KR100569617B1 - 에폭시 수지 조성물 - Google Patents
에폭시 수지 조성물 Download PDFInfo
- Publication number
- KR100569617B1 KR100569617B1 KR1019997006593A KR19997006593A KR100569617B1 KR 100569617 B1 KR100569617 B1 KR 100569617B1 KR 1019997006593 A KR1019997006593 A KR 1019997006593A KR 19997006593 A KR19997006593 A KR 19997006593A KR 100569617 B1 KR100569617 B1 KR 100569617B1
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- acid
- resin composition
- compound
- catalyst
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 0 CC1(CCC(*)CC2(C)CCC1)C1(CC3)C23NC1 Chemical compound CC1(CCC(*)CC2(C)CCC1)C1(CC3)C23NC1 0.000 description 2
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/72—Complexes of boron halides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3594897P | 1997-01-21 | 1997-01-21 | |
| US60/035,948 | 1997-01-21 | ||
| GB9701294.2 | 1997-01-22 | ||
| GBGB9701294.2A GB9701294D0 (en) | 1997-01-22 | 1997-01-22 | Latent catalysts for epoxy curing systems |
| PCT/US1998/001041 WO1998031750A1 (en) | 1997-01-21 | 1998-01-20 | Latent catalysts for epoxy curing systems |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20000070360A KR20000070360A (ko) | 2000-11-25 |
| KR100569617B1 true KR100569617B1 (ko) | 2006-04-11 |
Family
ID=26310844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019997006593A Expired - Fee Related KR100569617B1 (ko) | 1997-01-21 | 1998-01-20 | 에폭시 수지 조성물 |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP0954553B2 (https=) |
| JP (1) | JP4080546B2 (https=) |
| KR (1) | KR100569617B1 (https=) |
| CN (1) | CN1129648C (https=) |
| AT (1) | ATE273348T1 (https=) |
| DE (1) | DE69825561T3 (https=) |
| MY (1) | MY128727A (https=) |
| TW (1) | TW503246B (https=) |
| WO (1) | WO1998031750A1 (https=) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001042359A1 (en) * | 1999-12-13 | 2001-06-14 | Dow Global Technologies Inc. | Flame retardant phosphorus element-containing epoxy resin compositions |
| US6641923B2 (en) | 2001-07-31 | 2003-11-04 | Ppg Industries Ohio, Inc. | Weldable coating compositions having improved intercoat adhesion |
| US6617401B2 (en) * | 2001-08-23 | 2003-09-09 | General Electric Company | Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst |
| US6617400B2 (en) * | 2001-08-23 | 2003-09-09 | General Electric Company | Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst |
| DE50201326D1 (de) * | 2002-10-19 | 2004-11-18 | Leuna Harze Gmbh | Härtbare Epoxidharzzusammensetzung |
| US20040101689A1 (en) | 2002-11-26 | 2004-05-27 | Ludovic Valette | Hardener composition for epoxy resins |
| JP4895487B2 (ja) * | 2003-08-05 | 2012-03-14 | 一般財団法人川村理化学研究所 | 熱硬化性樹脂組成物及びその製造方法、成型物の製造方法 |
| BRPI0510861A (pt) | 2004-05-28 | 2007-12-26 | Dow Global Technologies Inc | processo para preparar um composto contendo fósforo, processo para preparar uma composição contendo fósforo, processo para preparar um composto de resina epóxi contendo fósforo, processo para preparar uma composição de resina epóxi contendo fósforo , processo para preparar um composto contendo um anel de benzoxazina e fósforo, processo para preparar uma composição de resina contendo anel de benzoxazina e fósforo, processo para preparar um composto contendo grupo termolábil e fósforo, processo para preparar uma composição de resina termolábil contendo fósforo, composto contendo fósforo, composição contendo fósforo, composição de resina epóxi contendo fósforo, composição contendo fósforo, composto de resina epóxi contendo fósforo, composto contendo anel de benzoxazina e fósforo, composição de resina contendo anel de benzoxazina e fósforo, composto contendo grupo termolábil e fósforo, composição de resina termolábil contendo fósforo, produto obtenìvel, composição de resina epóxi resistente à chama, composto de epóxi, composição de resina epóxi resistente a chama, composição de cura resistente à ignição, pré-impregnado, laminado, placa de circuito, poliol, resina de poliuretano resistente à chama, composição termoplástica resistente à ignição, composição hìbrida termoplástica / termofixa resistente à ignição e composição de revestimento |
