TW494507B - Semiconductor device and its assembling method - Google Patents

Semiconductor device and its assembling method Download PDF

Info

Publication number
TW494507B
TW494507B TW086104250A TW86104250A TW494507B TW 494507 B TW494507 B TW 494507B TW 086104250 A TW086104250 A TW 086104250A TW 86104250 A TW86104250 A TW 86104250A TW 494507 B TW494507 B TW 494507B
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
adhesive
wire
lead
semiconductor
Prior art date
Application number
TW086104250A
Other languages
English (en)
Chinese (zh)
Inventor
Shinji Ohuchi
Etsuo Yamada
Yasushi Shiraishi
Original Assignee
Oki Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Ind Co Ltd filed Critical Oki Electric Ind Co Ltd
Application granted granted Critical
Publication of TW494507B publication Critical patent/TW494507B/zh

Links

Classifications

    • H10W74/01—
    • H10W70/415—
    • H10W72/0113—
    • H10W72/07352—
    • H10W72/321—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/865—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
TW086104250A 1996-04-10 1997-04-02 Semiconductor device and its assembling method TW494507B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8086968A JPH09283545A (ja) 1996-04-10 1996-04-10 樹脂封止型半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
TW494507B true TW494507B (en) 2002-07-11

Family

ID=13901682

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086104250A TW494507B (en) 1996-04-10 1997-04-02 Semiconductor device and its assembling method

Country Status (7)

Country Link
US (1) US6097083A (enExample)
EP (1) EP0801424B1 (enExample)
JP (1) JPH09283545A (enExample)
KR (1) KR100366110B1 (enExample)
CN (1) CN1091950C (enExample)
DE (1) DE69735032T2 (enExample)
TW (1) TW494507B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5969410A (en) * 1996-05-09 1999-10-19 Oki Electric Industry Co., Ltd. Semiconductor IC device having chip support element and electrodes on the same surface
JP2001320007A (ja) * 2000-05-09 2001-11-16 Dainippon Printing Co Ltd 樹脂封止型半導体装置用フレーム
JP2005277415A (ja) * 2004-03-23 2005-10-06 Samsung Electronics Co Ltd リードチップ直接付着型半導体パッケージ、その製造方法及び装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06105721B2 (ja) * 1985-03-25 1994-12-21 日立超エル・エス・アイエンジニアリング株式会社 半導体装置
US4974057A (en) * 1986-10-31 1990-11-27 Texas Instruments Incorporated Semiconductor device package with circuit board and resin
JPS6437132U (enExample) * 1987-08-31 1989-03-06
JPH02125454A (ja) * 1988-11-02 1990-05-14 Nec Corp 樹脂封止型半導体装置
US5403785A (en) * 1991-03-03 1995-04-04 Matsushita Electric Works, Ltd. Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby
SG44840A1 (en) * 1992-09-09 1997-12-19 Texas Instruments Inc Reduced capacitance lead frame for lead on chip package
JP3137518B2 (ja) * 1993-10-29 2001-02-26 株式会社巴川製紙所 電子部品用液状接着剤およびそれを用いる絶縁接着層の形成方法
TW270213B (enExample) * 1993-12-08 1996-02-11 Matsushita Electric Industrial Co Ltd
US5545921A (en) * 1994-11-04 1996-08-13 International Business Machines, Corporation Personalized area leadframe coining or half etching for reduced mechanical stress at device edge
JP3127195B2 (ja) * 1994-12-06 2001-01-22 シャープ株式会社 発光デバイスおよびその製造方法
TW314650B (enExample) * 1995-06-21 1997-09-01 Oki Electric Ind Co Ltd

Also Published As

Publication number Publication date
US6097083A (en) 2000-08-01
JPH09283545A (ja) 1997-10-31
KR970072220A (ko) 1997-11-07
EP0801424B1 (en) 2006-01-04
DE69735032D1 (de) 2006-03-30
CN1165400A (zh) 1997-11-19
DE69735032T2 (de) 2006-08-31
EP0801424A3 (enExample) 1997-10-22
CN1091950C (zh) 2002-10-02
KR100366110B1 (ko) 2003-02-19
EP0801424A2 (en) 1997-10-15

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees