JP5144572B2 - 熱硬化性樹脂組成物 - Google Patents
熱硬化性樹脂組成物 Download PDFInfo
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- JP5144572B2 JP5144572B2 JP2009076209A JP2009076209A JP5144572B2 JP 5144572 B2 JP5144572 B2 JP 5144572B2 JP 2009076209 A JP2009076209 A JP 2009076209A JP 2009076209 A JP2009076209 A JP 2009076209A JP 5144572 B2 JP5144572 B2 JP 5144572B2
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Images
Classifications
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L35/06—Copolymers with vinyl aromatic monomers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Description
等を使用することができる。
サートマー社製SMA−1000P(スチレンと無水マレイン酸のモル比が1:1の共重合樹脂)500gとカルビトールアセテート500gを還流塔つきの攪拌可能な密閉釜に入れて、120℃で3時間加熱溶解させて不揮発分50wt%の樹脂溶液1を得た。
サートマー社製SMA−2000P(スチレンと無水マレイン酸のモル比が2:1の共重合樹脂)500gとカルビトールアセテート500gを還流塔つきの攪拌可能な密閉釜に入れて、120℃で3時間加熱溶解させて不揮発分50wt%の樹脂溶液2を得た。
実施例1〜8として、表1に示すような組成で、また、比較例1〜8として、表2に示すような組成で、A剤及びB剤を作製した。なお、配合成分が複数のものについては、それぞれの配合成分を3本ロールミルで混練して作製した。なお、表1、表2中の数字は、質量部を示す。
実施例1〜8、比較例1〜8のA剤について、回転式粘度計(東機産業 VISCOMETER TV−33)を用いて、25℃における5回転毎分の初期粘度を測定した。これを、30日間保存した後、再度同様に粘度を測定し、粘度上昇を求めた。結果を表3に示す。なお、初期の粘度より10%以下の粘度上昇があるものを○、10〜50%の粘度上昇があるものを△、50%以上の粘度上昇があるものを×、ゲル化したものを××とした。
A剤及びB剤をそれぞれ混合し、得られた熱硬化性樹脂組成物を、銅ベタのFR−4基板上にスクリーン印刷により乾燥塗膜が約20μmとなるようにパターン印刷し、これを150℃で60分間加熱し硬化させて試験片を得た。各試験片にロジン系フラックスを塗布して260℃のはんだ槽で30秒間フローさせた。その後、プロピレングリコールモノメチルエーテルアセテートで洗浄し、乾燥させた後に、セロハン粘着テープによるピールテストを行い、塗膜の剥がれについて評価した。結果を表4に示す。なお、塗膜の剥がれが無いものを○、塗膜の剥がれがあるものを×とした。
実施例1〜4、7および比較例6のA剤及びB剤をそれぞれ混合し、得られた熱硬化性樹脂組成物を、厚さ1mmのガラス板にスクリーン印刷により乾燥塗膜が約20μmとなるようにパターン印刷し、これを150℃で60分間加熱し硬化させて試験片を得た。これを初期値として、透過率測定装置(JASCO V−570:積分球 ISN−470)を用いて波長400nmの透過率を測定した。コンベア型UV照射機QRM−2082−E−01(オーク製作所製)を用いて、メタルハライドランプ、コールドミラー、80W/cm2×3灯、コンベアスピード6.5m/分(積算光量1000mJ/cm2)の条件で20回繰り返してUVを照射した。その後、コンベア式加熱炉で2回繰り返して加熱した。試験後の透過率を同様の方法で測定した。図1は、このとき用いられたコンベア式加熱炉の加熱温度分布を示す。図1に示すように、最高到達温度は、投入から250秒後において260℃であった。結果を表5に示す。なお、目視評価において、初期と試験後の色調の差がないものを○、色調の差が見られるものを×とした。
実施例5、6、8および比較例7、8のA剤及びB剤をそれぞれ混合し、得られた熱硬化性樹脂組成物により、(2)と同様の方法で試験片を作製し、初期値として色彩色差計CR−400(ミノルタ製)でXYZ表色系のY値およびL*a*b*表色系の各値を測定した。コンベア型UV照射機QRM−2082−E−01(オーク製作所製)を用いて、メタルハライドランプ、コールドミラー、80W/cm2×3灯、コンベアスピード6.5m/分(積算光量1000mJ/cm2)の条件で20回繰り返してUVを照射した。その後、耐光耐熱性評価1において用いたコンベア式加熱炉で2回繰り返して加熱した後、試験片を同様の方法で測定した。結果を表6に示す。
(2)と同様に作製した各試験片を、プロピレングリコールモノメチルエーテルアセテートに30分間浸漬し、乾燥させた後に、セロハン粘着テープによるピールテストを行い、塗膜の剥がれと変色について評価した。結果を表7に示す。なお、塗膜の剥がれや変色がなかったものを○とした。表7に示すように、実施例1〜8の熱硬化性樹脂組成物においては、良好な耐溶剤性が得られた。
(2)と同様に作製した各試験片に、芯の先が平らになるように研がれたBから9Hの鉛筆を、約45°の角度で押し付けて、塗膜の剥がれが生じない鉛筆の硬さを記録した。結果を表7に示す。表7に示すように、実施例1〜8の熱硬化性樹脂組成物においては、5H以上の良好な鉛筆硬度が得られた。
FR−4銅張り積層板の代わりに、IPC B−25テストパターンのクシ型電極Bクーポンを用いること以外は(2)と同様の条件で試験片を作製した。この試験片に、DC500Vのバイアスを印加し、絶縁抵抗値を測定した。結果を表7に示す。
Claims (4)
- A剤とB剤を混合して用いられる二液性の熱硬化性樹脂組成物であって、
前記A剤は、スチレン−無水マレイン酸の共重合物と有機溶剤を含み、
前記B剤は、多官能脂環式エポキシ樹脂と白色着色顔料を含むことを特徴とする熱硬化性樹脂組成物。 - 前記白色着色顔料は、酸化チタンを含むことを特徴とする請求項1記載の熱硬化性樹脂組成物。
- 請求項1または請求項2に記載の熱硬化性樹脂組成物を回路形成されたプリント配線板表面に塗布して形成されたソルダーレジスト膜を、熱硬化して得られることを特徴とするプリント配線板。
- 請求項1または請求項2に記載の熱硬化性樹脂組成物を基板上に塗布して形成された塗膜を、熱硬化して得られることを特徴とする発光素子用反射板。
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