| CN101273076B (zh) * | 2005-09-27 | 2011-01-19 | 住友电木株式会社 | 潜伏性催化剂的制造方法和环氧树脂组合物 |
| BRPI0621083A2 (pt) * | 2005-12-22 | 2011-11-29 | Dow Global Technologies Inc | composição de resina epóxi curável contendo halogênio, artigo compósito reforçado com fibra, componente de circuito elétrico, processo para produzir um artigo revestido, pré- impregnado, laminado, placa de circuito impresso (pcb), processo para preparar um artigo revestido com resina, e artigo revestido com resina |
| WO2008152003A1 (de) * | 2007-06-11 | 2008-12-18 | Basf Se | Katalysator für die härtung von epoxiden |
| EP2698393B1 (en) * | 2007-07-26 | 2015-08-19 | Ajinomoto Co., Inc. | Resin composition |
| JP5144572B2 (ja) * | 2009-03-26 | 2013-02-13 | 太陽ホールディングス株式会社 | 熱硬化性樹脂組成物 |
| US20120083564A1 (en) * | 2009-06-22 | 2012-04-05 | Dow Global Technologies Llc | Hardener composition for epoxy resins |
| CN106751517A (zh) * | 2009-11-06 | 2017-05-31 | 蓝立方知识产权有限责任公司 | 用于电层合体的存储稳定的环氧树脂组合物 |
| CN102031082B (zh) * | 2010-12-10 | 2013-04-03 | 东华大学 | 苯并咪唑二胺固化型环氧胶粘剂及其制备方法 |
| EP2705090A1 (en) * | 2011-05-02 | 2014-03-12 | Dow Global Technologies LLC | Trimethyl borate in epoxy resins |
| AU2013219821B2 (en) * | 2012-02-17 | 2017-05-04 | Huntsman Advanced Materials Americas Llc | Mixture of benzoxazine, epoxy and anhydride |
| EP2695727B1 (en) * | 2012-08-08 | 2017-12-06 | Siemens Aktiengesellschaft | Method of accelerating the curing process in resin overflow systems for the use in casting processes and resin overflow container |
| DK2695903T3 (en) * | 2012-08-08 | 2019-01-14 | Siemens Ag | Process for modifying the rate of temperature change of an epoxy resin composition in a resin container in a casting process |
| WO2015103427A1 (en) | 2013-12-31 | 2015-07-09 | Saint-Gobain Performance Plastics Corporation | Composites for protecting signal transmitters/receivers |
| US11550220B2 (en) | 2019-10-31 | 2023-01-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Negative tone photoresist for EUV lithography |
| CN113278251A (zh) * | 2021-04-26 | 2021-08-20 | 厦门理工学院 | 柔性线路板使用的环氧树脂及其制备方法、装置、计算机设备 |
| DE102024103231A1 (de) | 2024-02-06 | 2025-08-07 | Alzchem Trostberg Gmbh | Lagerstabile Epoxidharz-Zusammensetzung und dafür geeignete Härtersysteme |
| CN119285906B (zh) * | 2024-10-25 | 2025-10-14 | 厦门艾贝森电子有限公司 | 一种生物质阻燃环氧电子封装材料及其制备方法 |
| CN119661811B (zh) * | 2024-12-02 | 2026-03-27 | 江南大学 | 基于酸酐-叔胺动态离子对潜伏型促进剂及其制法和用途 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5314720A (en) * | 1990-05-21 | 1994-05-24 | The Dow Chemical Company | Cure inhibited epoxy resin compositions and laminates prepared from the compositions |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3732332A (en) † | 1970-10-16 | 1973-05-08 | Allied Chem | Production of low molecular weight polyanhydrides and epoxy compositions derived therefrom |
| US3997499A (en) * | 1974-08-29 | 1976-12-14 | Gulf Oil Corporation | Resin-forming homogeneous solutions of styrene, maleic anhydride and copolymers thereof |
| US4594291A (en) * | 1984-07-17 | 1986-06-10 | The Dow Chemical Company | Curable, partially advanced epoxy resins |
| JPS62207320A (ja) * | 1986-03-07 | 1987-09-11 | Hitachi Ltd | 熱硬化性樹脂組成物で封止してなる半導体装置 |
