环氧树脂的固化剂、其制备方法和应用
CN118421192B (zh) * 2024-07-04 2024-08-30 湖南飘峰电气股份有限公司 防火耐高温聚酰亚胺电磁线及其制备方法

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Also Published As

Publication number Publication date
PT97724A (pt) 1992-03-31
EP0458502A2 (de) 1991-11-27
CN1050617C (zh) 2000-03-22
SG43193A1 (en) 1997-10-17
MY141502A (en) 2010-05-14
CA2042858A1 (en) 1991-11-22
DE69133280T2 (de) 2004-05-06
CN1056699A (zh) 1991-12-04
CN1035823C (zh) 1997-09-10
JPH11310627A (ja) 1999-11-09
FI912435A7 (fi) 1991-11-22
JPH04227924A (ja) 1992-08-18
JP2000309626A (ja) 2000-11-07
IL98185A0 (en) 1992-06-21
JP3333762B2 (ja) 2002-10-15
EP0458502A3 (en) 1992-12-02
NO911933D0 (no) 1991-05-16
CN1118793A (zh) 1996-03-20
KR100229301B1 (ko) 1999-11-01
JP2000136288A (ja) 2000-05-16
JP3321429B2 (ja) 2002-09-03
DE69133280D1 (de) 2003-07-24
JP3080245B2 (ja) 2000-08-21
KR910020060A (ko) 1991-12-19
JP3383658B2 (ja) 2003-03-04
JP3269621B2 (ja) 2002-03-25
EP0458502B1 (de) 2003-06-18
FI912435A0 (fi) 1991-05-20
AU657264B2 (en) 1995-03-09
ATE243227T1 (de) 2003-07-15
NO911933L (no) 1991-11-22
BR9102108A (pt) 1991-12-24
AU7721191A (en) 1991-11-21
CN1050618C (zh) 2000-03-22
CN1118794A (zh) 1996-03-20
JP2002178342A (ja) 2002-06-26

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