| US4873273A (en) * | 1986-03-20 | 1989-10-10 | James River-Norwalk, Inc. | Epoxide coating composition |
| JPH072829B2 (ja) † | 1987-11-04 | 1995-01-18 | 株式会社日立製作所 | 積層板 |
| AU618313B2 (en) * | 1988-02-12 | 1991-12-19 | Dow Chemical Company, The | Epoxy resin composition containing latent catalysts |
| GB8824391D0 (en) * | 1988-10-18 | 1988-11-23 | Ciba Geigy Ag | Compositions |
| ATE243227T1 (de) † | 1990-05-21 | 2003-07-15 | Dow Global Technologies Inc | Latente katalysatoren, härtungsinhibierte epoxyharzzusammensetzungen und daraus hergestellte laminate |
| DE69423234T2 (de) † | 1993-11-02 | 2000-08-10 | The Dow Chemical Co., Midland | Härtungsinhibierte epoxidharzzusammensetzungen und daraus hergestellte laminate |
| DE69505410T2 (de) † | 1994-09-08 | 1999-05-20 | Akzo Nobel N.V., Arnheim/Arnhem | Allylgruppen enthaltende zusammensetzungen aus epoxyharz und dem copolymer eines ethylenisch ungesättigten anhydrids und einer vinylverbindung |
| GB9421405D0 (en) † | 1994-10-21 | 1994-12-07 | Dow Chemical Co | Low voc laminating formulations |
-
1998
- 1998-01-20 EP EP98903586A patent/EP0954553B2/en not_active Expired - Lifetime
- 1998-01-20 WO PCT/US1998/001041 patent/WO1998031750A1/en not_active Ceased
- 1998-01-20 JP JP53464498A patent/JP4080546B2/ja not_active Expired - Lifetime
- 1998-01-20 CN CN98802989A patent/CN1129648C/zh not_active Expired - Lifetime
- 1998-01-20 AT AT98903586T patent/ATE273348T1/de active
- 1998-01-20 DE DE69825561T patent/DE69825561T3/de not_active Expired - Lifetime
- 1998-01-20 KR KR1019997006593A patent/KR100569617B1/ko not_active Expired - Fee Related
- 1998-01-21 TW TW087100801A patent/TW503246B/zh not_active IP Right Cessation
- 1998-01-21 MY MYPI98000244A patent/MY128727A/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5314720A (en) * | 1990-05-21 | 1994-05-24 | The Dow Chemical Company | Cure inhibited epoxy resin compositions and laminates prepared from the compositions |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1249772A (zh) | 2000-04-05 |
| EP0954553B1 (en) | 2004-08-11 |
| DE69825561D1 (de) | 2004-09-16 |
| DE69825561T3 (de) | 2009-07-09 |
| JP4080546B2 (ja) | 2008-04-23 |
| EP0954553B2 (en) | 2008-12-10 |
| TW503246B (en) | 2002-09-21 |
| HK1023586A1 (en) | 2000-09-15 |
| CN1129648C (zh) | 2003-12-03 |
| WO1998031750A1 (en) | 1998-07-23 |
| JP2001508828A (ja) | 2001-07-03 |
| EP0954553A1 (en) | 1999-11-10 |
| DE69825561T2 (de) | 2005-08-11 |
| KR20000070360A (ko) | 2000-11-25 |
| MY128727A (en) | 2007-02-28 |
| ATE273348T1 (de) | 2004-08-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100569617B1 (ko) | 에폭시 수지 조성물 | |
| US6613839B1 (en) | Polyepoxide, catalyst/cure inhibitor complex and anhydride | |
| JP3383658B2 (ja) | 積層品を製造するための方法 | |
| JP4643272B2 (ja) | エポキシ樹脂用硬化剤組成物 | |
| CN101341181B (zh) | 可固化环氧树脂组合物及由其制造的层压材料 | |
| JP2013166959A (ja) | 混合触媒系を含む硬化性エポキシ樹脂組成物およびそれから作られた積層体 | |
| EP0729484B1 (en) | Cure inhibited epoxy resin compositions and laminates prepared from the compositions | |
| CN103819655B (zh) | 用于制备环氧树脂的低聚卤化增链剂 | |
| HK1023586B (en) | Latent catalysts for epoxy curing systems | |
| HK1078099B (en) | Hardener composition for epoxy resins |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| N231 | Notification of change of applicant | ||
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20130320 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20140319 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R14-asn-PN2301 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20170405 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20170405 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |